A method for forming a light-transmissive member includes irradiating a principal surface of a cured resin body containing a silicone resin with ultraviolet rays through a photomask comprising one or more light-blocking regions and one or more light-transmissive regions, so as to cause a height of one or more first regions of the principal surface, which correspond to the one or more light-blocking regions of the photomask, to be different than a height of one or more second regions of the principal surface, which correspond to the one or more light-transmissive regions of the photomask.

Embodiments of the present disclosure generally provide a digital lithography system that can process both large area substrates as well as semiconductor device substrates, such as wafers. Both the large area substrates and the semiconductor device substrates can be processed in the same system simultaneously. Additionally, the system can accommodate different levels of exposure for forming the features over the substrates. For example, the system can accommodate very precise feature patterning as well as less precise feature patterning. The different exposures can occur in the same chamber simultaneously. Thus, the system is capable of processing both semiconductor device substrates and large area substrates simultaneously while also accommodating very precise feature patterning simultaneous with less precise feature patterning.

A light source is composed of a discharge lamp, a resistor and a reflector container. The discharge lamp is provided as a source of light. The resistor increases a resistance in elevation of a temperature thereof, and reduces the resistance in lowering of the temperature thereof. The reflector container is a constituent element to which the discharge lamp and the resistor are attached. Additionally, the resistor is caused to heat an outer surface of the reflector container in accordance with elevation of a temperature of the discharge lamp in activation of lighting of the discharge lamp.

A system for pumping laser sustained plasma and enhancing one or more selected wavelengths of output illumination generated by the laser sustained plasma is disclosed. In embodiments, the system includes one or more pump modules configured to generate pump illumination for the laser sustained plasma and one or more enhancing illumination sources configured to generate enhancing illumination at one or more selected wavelengths. The pump illumination may be directed along one or more pump illumination paths that are non-collinear to an output illumination path of the output illumination. The enhancing illumination may be directed along an illumination path that is collinear to the output illumination path of the output illumination so that the enhancing illumination is combined with the output illumination, thereby enhancing the output illumination at the one or more selected wavelengths.

Embodiments of the present disclosure generally provide a digital lithography system that can process both large area substrates as well as semiconductor device substrates, such as wafers. Both the large area substrates and the semiconductor device substrates can be processed in the same system simultaneously. Additionally, the system can accommodate different levels of exposure for forming the features over the substrates. For example, the system can accommodate very precise feature patterning as well as less precise feature patterning. The different exposures can occur in the same chamber simultaneously. Thus, the system is capable of processing both semiconductor device substrates and large area substrates simultaneously while also accommodating very precise feature patterning simultaneous with less precise feature patterning.

Provided are an exposure apparatus and a prevention method and system for image offset of the exposure apparatus. The dust cover which is made of transparent material and arranged and arranged at one end of the bearing connected to the lifter enables to check whether the bearing is abraded via manual vision or machine vision, thereby enhancing the yield of the glass substrates achieved by photoetching in the photo process and thus improving the production efficiency of the photo process.

An etch process that includes removing an oxide containing surface layer from a semiconductor surface to be etched by applying a hydrofluoric (HF) based chemistry, wherein the hydrofluoric (HF) based chemistry terminates the semiconductor surface to be etched with silicon-hydrogen bonds, and applying a vapor priming agent bearing chemical functionality based on the group consisting of alkynes, alcohols and a combination thereof to convert the silane terminated surface to a hydrophobic organic surface. The method continues with forming a photoresist layer on the hydrophobic organic surface; and patterning the photoresist layer. Thereafter, the patterned portions of the photoresist are developed to provide an etch mask. The portions of the semiconductor surface exposed by the etch mask are then etched.

A light source is composed of a discharge lamp, a resistor and a reflector container. The discharge lamp is provided as a source of light. The resistor increases a resistance in elevation of a temperature thereof, and reduces the resistance in lowering of the temperature thereof. The reflector container is a constituent element to which the discharge lamp and the resistor are attached. Additionally, the resistor is caused to heat an outer surface of the reflector container in accordance with elevation of a temperature of the discharge lamp in activation of lighting of the discharge lamp.

Provided are an exposure apparatus and a prevention method and system for image offset of the exposure apparatus. The dust cover which is made of transparent material and arranged and arranged at one end of the bearing connected to the lifter enables to check whether the bearing is abraded via manual vision or machine vision, thereby enhancing the yield of the glass substrates achieved by photoetching in the photo process and thus improving the production efficiency of the photo process.

A light source apparatus includes a holder configured to hold a lamp including a metal base having a cylindrical surface, a condensing mirror configured to condense light generated by the lamp, and a nozzle including an ejection hole configured to eject a gas to cool the metal base. A distance between a straight line including a center axis of the ejection hole and a center axis of the metal base ranges from not less than ? of a radius of the cylindrical surface to not more than the radius.