G03F7/0385

PHOTOCURABLE COMPOSITION AND METHOD FOR FORMING PATTERN
20250122327 · 2025-04-17 ·

A photocurable composition including an acrylic resin, an epoxy group-containing compound excluding a component corresponding to the acrylic resin, and a cationic polymerization initiator. The acrylic resin has a glass transition point of 0 C. or lower and has a constitutional unit derived from an epoxy group-containing acrylic monomer. A content proportion of the constitutional unit in a total amount of all constitutional units constituting the acrylic resin is greater than 0% by mass and less than 50% by mass.

PHOTOSENSITIVE RESIN COMPOSITION, SOLDER RESIST COMPOSITION, AND COVERED-PRINTED WIRING BOARD
20170017152 · 2017-01-19 ·

This photosensitive resin composition includes: (A) a photopolymerizable compound including at least one of a photopolymerizable monomer and a photopolymerizable oligomer; (B) titanium dioxide; and (C) a photopolymerization initiator. The component (C) includes (C1) an acylphosphine oxide-containing photopolymerization initiator and (C2) a phenylglyoxylic acid-containing photopolymerization initiator.

Microcapsule imaging system including non-photopolymerizable reactive diluent
12321095 · 2025-06-03 · ·

Microcapsules including a polymeric shell and an internal phase including a non-photopolymerizable reactive diluent are provided for use in microcapsule imaging sheets. Imaging sheets including microcapsules which include a non-photopolymerizable reactive diluent, and which exhibit improvements in color development (Dmax), discoloration (yellowing) resistance, mechanical properties (e.g., peel strength), and temperature latitude of imaging sheets including leuco dyes.

Method for manufacturing microstructure including cured products of photosensitive resin compositions

A method for manufacturing a microstructure comprising cured products of photosensitive resin compositions, the method comprising: a step of forming at least two layers of the photosensitive resin compositions each comprising a photopolymerization initiator; a step of subjecting each of the formed at least two layers of the photosensitive resin compositions to patterning exposure; and a step of collectively developing the exposed at least two layers of the photosensitive resin compositions to obtain a microstructure, wherein in the at least two layers of the photosensitive resin compositions, 90% by mass or more of the photopolymerization initiators contained in at least one of the two adjacent layers of the photosensitive resin compositions is a nonionic photopolymerization initiator.

MICROCAPSULE IMAGING SYSTEM INCLUDING NON-PHOTOPOLYMERIZABLE REACTIVE DILUENT
20250271753 · 2025-08-28 · ·

Microcapsules including a polymeric shell and an internal phase including a non-photopolymerizable reactive diluent are provided for use in microcapsule imaging sheets. Imaging sheets including microcapsules which include a non-photopolymerizable reactive diluent, and which exhibit improvements in color development (Dmax), discoloration (yellowing) resistance, mechanical properties (e.g., peel strength), and temperature latitude of imaging sheets including leuco dyes.

Negative photosensitive resin composition, pattern formation method, and laminated film

A negative photosensitive resin composition containing an epoxy group-containing resin and a cationic polymerization initiator which includes a sulfonium salt represented by General Formula (I0). In Formula (I0), R1 and R2 represent an aryl group, a heterocyclic hydrocarbon group, or an alkyl group. R3 to R5 are an alkyl group, a hydroxy group, an alkoxy group, an alkylcarbonyl group, an arylcarbonyl group, an acyloxy group, an arylthio group, an alkylthio group, an aryl group, a heterocyclic hydrocarbon group, an aryloxy group, a hydroxy(poly)alkyleneoxy group, or a halogen atom. k is an integer of 0 to 4, m is an integer of 0 to 3, and n is an integer of 1 to 4. A is a group represented by S, O, SO, SO.sub.2, or CO X.sup. represents a monovalent polyatomic anion. ##STR00001##

Cured coating film

A matte-like cured coating film of a curable resin composition is provided on a substrate such as a wiring board, in which scratches are unnoticeable. The cured coating film satisfies Gs (20)5 and Gs (85)35 and has a ratio R represented by the formula R={Gs (85)/Gs (60}/{Gs (60)/Gs (20)} ranging from 0.35 to 4.0, where Gs (20), Gs (60), and Gs (85) are 20 gloss, 60 gloss, and 85 gloss on a surface of the cured coating film measured according to JIS Z 8741-1997, respectively.

METHOD OF MANUFACTURING LIQUID EJECTION HEAD, AND LIQUID EJECTION HEAD
20260116071 · 2026-04-30 ·

A method of manufacturing a liquid ejection head including, on a substrate, an ejection port formation member and a flow path formation member includes: forming and exposing a layer of a photosensitive resin composition (1) forming the flow path formation member on the substrate; laminating and exposing a layer of a photosensitive resin composition (2) forming the ejection port formation member on the layer of the photosensitive resin composition (1); and removing unexposed portions to form the flow path formation member and the ejection port formation member, the photosensitive resin composition (1) containing a specific epoxy resin and a specific gallate-based photoacid generator.