A resin and a photosensitive resin composition whereby a cured film exhibiting high extensibility, reduced stress, and high adhesion to metals can be obtained are provided. A resin (A) including a polyamide structure and at least any structure of an imide precursor structure and an imide structure, wherein at least any of the structures of the resin (A) include a diamine residue having an aliphatic group.

This disclosure relates to a photosensitive stacked structure that includes first and second layers, in which the first layer is a photosensitive, dielectric layer and the second layer is a photosensitive layer. The dissolution rate of the first layer in a developer is less than the dissolution rate of the second layer in the developer.

Embodiments of the present invention are directed to resist underlayer surface modifications. In a non-limiting embodiment of the invention, a photoresist patterning stack includes a resist underlayer on a substrate. The resist underlayer includes a surface modification having one or more moieties. The moieties can include acid quencher moieties that limit acid diffusion during a post exposure bake. The acid quencher moieties can include a tert-butoxycarbonyl protecting group (tBOC)-blocked amine that can be copolymerized with an acid generating underlayer. The moieties can also include base-catalyzed crosslinking moieties selected such that base-catalyzed crosslinking can occur upon exposure to a predetermined developer. The base-catalyzed crosslinking moieties can include an acetal group and the predetermined developer can include tetramethylammonium hydroxide (TMAH).

The present invention belongs to the field of functional materials, and particularly relates to a directly printable image recording material, a preparation method and application thereof. The image recording material comprises 25 to 78.8 parts by mass of a photopolymerizable monomer, 0.2 to 5 parts by mass of a photoinitiator, 20 to 70 parts by mass of an inert component, and 0.05 to 2 parts by mass of a thermal polymerization inhibitor, and has an initial viscosity of 200 to 800 mPa.Math.s. The photopolymerizable monomer includes a thiol monomer and an olefin monomer, at least one of which is a silicon-based monomer with polyhedral oligomeric silsesquioxane as a silicon core. By introducing a POSS-based thiol or olefin monomer into the photopolymerizable monomer in combination with other material components, the recording material is allowed to have an initial viscosity of 200 to 800 mPa.Math.s, and meanwhile, the low thermal conductivity characteristic of the POSS-based photopolymerizable monomer is utilized, so that image storage quality is ensured, continuous industrial production of the image recording material is achieved, the process cost is reduced and the production efficiency is improved.

A radiation-sensitive resin composition capable of forming a resin film for which development residue formation is sufficiently inhibited and that has excellent extensibility. The radiation-sensitive resin composition contains: a cycloolefin polymer (A-1) including a protonic polar group; a cycloolefin polymer (A-2) including a protonic polar group; a difunctional epoxy compound (B); and a radiation-sensitive compound (C). The cycloolefin polymer (A-1) has a weight-average molecular weight of not less than 1,000 and less than 10,000, and the cycloolefin polymer (A-2) has a weight-average molecular weight of not less than 10,000 and not more than 100,000. Content of the cycloolefin polymer (A-2) is not less than 5 mass % and not more than 55 mass % of total content of the cycloolefin polymer (A-1) and the cycloolefin polymer (A-2).

The present invention provides a composite which can be produced by photostructuring a photostructurable matrix material in a composite formulation to form a structured matrix with nanoparticles, where the refractive index of the composite with nanoparticles differs from the refractive index of the composite without nanoparticles at one wavelength, selected from the range from 150 nm to 2000 nm by less than 0.5, said composite being hierarchically structured and comprising at least one structural unit (I) of a selected thickness (i) and structural units (II) branching from said structural unit (I) of a selected thickness (ii), wherein the thickness (ii) at the branch-off points is at most half the thickness (i). In addition, the present invention provides an improved process for the preparation of a composite comprising photostructured matrix material and nanoparticles contained therein and the use of the composite.

A salt represented by the formula (I): ##STR00001##

An example of a flow cell includes a substrate and a cured, patterned resin on the substrate. The cured, patterned resin has nano-depressions separated by interstitial regions. Each nano-depression has a largest opening dimension ranging from about 10 nm to about 1000 nm. The cured, patterned resin also includes an interpenetrating polymer network. The interpenetrating polymer network of the cured, patterned resin includes an epoxy-based polymer and a (meth)acryloyl-based polymer.

A fabricating method of reducing photoresist footing includes providing a silicon nitride layer. Later, a fluorination process is performed to graft fluoride ions onto a top surface of the silicon nitride layer. After the fluorination process, a photoresist is formed to contact the top surface of the silicon nitride layer. Finally, the photoresist is patterned to remove at least part of the photoresist contacting the silicon nitride layer.

The present invention relates to a crosslinking agent compound in which a terminal crosslinkable functional group is capped with a silane-based protecting group, a photosensitive composition including the same, and a photosensitive material using the same.