Patent classifications
G03F7/2014
Mask frame assembly and evaporation device
A mask frame assembly, including: a hollow frame, which is provided with a hollow area; and a first howling stick, disposed across the hollow area of the hollow frame in a first direction; wherein the mask frame assembly is configured to support a fine metal mask plate which includes a mask pattern area and an invalid mask area surrounding the mask pattern area; in a state of the fine metal mask plate being supported by the mask frame assembly, opposite ends of the fine metal mask plate are fixed on the hollow frame in a second direction; the mask pattern area of the fine metal mask plate is disposed in the hollow area of the hollow frame; and a projection of the first howling stick on the fine metal mask plate is in the invalid mask area. An evaporation device is also disclosed.
PHOTORESIST-FREE DEPOSITION AND PATTERNING WITH VACUUM ULTRAVIOLET LAMPS
A method for photoresist-free photolithography to pattern a surface of conductor or semiconductor substrate and deposit a material includes surface cleaning and irradiating a surface through a mask with VUV photons from a lamp. Photons are generated with a VUV lamp having a wavelength of 160 nm-200 nm and with an intensity sufficient to alter the surface. The photons are directed through a mask pattern to alter the surface chemistry or structure in those areas of the substrate defined by the mask. Material is selectively deposited onto the surface, in those portions of the surface that are exposed to the VUV photons, or unexposed to the VUV photons, depending on the substrate surface. A method uses a seed film and then electroplates metal onto the seed film in the mask pattern. A method provides for electroless deposition of metal and another for altering surface chemistry in the mask pattern.
CONDUCTIVE PATTERNING USING A PERMANENT RESIST
A permanent resist, such as TMMF, is used when patterning conductive material on a substrate, enabling lines that have a higher line-to-space ratio (L/S) or a higher aspect ratio (T/L) or both. Pattern density can thus be increased, allowing for improved performance (e.g., greater efficiency, in the case of transformer coil patterning) and greater heat dissipation. As examples, the permanent-resist-based patterning fabrication methods can be used to create transformer coils within an integrated circuit (IC) module, or a routable lead frame for one or more IC dies.
Method of making a film negative
A method of preparing a film negative including the steps of dispersing a UV ink in a desired pattern on a UV printing substrate; and curing the UV ink with a source of actinic radiation to crosslink and cure the UV ink and create the UV printed polymer layer in the desired pattern. The UV ink is at least substantially solvent-free and printing substrate does not contain an adhesive layer or an ink-receptive layer and is not been modified to be ink-receptive. The film negative may be used in a process of making a flexographic printing element.
Nanofibrous carbon microstructures
Various examples of methods and systems related to nanofibrous microstructures including carbon nanofibrous microelectrode arrays are provided. In one example, a method includes electrospinning photosensitive nanofibers on a patterned substrate; immersing the photosensitive nanofibers in a refractive index matching medium; and exposing the immersed photosensitive nanofibers to ultraviolet (UV) light through the patterned substrate or through a front side photomask. In another example, a microelectrode array includes a carbon thin film (CTF) trace pattern including a plurality of CTF electrode pads; and a plurality of carbon nanofiber (CNF) pillars disposed on the plurality of CTF electrode pads.
ON-PRESS DEVELOPMENT TYPE LITHOGRAPHIC PRINTING PLATE PRECURSOR, METHOD FOR PREPARING LITHOGRAPHIC PRINTING PLATE, AND LITHOGRAPHIC PRINTING METHOD
Provided is an on-press development type lithographic printing plate precursor having an aluminum support and an image-recording layer on the aluminum support, in which the image-recording layer contains an infrared-absorbing polymethine colorant having HOMO of −5.2 eV or less, a polymerization initiator, and a polymerizable compound having 7 or more functional groups and contains or does not contain a polymer having a molecular weight 10,000 or more, and in a case where the image-recording layer contains the polymer having a molecular weight of 10,000 or more, a ratio Wp/Wm of a content Wp of the polymer having a molecular weight of 10,000 or more to a content Wm of the polymerizable compound having 7 or more functional groups is 1.00 or less. Also provided are a method for preparing a lithographic printing plate and a lithographic printing method using the lithographic printing plate precursor.
PHOTORESIST-FREE PHOTOLITHOGRAPHY, PHOTOPROCESSING TOOLS, AND METHODS WITH VUV OR DEEP-UV LAMPS
A fabrication tool has at least one flat lamp photon source, or an array of flat lamps, that serve to non-thermally ablate polymer material from a surface. No photoresist is required and the desired photoablated pattern is determined by inserting a photolithographic mask between the lamp(s) and the surface to be processed. Methods of the invention pattern organic polymer and can pattern a substrate using a pattern established in an organic polymer layer on the substrate, and can also deposit materials in the pattern by breaking bonds in deposition precursors with photons from the microplasma array. Another method converts organic polymer material to have a hydrophylic surface. A tool of the invention can have width and depth comparable to a typical paperback book and a height comparable to a coffee cup.
Method for making three dimensional structures using photolithography and an adhesively bondable material
A method for making three dimensional structures using photolithography and an adhesively bondable material is disclosed. A thiol-ene-epoxy (OSTE(−)) material undergoes a first reaction upon partial irradiation in a pattern to become a partially cross-linked polymer network. Non-cross-linked parts are dissolved in a solvent and removed. An initiator is added to activate the cross-linked polymer network so that it becomes adhesive and can then be covalently bound to another object to form an article. The method can be utilized to manufacture an article with a complicated three dimensional shape in an easy way.
Large microfluidic bioreactor and manufacturing method thereof
Large bioreactors based on microfluidic technology, and methods of manufacturing the same, are provided, The big microbioreactor can include a chip or substrate having the microfluidic channels thereon, and the chip can be manufactured by forming a master mold, forming a male mold from a photopolymer plate using replica molding with the Fmold, and transferring features of the male to a polymer material.
Substrate having film type pattern and the manufacturing method for making the same
A substrate having film type pattern and the manufacturing method, the substrate having film type pattern includes: a substrate; at least film type pattern layer which is allocated on the substrate; and a peripheral pattern layer which is allocated around the film type pattern layer.