A chemically amplified positive-type photosensitive resin composition capable of suppressing the occurrence of footing in which the width of the bottom (the side proximate to the surface of a support) becomes narrower than that of the top (the side proximate to the surface of a resist layer) in a nonresist section and the occurrence of development residue, when a resist pattern serving as a template for a plated article is formed on a metal surface of a substrate using the composition; a method for manufacturing a substrate with a template using the composition; and a method for manufacturing a plated article using the substrate with the template. A mercapto compound having a specific structure is contained in the composition including an acid generator that generates an acid when irradiated with an active ray or radiation and a resin whose solubility in alkali increases under the action of acid.

A method of manufacturing a patterned film includes forming a first film including a semiconductor nanoparticle and an additive, wherein the additive includes a polythiol compound, the semiconductor nanoparticle includes an organic ligand (for example, on a surface thereof), and the organic ligand includes a first functional group bonded to the surface of the semiconductor nanoparticle and a carbon-carbon unsaturated bond; exposing a portion of the first film to a radiation to cause a change in a solubility of the semiconductor nanoparticle in the exposed area with respect to a first solvent; contacting the radiation treated film with the first solvent to remove at least a portion of an unexposed area of the radiation treated film to obtain a patterned film. A light emitting device includes such a patterned film as a light emitting layer.

A method of forming a bioactive pattern on a substrate can include contacting a substrate comprising a prepolymer ink coated thereon with abeam pen lithography pen array. The prepolymer ink can include a photoinitiator, an acrylate, and a thiol-modified or acrylate-modified functional binding molecule. The method can further include irradiating the beam pen lithography pen array to transmit the radiation through the pens and out the exposed tip to controllably irradiate the prepolymer ink to initiate selectively photopolymerization of the prepolymer ink and form a pattern of thiol-functionalized cross-linked polymer printed indicia on the substrate; and exposing the pattern of the thiol-functionalized cross-linked polymer printed indicia in a biomolecule containing solution under conditions sufficient to bind the biomolecule to the thiol-functionalized cross-linked polymer printed indicia to form the bioactive pattern.

A photocurable composition for forming coating film having flattening properties on a substrate, with high fillability into patterns and capability of forming a coating film that is free from thermal shrinkage, which contains at least one compound that contains a photodegradable nitrogen-containing and/or photodegradable sulfur-containing structure, a hydrocarbon structure, and a solvent. The compound may have the photodegradable nitrogen-containing and/or photodegradable sulfur-containing structure and the hydrocarbon structure in one molecule, or may be a combination of compounds which contain the structures in separate molecules.

Compounds and compositions are provided which are useful in additive printing, particularly additive printing techniques such as stereolithography (SLA), wherein a composition of one or more photocurable compounds, such as a compound with multiple ethylenically unsaturated groups and a compound with multiple thiol groups, is photopolymerized, optionally the polymerizable composition comprises two or more thermocurable compounds which are reactive with one another, and optionally the polymerizable composition comprises one or more chain transfer agents, and optionally, are subjected to thermopolymerization, to form a manufactured article in solid form.

An object with a coating comprising: a) covalent bonds formed by reaction of a thiol group and a carbon-carbon double bond, b) covalent bonds formed by reaction of a thiol group and epoxide group, c) covalent bonds formed by a reaction of a carbon-carbon double bond and an epoxide group, said coating comprising a first primer coating and a second coating, said coating comprising covalent bonds between said first and second coatings, said first primer coating comprising covalent cross links between compounds, in the first coating the fraction (r3=ta/tc) of unreacted thiol groups (ta) to thiol groups which have reacted to form a covalent bond (tc) does not exceed 0.11, wherein the half height peak width of tan delta does not exceed 30? C. Advantages of the dual cure composition is that excellent strength is obtained and that the second curing is slow compared to the first initial curing.

A resist underlayer film-forming composition has excellent embedding and flattening properties for stepped substrates, excellent storage stability, low film-curing start temperature and small amount of sublimate generation, and can form a film that does not dissolve in photoresist solvents. The composition contains: a thermal acid generator; a Novolac resin polymer in which (i) a unit structure having an aromatic ring optionally having a substituent and (ii) a unit structure containing an aromatic cyclic organic group optionally having a substituent, a non-aromatic monocyclic organic group optionally having a substituent, or a 4to 25-membered bicyclic, tricyclic, or tetracyclic organic group containing at least one non-aromatic monocyclic ring and optionally having a substituent are bonded via a covalent bond between carbon atoms on the aromatic ring of (i) and the non-aromatic monocyclic ring of (ii); and a solvent.

The present disclosure relates to thiol-acrylate photopolymerizable resin compositions. The resin compositions may be used for additive manufacturing. One embodiment of the invention includes a photopolymerizable resin for additive manufacturing in an oxygen environment, the resin comprising: a crosslinking component; at least one monomer and/or oligomer; and a chain transfer agent comprising at least one of a thiol, a secondary alcohol, and/or a tertiary amine, wherein the resin may be configured to react by exposure to light to form a cured material.

A semiconductor device can be prepared using a precursor dielectric composition that comprises: (1) a photochemically or thermally crosslinked product of a photocurable or thermally curable thiosulfate-containing polymer that has a T.sub.g of at least 50 C. and that comprises: an organic polymer backbone comprising (a) recurring units comprising pendant thiosulfate groups; and further comprises charge balancing cations, and (2) optionally, an electron-accepting photo sensitizer component. The electronic device can be prepared by independently applying the precursor dielectric composition and an organic semiconductor composition to a substrate to form an applied precursor dielectric composition and an applied organic semiconductor composition, respectively, and subjecting the applied precursor dielectric composition to curing conditions to form a gate dielectric layer that is in physical contact with the applied organic semiconductor composition.

A semiconductor device can be prepared with a gate dielectric layer that comprises: (1) a photochemically or thermally crosslinked product of a photocurable or thermally curable thiosulfate-containing polymer that has a T.sub.g of at least 50 C. and that comprises: an organic polymer backbone comprising (a) recurring units comprising pendant thiosulfate groups; and further comprises charge balancing cations, and (2) optionally, an electron-accepting photosensitizer component.