Provided is a resin composition which makes it possible to improve the resistance to a flux to be used in soldering and the resistance to reflow, and which, when used as a photosensitive resin composition, can be cured into a film capable of being imparted with such thick film processability that the film can be processed with high sensitivity even when the thickness of the film is as high as 15 m or more. A resin composition comprising (A) a resin having a structural unit represented by general formula (1) and/or general formula (2), (B) a phenolic resin and (C) an antioxidant agent, wherein the phenolic resin (B) contains a structure represented by general formula (3).

The present invention provides an alkali-soluble resin with which a cured film having high extensibility, reduced stress, high adhesion to a metal, and high heat resistance can be obtained, and a photosensitive resin composition containing the alkali-soluble resin, and the present invention is an alkali-soluble resin (A) including a structure represented by a general formula (1) wherein X.sup.1 represents a divalent organic group having 2 to 100 carbon atoms, Y.sup.1 and Y.sup.2 each represent a divalent to hexavalent organic group having 2 to 100 carbon atoms, X.sup.2 represents a tetravalent organic group having 2 to 100 carbon atoms, p and q each represent an integer in a range of 0 to 4, and n.sup.1 and n.sup.2 each represent an integer in a range of 5 to 100,000, wherein (I) and (II) described below are satisfied: (I) an organic group having an aliphatic chain having 8 to 30 carbon atoms is contained as X.sup.1 of the general formula (1) at a content of 30 to 70 mol % based on 100 mol % of a total of X.sup.1 and X.sup.2, and (II) an organic group having a diphenyl ether structure is contained as Y.sup.1 of the general formula (1) at a content of 1 to 30 mol % based on 100 mol % of a total of Y.sup.1 and Y.sup.2.

The present invention relates to a crosslinking agent compound in which a terminal crosslinkable functional group is capped with a silane-based protecting group, a photosensitive composition including the same, and a photosensitive material using the same.

A photosensitive resin composition comprises a modified polyimide polymer having a chemical structural formula of: ##STR00001##
photosensitive monomers, a bisphenol A epoxy resin, a photo-initiator, and a pigment. The modified polyimide polymer is made by a reaction of a polyimide polymer having a chemical structural formula of: ##STR00002##
and glycidyl methacrylate. The carboxyl group of the polyimide polymer reacts with the epoxy group of glycidyl methacrylate. The polyimide polymer is made by a reaction of dianhydride monomers each having an A group, diamine monomers each having the R group, diamine monomers each having the R.sub.1 group, and diamine monomers each having the R.sub.2 group. The diamine monomer having R group is a diamine compound having R group bonding with the carboxyl group. The diamine monomer having R.sub.1 group is a soft long-chain diamine monomer. R.sub.2 group comprises at least one secondary amine group or tertiary amine group.

A photosensitive composition activatable by multiphoton absorption usable for the fabrication of a three-dimensional structure which is biodegradable and/or biocompatible and/or bioresorbable. This structure is usable as a matrix for cell culture. The photosensitive composition comprises: gelatin, collagen, a water-soluble photoinitiator, able to be excited by several photons and capable of generating singlet oxygen, optionally a cell adhesion promoter, and water. A process for preparing the photosensitive composition, a process for preparing a three-dimensional structure from the photosensitive composition, the three-dimensional structure obtained by this preparation process and a matrix for cell culture comprising this structure.

A polyimide polymer that includes the reaction product of: (a) at least one diamine selected from the group consisting of a diamine of Structure (Ia) and a diamine of Structure (Ib), ##STR00001##
(b) at least one diamine of Structure (II), ##STR00002##
(c) at least one tetracarboxylic acid dianhydride, and optionally (d) at least one compound containing a first functional group reactive with an amine or an anhydride and at least one second functional group selected from the group consisting of a substituted or unsubstituted alkenyl group and a substituted or unsubstituted alkynyl group. Each variable in the above formulas is defined in the specification.

A method for producing a polyimide precursor having a structural unit represented by the following formula (1), comprising the following steps (i) and (ii), wherein at least one of the steps of (i) and (ii) is carried out in a solvent comprising a compound having an ether bond and an amide bond: (i) a step of reacting carboxylic anhydride with a diamine compound to obtain a polyimide precursor having a structural unit represented by the following formula (2); and (ii) a step of reacting the polyimide precursor having a structural unit represented by the formula (2) with a compound represented by the following formula (8), and reacting the reactant with a compound represented by the following formula (9) to obtain a polyimide precursor having a structural unit represented by the following formula (1):

##STR00001## wherein in the formula (1), at least one of R.sub.1 and R.sub.2 is a group represented by the formula (3):

##STR00002##

A method of forming an insulating layer on a first interconnect layer formed on a first surface of a wafer includes a step of coating an upper surface of the first interconnect layer and the upper surface of the wafer with a thermosetting resin, a step of modifying predetermined regions of the thermosetting resin into modified resin portions, a step of dissolving the modified resin portions modified in the modifying step with a chemical solution and thereafter removing the dissolved modified resin portions by supplying a cleaning fluid to the wafer, a step of accommodating the wafer into a hermetically sealable chamber, hermetically sealing the chamber, and making the chamber free of oxygen, and a step of heating the wafer accommodated in the chamber that has been made free of oxygen to thermoset the thermosetting resin.

To provide an alkaline developable negative-type photosensitive resin composition from which a cured film that has a high-resolution and low-taper pattern shape and that are excellent in heat resistance and light blocking property can be obtained. A negative-type photosensitive resin composition is characterized by containing an (A1) first resin, a (A2) second resin, a (C) photopolymerization initiator, and a (D) coloring agent, wherein the (A1) first resin is an (A1-1) polyimide and/or an (A1-2) polybenzo-oxazole, and wherein the (A2) second resin is one or more species selected from a (A2-1) polyimide precursor, a (A2-2) polybenzo-oxazole precursor, a (A2-3) polysiloxane, a (A2-4) cardo based resin, and an (A2-5) acrylic resin, and wherein a content ratio of the (A1) first resin in a total of 100 mass % of the (A1) first resin and the (A2) second resin is within the range of 25 to 90 mass %.

This compound, which absorbs long-wavelength active energy rays and generates with high-efficiency radicals and strong bases, and which has excellent reaction efficiency in a base generating chain reaction, is represented by formula (1), where, in formula (1), R.sub.1, R.sub.2, R.sub.3, R.sub.5 and R.sub.6 independently represent a hydroxy group, an alkoxy group, or an organic group other than those substituents, the R.sub.4's independently represent an organic group including a thioether bond, and A represents a substituent represented by formula (1-1) or (1-2), where, in formula (1-1), R.sub.7 and R.sub.8 independently represent a hydrogen atom, an alkyl group or a heterocyclic group, and where, in formula (1-2), R.sub.9 and R.sub.10 independently represent an amino group or a substituted amino group. A photopolymerization initiator can include said compound; and a photosensitive resin composition can include said photopolymerization initiator.

##STR00001##