Methods for receiving a high-energy EUV beam and distributing EUV sub-beams to photolithography scanners and the resulting device are disclosed. Embodiments include receiving a high-energy primary EUV beam at a primary splitting optical assembly; splitting the primary EUV beam into primary EUV sub-beams; reflecting the primary EUV sub-beams to beam-splitting optical arrays; splitting the primary EUV sub-beams into secondary EUV sub-beams; reflecting the secondary EUV sub-beams to EUV distribution optical arrays; and distributing simultaneously the secondary EUV sub-beams to scanners.

An apparatus provides sensor data from at least one sensor of an optical system of a lithography apparatus. The apparatus comprises an analogue-to-digital converter and a digital filter device connected downstream of the analogue-to-digital converter. The analogue-to-digital converter is configured to convert an analogue signal sequence, which is provided via a number N of channels and includes a number N of analogue sensor signals from the number N of sensors of the optical system, into a digital signal sequence including N digital sensor signals. The analogue-to-digital converter and the digital filter device have the same frequency-synchronized system clock. The digital filter device is configured to filter the N digital sensor signals of the digital signal sequence in a channel-specific manner for providing and storing a respective filtered digital sensor signal for each of the N channels.

A device and a method for regulating and controlling an incident angle of a light beam in a laser interference lithography process are disclosed. The device comprises: a beam splitter prism between a first lens and a second lens, a first position detector, a first decoupling lens between the first position detector and the beam splitter prism, a feedback control system connected to the first position detector and a first universal reflecting mirror. The beam splitter prism reflects first incident light passing through the first universal reflecting mirror, the first decoupling lens enables a first reflected light enter into the first position detector, the first position detector measures the light beam position, the feedback control system outputs a control command according to the measurement result to regulate a mirror base of the first universal reflecting mirror, thereby regulating and controlling an incident angle of an exposure light beam.

An exposure device includes: a spatial light modulation element including micromirrors; an illumination unit that irradiates the spatial light modulation element with first light with a peak wavelength 1 and second light with a peak wavelength 2 (21), so that the first light is diffracted by ON-state micromirrors of the spatial light modulation element as first diffraction light and the second light is diffracted by the ON-state micromirror as second diffraction light; and a projection unit, wherein the first diffraction light and the second diffraction light enter the projection unit, so that the first diffraction light and the second diffraction light are distributed with an optical axis of the projection unit interposed therebetween.

There is provided an illumination optical system including: a light source; a fly-eye lens; and a condenser lens. The light source includes: a first light emitter configured to emit a first light flux; and a second light emitter configured to emit a second light flux. The light source is configured to selectively emit the first light flux or the second light flux. The second light emitter is configured such that a shape of a cross section of the second light flux at an incidence surface of the fly-eye lens is different from a shape of a cross section of the first light flux at the incidence surface, or that a dimension of the cross section of the second light flux at the incidence surface is different from a dimension of the cross section of the first light flux at the incidence surface.

Systems, apparatuses, and methods are provided for heating a plurality of optical components. An example method can include receiving an input radiation beam from a radiation source. The example method can further include generating a plurality of output radiation beams based on the input radiation beam. The example method can further include transmitting the plurality of output radiation beams towards a plurality of heater head optics configured to heat the plurality of optical components. Optionally, the example method can further include controlling a respective power value, and realizing a flat-top far-field profile, of each of the plurality of output radiation beams.

The present invention relates to photohardenable compositions and methods of forming an object, the method preferably including a photohardenable composition described herein. Preferred photohardenable compositions and methods include a photohardenable resin component, a first photoinitiator that is activatable by exposure to light at a first wavelength and light at a second wavelength, and a second photoinitiator that is activatable by exposure to light at a third wavelength, wherein the first, second, and third wavelengths are not the same, and the third wavelength is shorter than the first wavelength and the second wavelength. Preferred first photoinitators include photoswitchable photoinitiators. Preferably the second light-activated photoinitiator comprises a free-radical photoinitiator. Hardenable resin compositions and methods of forming an object including the hardenable resin composition are also disclosed.

Embodiments of the present disclosure include a lithography apparatus, patterning system, and method of patterning a layered structure. The patterning system includes an image formation device and a reactive layer. The patterning system allows for creating lithography patterns in a single operation. The lithography apparatus includes the patterning system and an optical system. The lithography apparatus uses a plurality of wavelengths of light, along with the image formation device, to create a plurality of color patterns on the reactive layer. The method of patterning includes exposing the reactive layer to a plurality of wavelengths of light. The light reacts differently with different regions of the reactive layer, depending on the wavelength of light emitted onto the different regions. The method and apparatuses disclosed herein require only one image formation device and one lithography operation.