Disclosed are a photosensitive resin composition including (A) a colorant including a xanthene-based dye and a blue pigment having an average particle diameter (D50) of less than 100 nm; (B) a binder resin including a radically polymerizable double bond; (C) a photopolymerizable compound; (D) a photopolymerization initiator; (E) a matting agent; and (F) a solvent, a photosensitive resin layer manufactured using the photosensitive resin composition, and a color filter including the photosensitive resin layer.

A photosensitive transfer material including a temporary support and a transfer layer including a photosensitive layer, in which a transmittance of the photosensitive layer to light having a wavelength of 365 nm is 0.1% to 30% or a transmittance of the photosensitive layer to light having a wavelength of 405 nm is 0.05% to 30%.

A photosensitive transfer material including a temporary support and a transfer layer including a photosensitive layer, in which the photosensitive layer has infrared curing properties, and a transmittance of the photosensitive layer to light having a wavelength of 830 nm is 0.1% or more.

The present invention relates to: a photosensitive transfer material including a temporary support and a photosensitive layer containing a binder polymer, a polymerizable compound, a photopolymerization initiator, and a compound A, in which a number of hydrophilic groups in the compound A being decreased by an action of light or heat, and the photosensitive layer is transferred to a surface of a metal-containing layer; a method of producing the photosensitive transfer material; a film; a touch panel; a method of suppressing deterioration; a laminate; and a method of producing the film.

Provided are a composition with which a cured film having excellent light shielding properties and low reflection properties can be produced; a light shielding film; a solid-state imaging element; an image display device; and a method for manufacturing a cured film.

The composition including carbon black, barium sulfate, one or more kinds selected from the group consisting of copper phthalocyanine and a copper phthalocyanine derivative, a resin, and a solvent, in which the solvent includes a solvent A having a boiling point of 180° C. or higher, a solvent B having a boiling point of 140° C. or higher and lower than 180° C., and a solvent C having a boiling point of 100° C. or higher and lower than 140° C.

Thermoset compositions and methods for forming three-dimensional articles via an additive fabrication process, and articles made therefrom are disclosed herein. In an embodiment, a composition comprises a first network-forming component comprising a TPA-based polyester comprising a backbone and having at least 2 polymerizable groups, one or more first network monomers, and a first network initiator. The backbone of the TPA-based polyester comprises the reaction product of a terephthalic acid and a polyol. The composition may further comprise a second network-forming component.

A photosensitive resin composition comprising (A) a polyimide precursor having a polymerizable unsaturated bond; (B) a polymerizable monomer having an aliphatic cyclic skeleton; (C) a photopolymerization initiator; and (D) a solvent.

To provide a resist material that can form a film with high smoothness and uniformity and has high patterning performance, such as resolution, a resist material is provided that contains a calixarene compound (A) with a molecular structure represented by the following structural formula (1) and a resin component (B); ##STR00001##
wherein R.sup.1 denotes a perfluoroalkyl group or a structural moiety with a perfluoroalkyl group; R.sup.2 denotes a hydrogen atom, a polar group, a polymerizable group, or a structural moiety with a polar group or a polymerizable group; R.sup.3 denotes a hydrogen atom, an aliphatic hydrocarbon group that optionally has a substituent, or an aryl group that optionally has a substituent; n denotes an integer in the range of 2 to 10; and * denotes a bonding point with an aromatic ring.

Provided are a photosensitive resin composition in which warping of a cured film after curing is decreased and lithographic properties in a case of forming a pattern are excellent, a cured film, a laminate, a method for producing a cured film, and a semiconductor device. The photosensitive resin composition includes a polyimide precursor including a repeating unit including a biphenyl structure and a photopolymerization initiator having an oxime structure capable of generating an aryl radical by being irradiated with light.

A photoinitiated polymerizable composition for 3D printing, the polymerizable composition comprising a nanogel component that comprises nanogel particles, wherein the nanogel particles comprise a copolymer with polymerizable reactive groups suitable for reacting with each other or a reactive diluent monomer, a reactive oligomer, a resin, or a combination thereof that is present in the polymerizable composition upon photoinitiation, wherein the nanogel component has a glass transition temperature that is in a range of about −50 C and about 20 C and an average molecular weight that is in a range of about 10 kg/mol and about 100 kg/mol, and wherein the nanoparticles have an average hydrodynamic radius that is in a range of 1 nm to about 5 nm.