Patent classifications
G03F7/105
PHOTOSENSITIVE RESIN COMPOSITION, AND PHOTOSENSITIVE RESIN FILM AND COLOUR FILTER MANUFACTURED BY USING SAME
Disclosed are a photosensitive resin composition including (A) a colorant including a xanthene-based dye and a blue pigment having an average particle diameter (D50) of less than 100 nm; (B) a binder resin including a radically polymerizable double bond; (C) a photopolymerizable compound; (D) a photopolymerization initiator; (E) a matting agent; and (F) a solvent, a photosensitive resin layer manufactured using the photosensitive resin composition, and a color filter including the photosensitive resin layer.
PHOTOSENSITIVE RESIN COMPOSITION, AND PHOTOSENSITIVE RESIN FILM AND COLOUR FILTER MANUFACTURED BY USING SAME
Disclosed are a photosensitive resin composition including (A) a colorant including a xanthene-based dye and a blue pigment having an average particle diameter (D50) of less than 100 nm; (B) a binder resin including a radically polymerizable double bond; (C) a photopolymerizable compound; (D) a photopolymerization initiator; (E) a matting agent; and (F) a solvent, a photosensitive resin layer manufactured using the photosensitive resin composition, and a color filter including the photosensitive resin layer.
PHOTOSENSITIVE TRANSFER MATERIAL, LIGHT SHIELDING MATERIAL, LED ARRAY, AND ELECTRONIC APPARATUS
A photosensitive transfer material including a temporary support and a transfer layer including a photosensitive layer, in which a transmittance of the photosensitive layer to light having a wavelength of 365 nm is 0.1% to 30% or a transmittance of the photosensitive layer to light having a wavelength of 405 nm is 0.05% to 30%.
PHOTOSENSITIVE TRANSFER MATERIAL, LIGHT SHIELDING MATERIAL, LED ARRAY, AND ELECTRONIC APPARATUS
A photosensitive transfer material including a temporary support and a transfer layer including a photosensitive layer, in which the photosensitive layer has infrared curing properties, and a transmittance of the photosensitive layer to light having a wavelength of 830 nm is 0.1% or more.
PHOTOSENSITIVE TRANSFER MATERIAL FOR LED ARRAY, LIGHT SHIELDING MATERIAL FOR LED ARRAY, LED ARRAY, AND ELECTRONIC APPARATUS
A photosensitive transfer material for an LED array, including a temporary support and a transfer layer including a photosensitive layer, in which an L* value of a surface of the photosensitive layer on a temporary support side, which is measured by an SCE method, is 5.0 or less.
COMPOSITION, LIGHT SHIELDING FILM, SOLID-STATE IMAGING ELEMENT, IMAGE DISPLAY DEVICE, AND METHOD FOR MANUFACTURING CURED FILM
Provided are a composition with which a cured film having excellent light shielding properties and low reflection properties can be produced; a light shielding film; a solid-state imaging element; an image display device; and a method for manufacturing a cured film.
The composition including carbon black, barium sulfate, one or more kinds selected from the group consisting of copper phthalocyanine and a copper phthalocyanine derivative, a resin, and a solvent, in which the solvent includes a solvent A having a boiling point of 180° C. or higher, a solvent B having a boiling point of 140° C. or higher and lower than 180° C., and a solvent C having a boiling point of 100° C. or higher and lower than 140° C.
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN FILM, PHOTOSENSITIVE DRY FILM, PATTERNING PROCESS, AND LIGHT EMITTING DEVICE
A photosensitive resin composition containing (A) an acid-crosslinkable group-containing silicone resin, (B) a photo-acid generator, and (C) quantum dot particles. Thus, a photosensitive resin composition is capable of easily forming a film having favorable heat resistance, lithography resolution, and luminous properties; a photosensitive resin film and a photosensitive dry film are obtained by using the photosensitive resin composition; patterning processes use these; and a light emitting device is obtained by using the photosensitive resin composition.
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN FILM, PHOTOSENSITIVE DRY FILM, PATTERNING PROCESS, AND LIGHT EMITTING DEVICE
A photosensitive resin composition containing (A) an acid-crosslinkable group-containing silicone resin, (B) a photo-acid generator, and (C) quantum dot particles. Thus, a photosensitive resin composition is capable of easily forming a film having favorable heat resistance, lithography resolution, and luminous properties; a photosensitive resin film and a photosensitive dry film are obtained by using the photosensitive resin composition; patterning processes use these; and a light emitting device is obtained by using the photosensitive resin composition.
Coloring composition for solid-state imaging element
A photosensitive green composition for a color filter of a solid-state imaging element, contains a colorant (A), a binder resin (B), a photopolymerization initiator (C), a photopolymerizable monomer (D), an ultraviolet absorber (E), and a monofunctional thiol (F), wherein the colorant (A) contains C.I. Pigment Green 36 and/or C.I. Pigment Green 58.
COMPOUND, BINDER RESIN, NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, AND DISPLAY DEVICE COMPRISING BLACK BANK FORMED USING SAME
The present application relates to a compound of Formula 1, a binder resin, a negative-type photosensitive resin composition, and a display device comprising a black bank formed using same.