A method of controlling a feedback system with a data matching module of an extreme ultraviolet (EUV) radiation source is disclosed. The method includes obtaining a slit integrated energy (SLIE) sensor data and diffractive optical elements (DOE) data. The method performs a data match, by the data matching module, of a time difference of the SLIE sensor data and the DOE data to identify a mismatched set of the SLIE sensor data and the DOE data. The method also determines whether the time difference of the SLIE sensor data and the DOE data of the mismatched set is within an acceptable range. Based on the determination, the method automatically validates a configurable data of the mismatched set such that the SLIE sensor data of the mismatched set is valid for a reflectivity calculation.

An exposure apparatus configured to expose a substrate to light from a solid-state light emitting element, includes an illumination optical system configured to illuminate a mask with the light, and a projection optical system configured to project an image of a pattern of the mask onto the substrate, wherein a pupil plane intensity distribution, which is a light intensity distribution on a pupil plane included in the illumination optical system and optically conjugated with a light emission plane of the solid-state light emitting element, is a light intensity distribution in which a maximum intensity is achieved outside an optical axis of the illumination optical system, and wherein the pupil plane intensity distribution is a light intensity distribution on the pupil plane onto which a light emission distribution of the light emission plane is projected with a predetermined magnification.

Methods and apparatus for determining an intensity profile of a radiation beam. The method comprises providing a diffraction structure, causing a relative movement of the diffraction structure relative to the radiation beam from a first position, wherein the radiation beam does not irradiate the diffraction structure to a second position, wherein the radiation beam irradiates the diffraction structure, measuring, with a radiation detector, diffracted radiation signals produced from a diffraction of the radiation beam by the diffraction structure as the diffraction structure transitions from the first position to the second position or vice versa, and determining an intensity profile of the radiation beam based on the measured diffracted radiation signals.

An illumination optical system for projection lithography includes a pupil facet mirror having pupil facets. For at least some of the pupil facets which are designed as selectively reflecting pupil facets, the selectively reflecting pupil facet has a reflective coating for the illumination light, wherein a first coating area on a first part of the selectively reflecting pupil facet has a first reflectivity, a second coating area on a second part of the selectively reflecting pupil facet has a second reflectivity, the first coating area is different from the second coating area, and the first reflectivity is different from the second reflectivity. In combination or as an alternative, for at least some of the pupil facets which are designed as broadbands reflecting pupil facets, the broadband reflecting facets have a broadband reflective coating for the illumination light.

The present invention is directed to adjusting a light intensity distribution on an irradiation target surface into a desired distribution with use of a light source apparatus including a light emitting diode (LED) array. A light source apparatus includes an LED array including a plurality of LED chips, and a controller configured to control the plurality of LED chips. A light intensity distribution acquired from each of the plurality of LED chips is superimposed on a light intensity distribution oriented in a different direction from each other on a predetermined surface. The controller controls an output of at least one of the plurality of LED chips, thereby changing the light intensity distribution that the plurality of LED chips forms on the predetermined surface.

The present application provides a detecting method for manufacturing process of a semiconductor. Using a same photomask to expose different regions of a same wafer under different lighting conditions to acquire a plurality of photoetching patterns; and detecting the photoetching pattern. Detection results under the different lighting conditions can be acquired on the same wafer at the same time, thereby shortening detection time, improving production efficiency, and saving costs.

A laser radiation system according to a viewpoint of the present disclosure includes a first optical system configured to convert a first laser flux into a second laser flux, a multimirror device including mirrors, configured to be capable of controlling the angle of the attitude of each of the mirrors, and configured to divide the second laser flux into laser fluxes and reflect the laser fluxes in directions to produce the divided laser fluxes, a Fourier transform optical system configured to focus the divided laser fluxes, and a control section configured to control the angle of the attitude of each of the mirrors in such a way that the Fourier transform optical system superimposes the laser fluxes, which are divided by the mirrors separate from each other by at least a spatial coherence length of the second laser flux, on one another.

The present disclosure relates to a lithography scanner including: a light source configured to emit extreme ultra-violet (EUV) light; a pellicle including an EUV transmissive membrane that is configured to scatter the EUV light into an elliptical scattering pattern having a first major axis; a reticle configured to reflect the scattered EUV light through the pellicle; and an imaging system configured to project a portion of the reflected light that enters an acceptance cone of the imaging system onto a target wafer, wherein a cross section of the acceptance cone has a second major axis, and wherein the pellicle is arranged such that the first major axis is oriented at an angle relative to the second major axis.

A system (500) includes an illumination system (502), a lens element (506), and a detector (504). The illumination system generates a beam of radiation (510) having a first spatial intensity distribution (800) at a pupil plane (528) and a second spatial intensity distribution (900) at a plane of a target (514). The first spatial intensity distribution comprises an annular intensity profile (802) or an intensity profile corresponding to three or more beams. The lens element focuses the beam onto the target. The second spatial intensity distribution is a conjugate of the first intensity distribution and has an intensity profile corresponding to a central beam (902) and one or more side lobes (904) that are substantially isolated from the central beam. The central beam has a beam diameter of approximately 20 microns or less at the target. The detector receives radiation scattered by the target and generates a measurement signal based on the received radiation.

An exposure apparatus includes an illumination optical system for illuminating an original including a periodic pattern, a projection optical system for forming an image of the original on a substrate, a controller configured to cause light from the illumination optical system to be obliquely incident on the original such that a light intensity distribution which is line-symmetric with respect to a line, passing through an origin of a pupil region of the projection optical system and orthogonal to a periodic direction of the periodic pattern, is formed in the pupil region by diffracted light beams including diffracted light of not lower than 2nd-order from the periodic pattern, and to control exposure of the substrate such that each point in a shot region of the substrate is exposed in not less than two focus states.