A compound represented by the following formula (1) and a method for producing the same, and a composition, a composition for optical component formation, a film forming composition for lithography, a resist composition, a method for forming a resist pattern, a radiation-sensitive composition, a method for producing an amorphous film, an underlayer film forming material for lithography, a composition for underlayer film formation for lithography, a method for producing an underlayer film for lithography, a resist pattern formation method, a circuit pattern formation method, and a purification method. ##STR00001## wherein R.sup.1 is a 2n-valent group of 1 to 60 carbon atoms or a single bond; R.sup.2 to R.sup.5 are each independently a linear, branched, or cyclic alkyl group of 1 to 30 carbon atoms, an aryl group of 6 to 30 carbon atoms, an alkenyl group of 2 to 30 carbon atoms, a group represented by the following formula (A), a group represented by the following formula (B), a thiol group, or a hydroxy group, wherein at least one selected from the group consisting of R.sup.2 to R.sup.5 is a group selected from the group consisting of a group represented by the following formula (A) and a group represented by the following formula (B); m.sup.2 and m.sup.3 are each independently an integer of 0 to 8; m.sup.4 and m.sup.5 are each independently an integer of 0 to 9, provided that m.sup.2, m.sup.3, m.sup.4, and m.sup.5 are not 0 at the same time; n is an integer of 1 to 4; and p.sup.2 to p.sup.5 are each independently an integer of 0 to 2: ##STR00002## wherein each R.sup.6 is independently an alkylene group of 1 to 4 carbon atoms; and m′ is an integer of 1 or larger, and ##STR00003## wherein R.sup.6 is as defined above; R.sup.7 is a hydrogen atom or a methyl group; and m″ is 0 or an integer of 1 or larger.

Described is a recording element which is suitable for the production of high-resolution flexographic printing plates by means of digital information transmission that can be imaged with actinic laser radiation and comprises or consists of the following layers: (A) a carrier film, (B) a photopolymerizable layer/relief forming polymer layer which is cross-linkable by actinic radiation, (C) an actinic radiation transparent intermediate layer composite, comprising at least two polymer comprising composite layers lying on top of each other, a first composite layer (C1) acting as blocking layer or barrier layer and a second composite layer (C2) acting as adhesion modulator against the relief forming polymer layer, (D) a recordable template layer comprising a monomeric diazonium compound, and (E1) optionally a peelable protective film or cover film on the recordable template layer (D).

Described is a recording element which is suitable for the production of high-resolution flexographic printing plates by means of digital information transmission that can be imaged with actinic laser radiation and comprises or consists of the following layers: (A) a carrier film, (B) a photopolymerizable layer/relief forming polymer layer which is cross-linkable by actinic radiation, (C) an actinic radiation transparent intermediate layer composite, comprising at least two polymer comprising composite layers lying on top of each other, a first composite layer (C1) acting as blocking layer or barrier layer and a second composite layer (C2) acting as adhesion modulator against the relief forming polymer layer, (D) a recordable template layer comprising a monomeric diazonium compound, and (E1) optionally a peelable protective film or cover film on the recordable template layer (D).

Disclosed herein are a black photosensitive resin composition and a black column spacer prepared therefrom. The black photosensitive resin composition may form a cured film exhibiting good adhesion to a substrate, good height difference property, good surface roughness and high light shielding property (optical density), and may be effectively used for the formation of a cured film, particularly a black column spacer, of a liquid crystal display (LCD) or an organic light-emitting diode (OLED) display.

The present disclosure relates to novel negative-type photoresist composition and methods of their use. The disclosure further relates to multiple trigger photoresist processes which allow for the improvement in contrast, resolution, and/or line edges roughness in some systems without giving up sensitivity. The photoresist compositions and the methods of the current disclosure are ideal for fine patent processing using, for example, ultraviolet radiation, extreme ultraviolet radiation, beyond extreme ultraviolet radiation, X-rays and changed particle. The disclosure further relates to sensitivity enhancing materials useful in the disclosed compositions and methods.

