The present invention provides a method for manufacturing a substrate equipped with a wiring electrode which has a fine pattern and is excellent in conductivity and in which an opaque wiring electrode is hardly visible. Disclosed is a method for manufacturing a substrate equipped with a wiring electrode including the steps of forming an opaque wiring electrode on at least one side of a transparent substrate, applying a positive photosensitive composition on one side of the transparent substrate, and exposing and developing the positive photosensitive composition using the opaque wiring electrode as a mask to form a functional layer at a portion corresponding to the opaque wiring electrode.

The present invention reduces inhibition of light sensitization of a photosensitive resin composition containing a black dye and increases sensitivity by improving pattern forming ability. The photosensitive resin composition according to one embodiment of the present invention contains a binder resin (A), a radiation-sensitive compound (B), and a dye (C), wherein the dye (C) contains a black dye (C1) and a dye (C2) other than (C1), the dye (C2) has an absorption maximum at a wavelength of 480-550 nm in an wavelength range of 300-800 nm, and, when the absorbance of the dye (C2) at the absorption maximum wavelength is defined as Abs1 and the average absorbance of the dye (C2) at wavelengths 560-600 nm is defined as Abs2, Abs2/Abs1 equals 0.1-1.0.

A photoresist composition, an organic light-emitting diode array substrate and their manufacturing methods are provided. The photoresist composition includes: an alkali soluble resin, a photosensitive monomer, a thermochromic pigment and a solvent whose mass percentages are 10-30 wt %, 1-12 wt %, 5-20 wt %, and 40-65 wt %, respectively; and the thermochromic pigment has a darkened color upon being heated.

[Object] To provide a positive type photosensitive composition capable of forming a cured film having high transparency [Means] The present invention provides a positive type photosensitive siloxane composition comprising: a polysiloxane, a diazonaphthoquinone derivative, an additive having a quaternary ammonium structure and the capability of interacting with the polysiloxane, and a solvent. The polysiloxane and the additive interact with each other before exposure, but they lose the interaction after exposure.

A highly-sensitive photosensitive resin composition contains a coloring agent, and can inhibit a coating from coming off in a development step. The photosensitive resin composition according to an embodiment of the present invention contains a binder resin (A), a compound (B) having a triazine ring and represented by formula (1), a radiation-sensitive compound (C), and a coloring agent (D) selected from the group consisting of black dyes and black pigments. In formula (1), R.sup.1, R.sup.2, and R.sup.3 each independently represent a hydroxy group, an alkyl group having 1-5 carbon atoms, an alkenyl group having 2-6 carbon atoms, an alkenyl ether group having 2-6 carbon atoms, an optionally substituted amino group, a halogenated alkyl group, a sulfide group, a mercapto group, a phenyl group, a phenyl ether group, a halogeno group, a naphthyl group, a pyridyl group, a biphenyl group, a morpholino group, a fluorene group, or a carbazole group.

A highly-sensitive photosensitive resin composition contains a coloring agent, and can inhibit a coating from coming off in a development step. The photosensitive resin composition according to an embodiment of the present invention contains a binder resin (A), a compound (B) having a triazine ring and represented by formula (1), a radiation-sensitive compound (C), and a coloring agent (D) selected from the group consisting of black dyes and black pigments. In formula (1), R.sup.1, R.sup.2, and R.sup.3 each independently represent a hydroxy group, an alkyl group having 1-5 carbon atoms, an alkenyl group having 2-6 carbon atoms, an alkenyl ether group having 2-6 carbon atoms, an optionally substituted amino group, a halogenated alkyl group, a sulfide group, a mercapto group, a phenyl group, a phenyl ether group, a halogeno group, a naphthyl group, a pyridyl group, a biphenyl group, a morpholino group, a fluorene group, or a carbazole group.

Provided are a curable composition including a pigment, a resin, a polymerizable compound, a photopolymerization initiator, and a solvent; a film formed of the curable composition; a structural body; a color filter; a solid-state imaging element; and an image display device. The resin includes a resin A which includes a repeating unit having a graft chain of a poly(meth)acrylate structure and a repeating unit having an acid group, and the graft chain of a poly(meth)acrylate structure includes a repeating unit represented by the following formula. R.sup.1 represents a hydrogen atom or a methyl group, and R.sup.2 represents a hydrocarbon group having 1 to 20 carbon atoms. However, R.sup.1 is a hydrogen atom in a case where R.sup.2 is a methyl group, and R.sup.2 is a hydrocarbon group having 2 or more carbon atoms in a case where R.sup.1 is a methyl group.

##STR00001##

The present invention relates to a photosensitive resin composition that is excellent in adhesiveness and sensitivity. Specifically, the photosensitive resin composition is capable of providing a cured film that is excellent in transparency, sensitivity, chemical resistance, and adhesiveness upon immersion in a stripper. Thus, the cured film can be effectively used in a liquid crystal display, an organic EL display, and the like.

The present invention employs a compound represented by the following formula (0): ##STR00001## wherein R.sup.Y is a linear, branched, or cyclic alkyl group of 1 to 30 carbon atoms or an aryl group of 6 to 30 carbon atoms; R.sup.Z is an N-valent group of 1 to 60 carbon atoms or a single bond; each R.sup.T is independently an alkyl group of 1 to 30 carbon atoms optionally having a substituent, an aryl group of 6 to 40 carbon atoms optionally having a substituent, an alkenyl group of 2 to 30 carbon atoms optionally having a substituent, an alkoxy group of 1 to 30 carbon atoms optionally having a substituent, a halogen atom, a nitro group, an amino group, a cyano group, a thiol group, a hydroxy group, or a group in which a hydrogen atom of a hydroxy group is replaced with an acid dissociation group, wherein the alkyl group, the alkenyl group, and the aryl group each optionally contain an ether bond, a ketone bond, or an ester bond, wherein at least one R.sup.T is a hydroxy group or a group in which a hydrogen atom of a hydroxy group is replaced with an acid dissociation group; X is an oxygen atom, a sulfur atom, or not a crosslink; each m is independently an integer of 0 to 9, wherein at least one m is an integer of 1 to 9; N is an integer of 1 to 4, wherein when N is an integer of 2 or larger, N structural formulas within the parentheses [ ] are the same or different; and each r is independently an integer of 0 to 2.

The present invention employs a compound represented by the following formula (0): ##STR00001## wherein R.sup.Y is a linear, branched, or cyclic alkyl group of 1 to 30 carbon atoms or an aryl group of 6 to 30 carbon atoms; R.sup.Z is an N-valent group of 1 to 60 carbon atoms or a single bond; each R.sup.T is independently an alkyl group of 1 to 30 carbon atoms optionally having a substituent, an aryl group of 6 to 40 carbon atoms optionally having a substituent, an alkenyl group of 2 to 30 carbon atoms optionally having a substituent, an alkoxy group of 1 to 30 carbon atoms optionally having a substituent, a halogen atom, a nitro group, an amino group, a cyano group, a thiol group, a hydroxy group, or a group in which a hydrogen atom of a hydroxy group is replaced with an acid dissociation group, wherein the alkyl group, the alkenyl group, and the aryl group each optionally contain an ether bond, a ketone bond, or an ester bond, wherein at least one R.sup.T is a hydroxy group or a group in which a hydrogen atom of a hydroxy group is replaced with an acid dissociation group; X is an oxygen atom, a sulfur atom, or not a crosslink; each m is independently an integer of 0 to 9, wherein at least one m is an integer of 1 to 9; N is an integer of 1 to 4, wherein when N is an integer of 2 or larger, N structural formulas within the parentheses [ ] are the same or different; and each r is independently an integer of 0 to 2.