According to the invention, an LED fixture is provided for photographic and theatrical lighting. The light fixture is particularly suitable for photographic and theatrical lighting by mounting LED elements directly or indirectly on articulating arms. The arms rotate 90 degrees from a position where the arms are aligned substantially in parallel with an axis of the fixture hub and may be rotated 90 degrees for deployment of the fixture. In addition, the spokes may be flexed beyond the alignment permitted by the cooperation between the hub and mounting elements.

In an embodiment of the present invention, a production light is provided to be attached to the bottom of a camera, via a threaded aperture, typically used to mount a camera to a tripod. The production light is configured to emit light about a 360-degree angle via a light emitting diode (LED) array.

The lens attachment includes a body that overlays a lens of an image capture device and one or more lights integrated with the body that emits light in a direction so that the light is not directed into the lens of the image capture device. The lens attachment includes a connector integrated with the body that secures the lens attachment against a housing of the image capture device.

A camera attachment apparatus for attaching to a mobile computing device having an integrated camera includes a house, a slide plate, an aperture, and an illumination system. The housing has a shape to mount on the mobile computing device. The slide plate is disposed within the housing and has a stowed position and a deployed position. The aperture is disposed in the slide plate. The illumination system is disposed on the slide plate. The slide plate is configured to align the aperture over the integrated camera when moved to the deployed position and does not obstruct the integrated camera in the stowed position.

A protective covering configured for use with a mobile electronics device, including a front wall and a plurality of side walls defining a primary cavity. A back wall is disposed within the primary cavity separating the primary cavity into a protective covering electronics housing cavity and a mobile electronic device housing cavity. One or more apertures are disposed within the front wall. A light source is disposed within the protective covering electronics housing cavity, wherein at least a portion of the light source is disposed outside of the protective covering electronics housing cavity and through at least one of the one or more apertures in the front wall. A heat sink is disposed within the protective covering electronics housing cavity and in contact with the light source.

A protective covering configured for use with a mobile electronics device, including a front wall and a plurality of side walls defining a primary cavity. A back wall is disposed within the primary cavity separating the primary cavity into a protective covering electronics housing cavity and a mobile electronic device housing cavity. One or more apertures are disposed within the front wall. A light source is disposed within the protective covering electronics housing cavity, wherein at least a portion of the light source is disposed outside of the protective covering electronics housing cavity and through at least one of the one or more apertures in the front wall. A heat sink is disposed within the protective covering electronics housing cavity and in contact with the light source.

An apparatus for a mobile light source is described. The apparatus comprising: a first outer casing housing an array of lights, wherein the array of lights are located on a surface of a substrate, a second outer casing coupled with the first outer casing to create an enclosure that is substantially water tight, a heat shield composed of a metal alloy creating two compartments in the enclosure such that the array of lights is situated in a first compartment, and a printed circuit board (PCB) with circuitry for controlling the array of lights, the PCB situated in the second compartment of the enclosure housed by the second outer casing, and wherein a surface the PCB is substantially parallel to the surface of the substrate.