The present invention provides a flexographic printing plate precursor which makes it possible to precisely reproduce the pattern of a microcell on the surface of a printing plate without requiring the use of any specialized device or any additional step, and thus to improve the ink laydown on a solid-printed part. A flexographic printing plate precursor comprising at least a support (A), a photosensitive resin layer (B), an oxygen barrier layer (C) and a heat-sensitive mask layer (D) which are laminated in this order, wherein a photosensitive resin composition constituting the photosensitive resin layer (B) comprises (a) a polymer prepared by polymerizing a conjugated diene, (b) an ethylenically unsaturated compound and (c) a photopolymerization initiator, and wherein the content of the photopolymerization initiator (c) in the photosensitive resin composition is 2 to 9% by mass.

The present invention provides a flexographic printing plate in which the problem of ink entanglement, i.e., the direct connection of ink on a dot convex part to ink on an adjacent dot convex part, is reduced. A flexographic printing plate obtained from a flexographic printing plate precursor comprising at least a support (A), a photosensitive resin layer (B) and a heat-sensitive mask layer (C) which are laminated in this order, wherein, on a surface of the printing plate, there are provided dot convex parts, a dot valley part formed between the dot convex parts, and a floor part, and wherein a side surface of the dot valley part and the floor part have been subjected to the same finishing exposure treatment and the same exposure treatment using a germicidal lamp, characterized in that the adhesion force of the floor part on the printing plate is 2.0 N/mm.sup.2 or less.

A method of making a semiconductor device is provided for depositing, patterning, and developing photoresist (1703, 1704) on an underlying layer located on a backside of a wafer having a frontside on which an integrated circuit die are formed over a shared wafer semiconductor substrate and arranged in a grid, thereby forming a patterned photoresist mask with a unique set of one or more openings which are used to selectively etch the underlying layer to form, on each integrated circuit die, a unique die mark identifier pattern of etched openings in the underlying layer corresponding to the unique set of one or more openings in the patterned photoresist mask (1705), where the patterned photoresist mask is removed (1706) from the backside of the wafer before singulating the wafer to form a plurality of integrated circuit devices (1708) which each include a unique die marking.

Provided is a lithographic printing plate precursor having an aluminum support, an image-recording layer, and a water-soluble overcoat layer in this order, in which the image-recording layer contains an infrared-absorbing polymethine colorant having HOMO of −5.2 eV or less, a polymerization initiator, a polymerizable compound, and a polymer, and the polymer has a constitutional unit formed of an aromatic vinyl compound and a constitutional unit formed of an acrylonitrile compound. Also provided are a method for preparing a lithographic printing plate using the lithographic printing plate precursor.

A member transfer method includes sticking a member supported at a support to an object, thinning the support after the sticking of the member to the object, and removing the support from the member after the thinning of the support.

The present disclosure is directed to a patterning process that includes providing a composite dry film resist on a surface, in which the composite dry film resist includes a base film, a barrier layer and a resist layer, in which the base film is disposed over the barrier layer and the barrier layer is disposed over the resist layer. In another aspect, the patterning process includes removing the base film from the barrier layer and exposing the barrier layer to form an exposure precursor, which has a first area and a second area, further exposing the first area of the exposure precursor to electromagnetic irradiation, which passes through the barrier layer and the resist layer in the exposed first area becomes water-insoluble, and removing the barrier layer and the unexposed second area to form a pattern template.

A method of removing a photoresist, a laminate, a method of forming a metallic pattern, a polyimide resin, and a stripper are provided. The method of removing the photoresist includes forming a release layer on a substrate, the release layer having a first surface and a second surface opposite to each other, wherein the first surface of the release layer is in contact with the substrate; forming a photoresist layer on the second surface of the release layer; and removing the release layer and the photoresist layer. The release layer is formed by a polyimide resin. The polyimide resin is obtained by performing a polymerization of tetracarboxylic dianhydrides, diamines, and phenolamines. The diamines include hydroxyfluorinated diamines, benzoic acid diamines, and aminotetramethyldisiloxanes.

A method of forming a pattern in a photoresist layer includes forming a photoresist layer over a substrate, and reducing moisture or oxygen absorption characteristics of the photoresist layer. The photoresist layer is selectively exposed to actinic radiation to form a latent pattern, and the latent pattern is developed by applying a developer to the selectively exposed photoresist layer to form a pattern.

IR-sensitive lithographic printing plate precursors provide a stable print-out image using a unique IR radiation-sensitive composition. This IR radiation-sensitive composition includes: a) free radically polymerizable component; an b) IR radiation absorber; c) an initiator composition; a d) borate compound; and a e) compound capable of forming a colored boronic complex during or after exposure of the infrared radiation-sensitive image-recording layer to infrared radiation. The resulting print-out image exhibits an excellent color contrast between the exposed and non-exposed regions. After IR imaging, these precursors can be developed off-press or on-press.

A semiconductor structure includes a semiconductor substrate and a multi-layer patterning material film stack formed on the semiconductor substrate. The patterning material film stack includes a resist layer formed over one or more additional layers. The semiconductor structure further includes a metal-containing top coat formed over the resist layer. The metal-containing top coat can be formed, for example, by atomic layer deposition or spin-on deposition over the resist layer, or by self-segregation from the resist layer.