There is provided a highly sensitive colorant-containing photosensitive resin composition for use in the formation of organic EL element barrier ribs. In one embodiment, the photosensitive resin composition for an organic EL element barrier rib comprises: (A) a binder resin; (B) at least one low molecular weight organic compound having a molar volume of 130 cm.sup.3/mol or less and being selected from the group consisting of aromatic carboxylic acids and compounds each having a plurality of phenolic hydroxyl groups; (C) a radiation sensitive compound; and (D) a colorant selected from the group consisting of black dyes and black pigments.

A photosensitive epoxy resin composition for formation of an optical waveguide is provided, which contains an epoxy resin component, and a photo-cationic polymerization initiator, wherein the epoxy resin component includes a solid semi-aliphatic bifunctional epoxy resin. The optical waveguide formation photosensitive epoxy resin composition is usable as an optical waveguide forming material having higher R-to-R (roll-to-roll) adaptability (lower tackiness and uncured-state flexibility), a lower refractive index, excellent patternability, and excellent laser processability mirror forming processability).

A structured composite surface includes a backing layer and a plurality of composite posts in contact with the backing layer, each composite post having a core made of a first material and an outer shell made of a second material, the outer shell is in contact with and surrounding the core, the core has a Young's modulus of at least 50 times greater than the outer shell. A method of transfer printing includes pressing a stamp including at least one composite post to a substrate, the at least one composite post having a core made of a first material and an outer shell made of a second material, the outer shell is in contact with and surrounding the core, the core has a Young's modulus at least 50 times greater than the outer shell, and retracting the stamp from the substrate by applying a shear load to the stamp.

A low dielectric constant (Dk) and dissipation factor (Df) of solder resistant mask composition comprising (A) a photopolymerizable prepolymer of formula (1); (B) a photopolymerizable vinyl monomer; (C) an epoxy compound; (D) a photopolymerization initiator; (E) an inorganic filler; (F) a catalyst; and (G) an organic solvent. The low dielectric constant (Dk) and dissipation factor (Df) of solder resistant mask composition has excellent photo and thermocurability, and high developability resolution with an alkaline aqueous solution, wherein the dielectric constant is below 3.20 (1 GHz), and the dissipation factor is less than 0.015 (1 GHz); ##STR00001## ##STR00002##

A liquid solder resist composition contains a carboxyl group-containing resin, a photopolymerizable compound containing at least one compound selected from a group consisting of a photopolymerizable monomer and a photopolymerizable prepolymer, a photopolymerization initiator, and a titanium dioxide. The photopolymerization initiator contains a bisacylphosphine oxide-based photopolymerization initiator, a first -hydroxyalkyl phenone-based photopolymerization initiator that is a liquid at 25 C., and a second -hydroxyalkyl phenone-based photopolymerization initiator that is a solid at 25 C.

Provided are: a negative photosensitive composition which exhibits excellent sensitivity at the time of being cured and yields a cured article having excellent heat resistance; a cured article thereof; and a method of curing the same. The negative photosensitive composition contains: a sulfonic acid derivative compound (A) represented by Formula (I) below where X.sup.1 represents a linear or branched alkyl group having 1 to 14 carbon atoms or the like; R.sup.1 represents an aliphatic hydrocarbon group having 1 to 18 carbon atoms or the like; and the aliphatic hydrocarbon group having 1 to 18 carbon atoms or the like has no substituent or is optionally substituted with a halogen atom or a group selected from a halogenated alkyl group having 1 to 4 carbon atoms, an alkoxy group having 1 to 18 carbon atoms and an alkylthio group having 1 to 18 carbon atoms; a crosslinkable functional group-containing polymer compound (B); and a crosslinking agent (C):

##STR00001##

A negative photosensitive composition including a novolak-type polyfunctional aromatic epoxy resin (Ap), a trifunctional epoxy monomer (Am), and a sulfonium salt represented by Formula (I0). A mass ratio of (Am)/(Ap) is 5/5 to 8/2. In Formula (I0), R1 and R2 represent an aryl group, a heterocyclic hydrocarbon group, or an alkyl group. R3 to R5 are an alkyl group, a hydroxy group, an alkoxy group, an alkylcarbonyl group, an arylcarbonyl group, an acyloxy group, an arylthio group, an alkylthio group, an aryl group, a heterocyclic hydrocarbon group, an aryloxy group, a hydroxy(poly)alkyleneoxy group, or a halogen atom; k is an integer of 0 to 4, m is an integer of 0 to 3, and n is an integer of 1 to 4; L is S, O, SO, SO.sub.2, or CO and X.sup. represents a monovalent polyatomic anion

##STR00001##

The purpose of the present invention is to provide: a novel compound which can generate a base and radical upon the irradiation with an active energy ray; a photopolymerization initiator which comprises the novel compound; and a photosensitive resin composition which contains the photopolymerization initiator, has high sensitivity and excellent storage stability, and can be formed into a cured article that does not have a metal-corrosive property. The novel compound is represented by formula (1): ##STR00001## (wherein R.sub.1 to R.sub.6 independently represent a hydrogen atom, a hydroxy group, an alkoxy group, an organic group other than the aforementioned substituents, or the like; X represents a residue having a structure such that n hydrogen atoms are removed from a saturated hydrocarbon containing a ring structure; and n represents an integer of 1 to 6).

A hollow package (103) includes a substrate (109), an element (111), a partition wall (113), and a top plate (115) and has one or more closed hollow parts (117) that are covered by the substrate (109), the partition wall (113), and the top plate (115), and the substrate (109), the partition wall (113), and the top plate (115) are sealed with a cured product of a sealing resin composition. The top plate (115) and the partition wall (113) are composed of an organic material, and the thickness of the top plate (115), the thickness of the partition wall (113), the width of the partition wall, and the maximum width of the hollow part (117) are each within respective predetermined ranges. The sealing resin composition comprises (A) an epoxy resin that includes one or more selected from the group consisting of an epoxy resin containing two epoxy groups in the molecule and an epoxy resin containing three or more epoxy resins in the molecule and (B) an inorganic filler.

An object of the present invention is to provide a resin membrane filter having excellent separation accuracy and excellent toughness, and a manufacturing method of the resin membrane filter.

The resin membrane filter of the present invention includes a first main surface, a second main surface, and a plurality of through-holes, in which, in the through-hole, in a case where an average area of an opening portion at a position A which is located at a distance of 10% of a thickness of the resin membrane filter from the first main surface is denoted as Sva and an average area of an opening portion at a position B which is located at a distance of 90% of the thickness of the resin membrane filter from the first main surface is denoted as Svb, 0.8?Sva/Svb?1.25, a number ratio Ra of through-holes in which an area of the opening portion at the position A is more than 1.25 times Sva is 3.0% or less, and a number ratio Rb of through-holes in which an area of the opening portion at the position B is more than 1.25 times Svb is 3.0% or less.