The inventive concept provides a substrate treating apparatus and a substrate treating method. The sub substrate treating apparatus may include a support unit that supports a substrate, a liquid supply unit that supplies a liquid onto the substrate supported by the support unit, and a controller that controls the liquid supply unit and the support unit, the liquid supply unit may include a pre-treatment nozzle that discharges a first treatment liquid in a stream scheme, and a main nozzle that discharges a second treatment liquid in a liquid curtain scheme, and the controller may control the support unit such that a rotational direction of the substrate when the first treatment liquid is discharged from the main nozzle and a rotational direction of the substrate when the second treatment liquid is discharged from the pre-treatment nozzle are opposite to each other.

A developing method and apparatus are provided. The developing method includes: obtaining airflow conditions above a wafer to be developed; setting a developing procedure according to the airflow conditions; and developing the wafer to be developed according to the developing procedure.

The inventive concept provides a substrate treating apparatus and a substrate treating method. The sub substrate treating apparatus may include a support unit that supports a substrate, a liquid supply unit that supplies a liquid onto the substrate supported by the support unit, and a controller that controls the liquid supply unit and the support unit, the liquid supply unit may include a pre-treatment nozzle that discharges a first treatment liquid in a stream scheme, and a main nozzle that discharges a second treatment liquid in a liquid curtain scheme, and the controller may control the support unit such that a rotational direction of the substrate when the first treatment liquid is discharged from the main nozzle and a rotational direction of the substrate when the second treatment liquid is discharged from the pre-treatment nozzle are opposite to each other.

A method for improving uniformity of photoresist development includes: a substrate is provided, which is coated with a photoresist layer and includes a first area and a second area around a periphery of the first area; a second developer solution is transmitted to the second area, and the photoresist layer located in the second area is developed; a first developer solution is transmitted to the first area, and the photoresist layer located in the first area is developed.

A spin coater may include a spin chuck, a nozzle, a first temperature controller and a second temperature controller. The spin chuck may be configured make contact with a central portion of a lower surface of a substrate and may be configured to rotate the substrate when photoresist is on the substrate. The nozzle may be arranged over a central portion of the spin chuck and configured to provide a central portion of an upper surface of the substrate with photoresist. The first temperature controller may be configured to control a temperature in a first region of the spin chuck. The second temperature controller may be configured to control a temperature in a second region of the spin chuck.

A method of processing a substrate includes: performing a first developing process of moving a nozzle having one end surface and a discharge port opened at the end surface while making the end surface come into contact with a developer on a front surface of a substrate in a state in which the nozzle is disposed so that the end surface faces the front surface and the developer is discharged from the discharge port at a first flow rate while rotating the substrate; and after the first developing process, performing a second developing process of discharging the developer from the discharge port at a second flow rate higher than the first flow rate in a state in which the end surface is in contact with the developer on the front surface at a position facing a center of the front surface of the substrate while rotating the substrate.

A developer tool described herein includes a dispenser that includes a greater quantity of nozzles in a central portion relative to a perimeter portion such that the developer tool is capable of more effectively removing material from a photoresist layer near a center of a substrate (which tends to be thicker near the center of the substrate relative to the edge or perimeter of the substrate). In this way, the developer tool may reduce the amount of photoresist residue or scum remaining on the substrate near the center of the substrate after a development operation, which may enable defect removal and/or prevention, may increase semiconductor processing yield, and/or may increase semiconductor processing quality.

There are provided an apparatus and a method for providing a substrate, which can suppress any additional reaction between a developing solution and a photoresist (PR) film and prevent any PR remnants from being generated from such additional reaction. The method includes: supplying an organic developing solution onto a substrate while rotating the substrate at a first revolutions per minute (rpm); substituting the organic developing solution with a nonpolar rinse solution by supplying the nonpolar rinse solution onto the substrate while rotating the substrate at a second rpm, which is lower than the first rpm; continuing to supply the nonpolar rinse solution while rotating the substrate at a third rpm, which is higher than the second rpm; and continuing to supply the nonpolar rinse solution while rotating the substrate at a fourth rpm, which is between the second rpm and the third rpm.

A spin dispenser module and methods for using the same is disclosed. The spin dispenser module includes a cup having a basin with sidewalls and an exhaust, a rotatable platform situated inside the cup adapted for holding and rotating a substrate, a liquid dispenser disposed over the rotatable platform for dispensing a liquid coating material on top of the substrate, one or more ejector inlets disposed over the rotatable platform, the one or more ejectors connected to a negative pressure source, and a motor coupled to the rotatable platform to rate the rotatable platform at different rotational speeds. The one or more ejector inlets may be translatable and/or rotatable with optionally adjustable suction pressure. The ejector inlets operate after a liquid coating material is dispensed to avoid deposition of suspended organic compounds after a coating is formed.

A developer tool described herein includes a dispenser that includes a greater quantity of nozzles in a central portion relative to a perimeter portion such that the developer tool is capable of more effectively removing material from a photoresist layer near a center of a substrate (which tends to be thicker near the center of the substrate relative to the edge or perimeter of the substrate). In this way, the developer tool may reduce the amount of photoresist residue or scum remaining on the substrate near the center of the substrate after a development operation, which may enable defect removal and/or prevention, may increase semiconductor processing yield, and/or may increase semiconductor processing quality.