To provide a negative photosensitive resin composition which exhibits satisfactory resolution even when shifts occur in focus depth, and which has satisfactory adhesion to a mold resin and exhibits a low dielectric constant; a method for producing a polyimide using the photosensitive resin composition; a method for producing a cured relief pattern; and a semiconductor device including the cured relief pattern.

Disclosed is a negative photosensitive resin composition including a polyimide precursor having a structure represented by general formula (A1), (B) a photopolymerization initiator, and (C) a solvent.

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A method of manufacturing a semiconductor device includes forming a polymer mixture over a substrate, curing the polymer mixture to form a polymer material, and patterning the polymer material. The polymer mixture includes a polymer precursor, a photosensitizer, a cross-linker, and a solvent. The polymer precursor may be a polyamic acid ester. The cross-linker may be tetraethylene glycol dimethacrylate. The photosensitizer includes 4-phenyl-2-(piperazin-1-yl)thiazole. The mixture may further include an additive.

This compound, which absorbs long-wavelength active energy rays and generates with high-efficiency radicals and strong bases, and which has excellent reaction efficiency in a base generating chain reaction, is represented by formula (1), where, in formula (1), R.sub.1, R.sub.2, R.sub.3, R.sub.5 and R.sub.6 independently represent a hydroxy group, an alkoxy group, or an organic group other than those substituents, the R.sub.4's independently represent an organic group including a thioether bond, and ‘A’ represents a substituent represented by formula (1-1) or (1-2), where, in formula (1-1), R.sub.7 and R.sub.8 independently represent a hydrogen atom, an alkyl group or a heterocyclic group, and where, in formula (1-2), R.sub.9 and R.sub.10 independently represent an amino group or a substituted amino group. A photopolymerization initiator can include said compound; and a photosensitive resin composition can include said photopolymerization initiator. ##STR00001##

A highly-sensitive photosensitive resin composition contains a coloring agent, and can inhibit a coating from coming off in a development step. The photosensitive resin composition according to an embodiment of the present invention contains a binder resin (A), a compound (B) having a triazine ring and represented by formula (1), a radiation-sensitive compound (C), and a coloring agent (D) selected from the group consisting of black dyes and black pigments. In formula (1), R.sup.1, R.sup.2, and R.sup.3 each independently represent a hydroxy group, an alkyl group having 1-5 carbon atoms, an alkenyl group having 2-6 carbon atoms, an alkenyl ether group having 2-6 carbon atoms, an optionally substituted amino group, a halogenated alkyl group, a sulfide group, a mercapto group, a phenyl group, a phenyl ether group, a halogeno group, a naphthyl group, a pyridyl group, a biphenyl group, a morpholino group, a fluorene group, or a carbazole group.

Photosensitive polymer formulations, materials and uses of such materials are disclosed. Embodiments of the present disclosure provide photosensitive polyimide materials having chain extenders and formulations thereof that improve elongation and formability of the polyimide materials, and methods of making such polymer materials.

A negative resist composition comprising a base polymer comprising repeat units derived from a triple bond-containing maleimide compound is provided. A pattern with a high resolution and reduced edge roughness is formed therefrom.

A polymer in the present invention contains a structural unit represented by the following general formula (1), where X.sub.1 is a tetravalent organic group, Z.sub.1 is a divalent organic group, and “k” is an integer of 1 to 3. Thus, the present invention provides: a positive photosensitive resin composition and a negative photosensitive resin composition which exhibit favorable solvent solubility and are capable of forming a fine pattern with high resolution as a result of solubility in an aqueous alkaline solution; a polyimide-based polymer usable as a base resin for these compositions; and a patterning method and a method for forming a cured film which use the compositions.

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A photosensitive resin composition is provided comprising 100 pbw of a polyimide silicone containing a primary alcoholic hydroxyl group, a crosslinker, a photoacid generator, a polyfunctional epoxy compound, 1-70 pbw of a filler having an average particle size of 0.01-20.0 μm, and 0.01-30 pbw of a colorant. The resin composition is colored and photosensitive and cures into a product having an improved modulus.

A method and apparatus for forming a plurality of vias in panels for advanced packaging applications is disclosed, according to one embodiment. A redistribution layer is deposited on a substrate layer. The redistribution layer may be deposited using a spin coating process, a spray coating process, a drop coating process, or lamination. The redistribution layer is then micro-imprinted using a stamp inside a chamber. The redistribution layer and the stamp are then baked inside the chamber. The stamp is removed from the redistribution layer to form a plurality of vias in the redistribution layer. Excess residue built-up on the redistribution layer may be removed using a descumming process. A residual thickness layer disposed between the bottom of each of the plurality of vias and the top of the substrate layer may have thickness of less than about 1 μm.

The present invention is a photosensitive resin composition containing: (A) a resin; (B) a photosensitizer; (C) a surfactant containing a structural unit represented by the following average composition formula (1); and (D) a solvent, where Y.sub.1 and Y.sub.2 each independently represent a hydrogen atom, a methyl group, a phenyl group, or a group represented by the following general formula (2), at least one of Y.sub.1 and Y.sub.2 is a group represented by the following general formula (2), R.sub.1 to R.sub.6 are monovalent hydrocarbon groups that may be the same or different and optionally contain a heteroatom, having 1 to 20 carbon atoms, “l” and “n” are each independently integers of 1 to 100, and “m” is an integer of 0 to 100. This provides: a photosensitive resin composition that is excellent in film thickness uniformity at the time of application and that has reduced coating defects when forming a thick film; a patterning process performed using the photosensitive resin composition; a cured film formed by curing the pattern; and an electronic component having the cured film.

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