To provide a negative photosensitive resin composition which may be sufficiently cured even at a low exposure amount and which can impart good ink repellency to the upper surface of partition walls, a cured resin film and partition walls which have good ink repellency on the upper surface, and an optical element which has dots formed with good precision, having opening sections partitioned by partition walls uniformly coated with an ink. A negative photosensitive resin composition comprising an alkali-soluble resin or alkali-soluble monomer (A) having an ethylenic double bond, a photopolymerization initiator (B), a thiol compound (C) having at least 3 mercapto groups in one molecule, and an ink repellent agent (D), a cured resin film and partition walls formed by using the negative photosensitive resin composition, and an optical element having the partition walls located between a plurality of dots and their adjacent dots on a substrate surface.

To provide a negative photosensitive resin composition which may be sufficiently cured even at a low exposure amount and which can impart good ink repellency to the upper surface of partition walls, a cured resin film and partition walls which have good ink repellency on the upper surface, and an optical element which has dots formed with good precision, having opening sections partitioned by partition walls uniformly coated with an ink. A negative photosensitive resin composition comprising an alkali-soluble resin or alkali-soluble monomer (A) having an ethylenic double bond, a photopolymerization initiator (B), a thiol compound (C) having at least 3 mercapto groups in one molecule, and an ink repellent agent (D), a cured resin film and partition walls formed by using the negative photosensitive resin composition, and an optical element having the partition walls located between a plurality of dots and their adjacent dots on a substrate surface.

A patterning method includes providing a photosensitive composition on a material layer. The photosensitive composition includes one part by weight of a photo sensitive compound, 1.5 to 8 parts by weight of a resin, and 10 to 40 parts by weight of a diluent. The photosensitive compound has a chemical structure of ##STR00001##
The patterning method further includes removing the diluent in the photosensitive composition to form a photoresist layer, exposing the photoresist layer, and removing an exposed part of the photoresist layer to expose a part of the material layer.

A patterning method includes providing a photosensitive composition on a material layer. The photosensitive composition includes one part by weight of a photo sensitive compound, 1.5 to 8 parts by weight of a resin, and 10 to 40 parts by weight of a diluent. The photosensitive compound has a chemical structure of ##STR00001##
The patterning method further includes removing the diluent in the photosensitive composition to form a photoresist layer, exposing the photoresist layer, and removing an exposed part of the photoresist layer to expose a part of the material layer.

A liquid solder resist composition contains: a carboxyl group-containing resin; a photopolymerizable compound which contains one or more kinds of compounds selected from a group consisting of a photopolymerizable monomer and a photopolymerizable prepolymer; a photopolymerization initiator; an epoxy compound; and titanium dioxide. The carboxyl group-containing resin is obtained by polymerization of a monomer composition which contains: a carboxyl group-containing monomer represented by following formula (1); and a maleimide compound represented by following formula (2). The carboxyl group-containing resin does not contain a photopolymerizable functional group. In the formula (1), X represents R.sup.a—COO.

##STR00001##

A liquid solder resist composition contains: a carboxyl group-containing resin; a photopolymerizable compound which contains one or more kinds of compounds selected from a group consisting of a photopolymerizable monomer and a photopolymerizable prepolymer; a photopolymerization initiator; an epoxy compound; and titanium dioxide. The carboxyl group-containing resin is obtained by polymerization of a monomer composition which contains: a carboxyl group-containing monomer represented by following formula (1); and a maleimide compound represented by following formula (2). The carboxyl group-containing resin does not contain a photopolymerizable functional group. In the formula (1), X represents R.sup.a—COO.

##STR00001##

The present invention relates to radiation or dual radiation/moisture curable compositions based on (meth)acrylate- and silane-terminated polyorganosiloxanes that can be used as 3D printing materials and provide isotropic and elastomeric properties. The invention further relates to the use thereof as 3D printing materials and printing methods using said compositions.

Provided are a resin composition including a coloring material, a resin, and a solvent, in which, in a case where a film having a thickness of 0.60 μm is formed by heating the resin composition at 200° C. for 30 minutes, a thickness of the film after performing a heating treatment of the film at 300° C. for 5 hours in a nitrogen atmosphere is 70% or more of a thickness of the film before the heating treatment; a film formed of the resin composition; a color filter; a solid-state imaging element; and an image display device.

The present invention is a substrate for a display, the substrate having a film B including a polysiloxane resin on at least one surface of a film A including a polyimide resin, wherein the film B contains inorganic oxide particles therein, and the present invention has an object to provide a substrate for a display: being able to be applied to a color filter, an organic EL element, or the like without the need to carry out any complex operations; allowing high-definition displays to be manufactured; and being provided with a low CTE, a low birefringence, and flexibility.

To provide a photosensitive resin composition which is capable of forming a pattern with high resolution and obtaining a cured film having excellent heat resistance and cracking resistance, and is also alkali developable; and a method capable of shortening the step required to remove a cured film of the composition after formation of an impurity region on a semiconductor substrate; and a method for manufacturing a semiconductor device using the same. Disclosed is a photosensitive resin composition including a polysiloxane (A), wherein the polysiloxane (A) is a polysiloxane represented by the general formula (1), and wherein (X) and (Y) are represented by the general formulas (4) to (6).

7.5≦(X)≦75  (4)

2.5≦(Y)≦40  (5)

1.5×(Y)≦(X)≦3×(Y)  (6)

##STR00001##