Patent classifications
G03F7/70141
Lens adjustment for an edge exposure tool
An edge exposure tool may include a lens adjustment device that is capable of automatically adjusting various parameters of an edge exposure lens to account for changes in operating parameters of the edge exposure tool. In some implementations, the edge exposure tool may also include a controller that is capable of determining edge adjustment parameters for the edge exposure lens and exposure control parameters for the edge exposure tool using techniques such as big data mining, machine learning, and neural network processing. The lens adjustment device and the controller are capable of reducing and/or preventing the performance of the edge exposure tool from drifting out of tolerance, which may maintain the operation performance of the edge exposure tool and reduce the likelihood of wafer scratching, and may reduce the down-time of the edge exposure tool that would otherwise be caused by cleaning and calibration of the edge exposure lens.
FIELD FACET SYSTEM, OPTICAL ARRANGEMENT AND LITHOGRAPHY APPARATUS
A field facet system for a lithography apparatus includes an optical element. The optical element includes a base section having an optically effective surface. The optical element also includes a plurality of lever sections provided at a rear side of the base section facing away from the optically effective surface. In addition, the field facet system includes two or more actuating elements configured, with the aid of the lever sections acting as levers, to apply in each case a bending moment to the base section to elastically deform the base section and thus to alter a radius of curvature of the optically effective surface. The actuating elements are arranged in series as viewed along a length direction of the optical element.
DETERMINING SUBSET OF COMPONENTS OF AN OPTICAL CHARACTERISTIC OF PATTERNING APPARATUS
A method for determining a component of optical characteristic of a patterning process. The method includes obtaining (i) a plurality of desired features, (ii) a plurality of simulated features based on the plurality of desired features and an optical characteristic of a patterning apparatus, and (iii) a performance metric (e.g., EPE) related to a desired feature of the plurality of desired features and an associated simulated feature of the plurality of simulated features; determining a set of optical sensitivities of the patterning process by computing a change in value of the performance metric based on a change in value of the optical characteristic; and identifying, based on the set of optical sensitivities, a set of components (e.g., principal components) of the optical characteristic that include dominant contributors in changing the value of the performance metric.
METHOD FOR GENERATING A MATHEMATICAL MODEL FOR POSITIONING INDIVIDUAL MIRRORS OF A FACET MIRROR IN AN OPTICAL SYSTEM
A method for generating a mathematical model (MM) for positioning individual mirrors (204, 204′) of a facet mirror (200) in an optical system (500), e.g. in a lithography apparatus (100A, 100B). The method includes: a) providing (S701) target positions (SP) of the individual mirrors (204, 204′) with an adjustment unit (502), b) capturing (S702) actual measurement positions (MI) of the individual mirrors (204, 204′) with a measuring device (508), which is embodied as an interferometer, deflectometer and/or camera, and c) generating (S705) a mathematical model (MM) for positioning the individual mirrors (204, 204′) based on the captured actual measurement positions (MI) and the target positions (SP). In step c ), a difference (EA) is formed (S703) between a respective actual measurement position (MI) and a respective target position (SP) and the mathematical model (MM) is generated (S705) based on the difference (EA) formed.
METHOD OF FABRICATING RETICLE
A method includes receiving a device design layout and a scribe line design layout surrounding the device design layout. The device design layout and the scribe line design layout are rotated in different directions. An optical proximity correction (OPC) process is performed on the rotated device design layout and the rotated scribe line design layout. A reticle includes the device design layout and the scribe line design layout is formed after performing the OPC process.
METHOD FOR REPLACING A MIRROR IN A PROJECTION EXPOSURE APPARATUS, AND POSITION- AND ORIENTATION DATA MEASURING DEVICE FOR CARRYING OUT THE METHOD
When replacing a mirror in a projection exposure apparatus, a mirror for replacement is initially removed (41). Position- and orientation data of the removed mirror for replacement are measured (43) by a position-and orientation data measuring device. Furthermore, position- and orientation data of a replacement mirror, to be inserted in place of the mirror for replacement, are measured (46) using the position- and orientation data measuring device. Bearing points of the replacement mirror are reworked (48) on the basis of ascertained differences between, firstly, the position- and orientation data of the mirror for replacement and, secondly, the position- and orientation data of the replacement mirror. The reworked replacement mirror is installed (54). This yields a mirror replacement method, in which an adjustment outlay of the replacement mirror in the projection exposure apparatus is reduced.
ACTUATOR DEVICE FOR ALIGNING AN ELEMENT, PROJECTION EXPOSURE APPARATUS FOR SEMICONDUCTOR LITHOGRAPHY, AND METHOD FOR ALIGNING AN ELEMENT
An actuator device for aligning an element includes at least one first actuator unit, which is secured to a support structure, for a first setting range and a second actuator unit, which is able to be secured to the element, for a second setting range. The second actuator unit is connected to an output element of the first actuator unit so that the positioning of the second actuator unit is adjustable by an adjustment of the output element. The first actuator unit has an adjusting element and a fixing element, which is able to be secured to the support structure. The fixing element secures the output element in a force-locking manner in an operating state of the element. The fixing element is furthermore configured to release the force-locking connection in a setting state of the element to enable an adjustment of the output element via the adjusting element.
Exposure apparatus and exposure method
An exposure apparatus 10 includes an optical pickup 12 configured to emit laser light and being capable of adjusting the focus of the laser light, a control computing unit 16 configured to adjust the focus of the laser light, an auxiliary stage 21 having the light source unit 12 set thereon, the position of the auxiliary stage 21 being adjustable in the direction toward the master 1, an auxiliary stage control unit 25 configured to control the position of the auxiliary stage 21, wherein the optical pickup 12 includes an object lens 124 configured to direct the laser light to the master 1, a VCM actuator 125 configured to displace the object lens 124 in accordance with a drive current, and the auxiliary stage control unit 25 controls the position of the auxiliary stage 21 in accordance with the drive current for the VCM actuator 125.
Method for producing an illumination system for an EUV projection exposure system, and illumination system
The disclosure relates to a method for producing an illumination system for an EUV apparatus in and to an illumination system for an EUV apparatus.
Assembly for Use in Semiconductor Photolithography and Method of Manufacturing Same
An optical assembly and a method of making an optical assembly in which additive manufacturing techniques are used to form a support structure either directly on an optical element or on a carrier that is subsequently bonded to an optical element.