Diazo-resin-containing photoresist compositions and methods of preparing the same are provided for solving the problem that existing diazo-resins cannot be applied in LCD photoresists because the storage periods of the diazo-resins themselves and the printed boards made thereby are both short due to poor thermal stability of the diazo-resins. The diazo-resins of the present invention have excellent thermal stability and exhibit strong resistance to dry etching when being used in negative photoresists, while high resolution can be achieved. Meanwhile, during exposure, portions of the diazo-resins can crosslink with hydrogen bonds on surface of SiO or SiON film forming a barrier layer or passivation layer, such that the adhesion between the photoresists and the film layer is increased, and the photoresists would not peel during development. Thus, the utilization of tackifiers for enhancing the adhesion between a photoresist and surface of SiO or SiON film before masking can be omitted.

Diazo-resin-containing photoresist compositions and methods of preparing the same are provided for solving the problem that existing diazo-resins cannot be applied in LCD photoresists because the storage periods of the diazo-resins themselves and the printed boards made thereby are both short due to poor thermal stability of the diazo-resins. The diazo-resins of the present invention have excellent thermal stability and exhibit strong resistance to dry etching when being used in negative photoresists, while high resolution can be achieved. Meanwhile, during exposure, portions of the diazo-resins can crosslink with hydrogen bonds on surface of SiO or SiON film forming a barrier layer or passivation layer, such that the adhesion between the photoresists and the film layer is increased, and the photoresists would not peel during development. Thus, the utilization of tackifiers for enhancing the adhesion between a photoresist and surface of SiO or SiON film before masking can be omitted.

Disclosed herein are a black photosensitive resin composition and a black column spacer prepared therefrom. The black photosensitive resin composition may form a cured film exhibiting good adhesion to a substrate, good height difference property, good surface roughness and high light shielding property (optical density), and may be effectively used for the formation of a cured film, particularly a black column spacer, of a liquid crystal display (LCD) or an organic light-emitting diode (OLED) display.

A compound represented by the following formula (1) and a method for producing the same, and a composition, a composition for optical component formation, a film forming composition for lithography, a resist composition, a method for forming a resist pattern, a radiation-sensitive composition, a method for producing an amorphous film, an underlayer film forming material for lithography, a composition for underlayer film formation for lithography, a method for producing an underlayer film for lithography, a resist pattern formation method, a circuit pattern formation method, and a purification method.

##STR00001## wherein R.sup.1 is a 2n-valent group of 1 to 60 carbon atoms or a single bond; R.sup.2 to R.sup.5 are each independently a linear, branched, or cyclic alkyl group of 1 to 30 carbon atoms, an aryl group of 6 to 30 carbon atoms, an alkenyl group of 2 to 30 carbon atoms, a group represented by the following formula (A), a group represented by the following formula (B), a thiol group, or a hydroxy group, wherein at least one selected from the group consisting of R.sup.2 to R.sup.5 is a group selected from the group consisting of a group represented by the following formula (A) and a group represented by the following formula (B); m.sup.2 and m.sup.3 are each independently an integer of 0 to 8; m.sup.4 and m.sup.5 are each independently an integer of 0 to 9, provided that m.sup.2, m.sup.3, m.sup.4, and m.sup.5 are not 0 at the same time; n is an integer of 1 to 4; and p.sup.2 to p.sup.5 are each independently an integer of 0 to 2:

##STR00002## wherein each R.sup.6 is independently an alkylene group of 1 to 4 carbon atoms; and m is an integer of 1 or larger, and

##STR00003## wherein R.sup.6 is as defined above; R.sup.7 is a hydrogen atom or a methyl group; and m is 0 or an integer of 1 or larger.

Provided are a photosensitive resin composition using a polyimide precursor composition, a cured film, a method for producing a cured film, a semiconductor device, and a method for producing a polyimide precursor composition.

A polyimide precursor composition in which the molar ratio of repeating units represented by General Formula (1-2) among structural isomers of the polyimide precursor is 60% to 90% by mole; in General Formula (1-2), A.sup.1 and A.sup.2 each independently represent an oxygen atom or NH, R.sup.111 and R.sup.112 each independently represent a single bond or a divalent organic group, and R.sup.113 and R.sup.114 each independently represent a hydrogen atom or a monovalent organic group.

##STR00001##