A system for generating extreme ultraviolet light, in which a target material inside a chamber is irradiated with a laser beam to be turned into plasma, includes a first laser apparatus configured to output a first laser beam, a second laser apparatus configured to output a pedestal and a second laser beam, and a controller connected to the first and second laser apparatuses and configured to cause the first laser beam to be outputted first, the pedestal to be outputted after the first laser beam, and the second laser beam having higher energy than the pedestal to be outputted after the pedestal.

An extreme ultraviolet light generation system includes a chamber, a target supply unit supplying a target substance to a plasma generation region including a first point in the chamber, a window allowing pulse laser light with which the target substance is irradiated to pass therethrough, an EUV light concentrating mirror concentrating extreme ultraviolet light generated at the first point on a second point, a planar mirror arranged on an optical path of the extreme ultraviolet light reflected by the EUV light concentrating mirror and between the first and second points, an actuator causing the second point to be switched between a first position and a second position, a connection portion connectable to an external apparatus, a first EUV measurement unit on which the extreme ultraviolet light having passed through the second position is incident, and a processor controlling the actuator based on a signal from the external apparatus.

A wavelength control method of a laser apparatus includes sequentially obtaining target wavelength data of a pulse laser beam, sequentially saving the target wavelength data, sequentially measuring a wavelength of the pulse laser beam to obtain a measured wavelength, calculating a wavelength deviation using the measured wavelength and the target wavelength data at a time before a time when the measured wavelength is obtained, and feedback-controlling the wavelength of the pulse laser beam using the wavelength deviation.

A laser apparatus includes a first optical element, a second optical element, a first actuator configured to change a first wavelength component included in a pulse laser beam by changing a posture of the first optical element, a second actuator configured to change a second wavelength component included in the pulse laser beam by changing a posture of the second optical element, a first encoder configured to measure a position of the first actuator, a second encoder configured to measure a position of the second actuator, and a processor. The processor reads a first relation and a second relation and performs control of the first actuator based on the first relation and the position of the first actuator measured by the first encoder and control of the second actuator based on the second relation and the position of the second actuator measured by the second encoder.

A method includes: producing a light beam made up of pulses having a wavelength in the deep ultraviolet range, each pulse having a first temporal coherence defined by a first temporal coherence length and each pulse being defined by a pulse duration; for one or more pulses, modulating the optical phase over the pulse duration of the pulse to produce a modified pulse having a second temporal coherence defined by a second temporal coherence length that is less than the first temporal coherence length of the pulse; forming a light beam of pulses at least from the modified pulses; and directing the formed light beam of pulses toward a substrate within a lithography exposure apparatus.

A light source apparatus according to an embodiment may be used for an exposure apparatus which exposes a plurality of wafers by repeating a wafer exposure for exposing a total exposure area of each wafer. The wafer exposure may include a sequential execution of scanning exposures in which each divided area defined by dividing the total exposure area of each wafer is scanned by pulsed light. The apparatus may comprise: a light source controller configured to execute a control for outputting the pulsed light based on a luminescence trigger signal received from the exposure apparatus; a detector configured to detect a characteristic of the pulsed light; and a data collection processor configured to collect at least a piece of data in data included in a pulse light data group related to the pulsed light detected by the detector and a control data group related to the control, and execute a mapping process of mapping the collected data by at least one of scanning exposure basis and wafer exposure basis.

A method includes producing a pulsed light beam; directing the pulsed light beam toward a substrate mounted to a stage of a lithography exposure apparatus; scanning a pulsed light beam and the substrate relative to each other, including projecting the pulsed light beam onto each sub-area of the substrate and moving one or more of the pulsed light beam and the substrate relative to each other; determining a value of a vibration of the stage for each sub-area of a substrate; for each sub-area of the substrate, determining an amount of adjustment to a bandwidth of the pulsed light beam, the adjustment amount compensating for a variation in the stage vibration so as to maintain a focus blur within a predetermined range of values across the substrate; and changing the bandwidth of the pulsed light beam by the determined adjustment amount to thereby compensate for the stage vibration variations.

A laser processing method of performing laser processing on a transparent material that is transparent to ultraviolet light by using a laser processing system includes: performing relative positioning of a transfer position of a transfer image and the transparent material in an optical axis direction of a pulse laser beam so that the transfer position is set at a position inside the transparent material at a predetermined depth ΔZsf from a surface of the transparent material in the optical axis direction; and irradiating the transparent material with the pulse laser beam having a pulse width of 1 ns to 100 ns inclusive and a beam diameter of 10 μm to 150 μm inclusive at the transfer position.

An example of the disclosure is a laser apparatus including a master oscillator capable of outputting a pulse laser beam, a plurality of optical amplifiers disposed on an optical path of the pulse laser beam outputted from the master oscillator and configured to sequentially amplify the pulse laser beam, an optical reflector capable of passing the pulse laser beam therethrough and reflecting a self-oscillation beam generated in one of the plurality of optical amplifiers, and an optical absorber capable of receiving and absorbing the self-oscillation beam reflected by the optical reflector.

An optical fiber, manufacturing intermediate for forming an optical fiber and a method for forming an optical fiber. The method includes providing a manufacturing intermediate having an elongate body and having an aperture extending through the elongate body along an axial dimension of the elongate body, a boundary of the aperture defining an internal surface of the manufacturing intermediate. The method further includes etching the internal surface of the manufacturing intermediate using an etching substance, and drawing the manufacturing intermediate along the axial dimension so as to form the optical fiber.