Disclosed herein is a method, comprising disposing a first composition on a substrate, wherein the first composition comprises a first block copolymer comprising a first block and a second block, wherein the first block comprises a repeat unit containing a hydrogen acceptor or a hydrogen donor, and the second block comprises a repeat unit containing a blocked donor when the repeat unit of the first block is a hydrogen acceptor, or a blocked acceptor when the repeat unit of the first block is a hydrogen donor; and a solvent; and deprotecting the blocked acceptor or the blocked donor with a deprotecting agent.

The present invention relates to a photo-curable and thermo-curable resin composition which can form a DFSR having micro unevenness on the surface without a separate treatment such as plasma treatment and the like and a DFSR. The photo-curable and thermo-curable resin composition includes an acid-modified oligomer having a carboxyl group (COOH) and a photo-curable unsaturated functional group; a polyimide-based resin; a photo-polymerizable monomer having two or more photo-curable unsaturated functional groups; a thermo-curable binder having a thermo-curable functional group; and a photoinitiator.

The present invention relates to a photo-curable and thermo-curable resin composition which can form a DFSR having micro unevenness on the surface without a separate treatment such as plasma treatment and the like and a DFSR. The photo-curable and thermo-curable resin composition includes an acid-modified oligomer having a carboxyl group (COOH) and a photo-curable unsaturated functional group; a polyimide-based resin; a photo-polymerizable monomer having two or more photo-curable unsaturated functional groups; a thermo-curable binder having a thermo-curable functional group; and a photoinitiator.

A photosensitive resin composition, containing: an acid-modified vinyl group-containing resin (A); a photopolymerization initiator (B); a photopolymerizable compound (C); and polymerization inhibitor (D), in which the photopolymerization initiator (B) includes an alkyl phenone-based photopolymerization initiator (B1), an oxime ester-based photopolymerization initiator (B2), and a benzophenone-based photopolymerization initiator (B3).

A photosensitive resin composition, containing: an acid-modified vinyl group-containing resin (A); a photopolymerization initiator (B); a photopolymerizable compound (C); and polymerization inhibitor (D), in which the photopolymerization initiator (B) includes an alkyl phenone-based photopolymerization initiator (B1), an oxime ester-based photopolymerization initiator (B2), and a benzophenone-based photopolymerization initiator (B3).