Disclosed is a projection system for a lithographic apparatus, comprising: a plurality of optical elements configured to direct a beam along a path, and a control system configured to receive an input signal indicative of a deformation of a first optical element of the plurality of optical elements. The plurality of optical elements may be configured to position the beam onto an object arranged on an object support, and a pattern may be imparted on the beam by a patterning device arranged on support structure. The control system is configured to generate an output signal for controlling a position of at least a second optical element of the plurality of optical elements, based on said input signal; and/or an output signal for controlling a position of said object support, based on said input signal; and/or an output signal for controlling a position of said support structure, based on said input signal.

Devices, systems, and/or methodologies are provided for three dimensional printing, for example, additive manufacturing, wherein an array of energy patterning (e.g., light patterning) modules are used in conjunction with an automated positional control system to coordinate implementation of patterning modules of the array. Implementation of the array can be controlled by a sensory feed-back.

A method for determining a component of optical characteristic of a patterning process. The method includes obtaining (i) a plurality of desired features, (ii) a plurality of simulated features based on the plurality of desired features and an optical characteristic of a patterning apparatus, and (iii) a performance metric (e.g., EPE) related to a desired feature of the plurality of desired features and an associated simulated feature of the plurality of simulated features; determining a set of optical sensitivities of the patterning process by computing a change in value of the performance metric based on a change in value of the optical characteristic; and identifying, based on the set of optical sensitivities, a set of components (e.g., principal components) of the optical characteristic that include dominant contributors in changing the value of the performance metric.

A measuring system (MS) configured to measure a projection radiation property representing an aberration level at a plurality of spaced apart measuring points distributed in the image field; and an operating control system with at least one manipulator operatively connected to an optical element of a projection exposure system to modify imaging properties of the projection exposure system based on measurement results generated by the measuring system. In a measuring point distribution calculation (MPDC), a measuring point distribution defining a number and positions of measuring points is used. The MPDC is performed under boundary conditions representing at least: (i) manipulation capacities of the operating control system; (ii) measuring capacities of the measuring system; and (iii) predefined use case scenarios defining a set of representative use cases. Each use case corresponds to a specific aberration pattern generated by the projection exposure system under a predefined set of use conditions.

A projection exposure apparatus (10) includes a mask mark illumination light source (21) capable of irradiating a mask mark (MM) with exposure light itself or a first alignment light (L1) having substantially the same wavelength as the exposure light, and an alignment unit (30) having a work mark illumination light source (31) capable of irradiating a work mark (WM) with second alignment light (L2) having a wavelength different from the wavelength of the exposure light, an imaging device (32), and an imaging optical system (40). The imaging optical system (40) includes a first dichroic prism (41) for synthesizing the first alignment light (L1) and the light from the work mark (WM) and emitting the synthesized light toward the imaging device (32), and an optical path length changing optical system (42) for splitting and merging the first alignment light (L1), in which the optical positional relationships of the work mark (WM) and the image (MMI) of the mask mark (MM) with respect to the imaging device (32) are equivalent. Accordingly, it is possible to provide a projection exposure apparatus and a projection exposure method that allow high-precision alignment even in a small-sized exposure area.

Provided for herein is a device that includes a first base support rotatable about a first rotational axis perpendicular to a rest surface of the first base support; a second base support arranged on the first base support and rotatable about a second rotational axis perpendicular to the rest surface of the first base support; at least one third base support arranged on the second base support and rotatable about a third rotational axis perpendicular to the rest surface of the first base support; and a supporting element is arranged on the third base support and including a holding surface for holding at least one optical element, the holding surface being rotatable about a rotational axis perpendicular to the holding surface.

A method includes: a) measuring individual parts K1-KN of an optical system to provide measurement data, N being greater than one; b) using the measurement data to virtualize the individual parts K1-KN and using the virtualized individual parts K1-KN to generate an actual assembly model by geometrically stringing together a plurality of the virtualized individual parts K1-KN, the actual assembly model comprising virtual actual positions of the virtualized individual parts K1-KN in a virtually assembled state; c) using the actual assembly model and a target assembly model to determine a correction measure, the target assembly model comprising virtual target positions of one or more of the virtualized individual parts K1-KN in the virtually assembled state; and d) using the correction measure, assembling the individual parts K1-KN to form the optical system.

A method adjusts a first element of a lithography apparatus toward a second element of the lithography apparatus via a tunable spacer which is arranged between the first element and the second element. The method includes: determining an actual location of the first element; determining a nominal location of the first element; unloading the tunable spacer; adjusting a height of the tunable spacer to bring the first element from the actual location to the nominal location; and loading the tunable spacer.

The present application provides a dynamic illumination method based on a scan exposure machine, providing a mask used for exposure and a GDS file corresponding to the mask; dividing pattern information on the mask into n areas with the same width along the direction of movement of the mask during the exposure; performing SMO computation on the pattern information in the n areas, so as to generate n SMO files corresponding to the n areas respectively; performing combinatorial optimization on the n SMO files to obtain a DSMO file; generating a driver of a light source reflector array according to the DSMO file, the illumination; and controlling a reflector array of an exposure machine by calling the driver of the light source reflector array. The DSMO method is performed in each exposure slit area, so as to improve the illumination optimization for a pattern.

A method for determining an intra-field correction for control of a lithographic apparatus configured for exposing a pattern on an exposure field of a substrate, the method includes: obtaining metrology data for use in determining the intra-field correction; determining an accuracy metric indicating a lower accuracy where the metrology data is not reliable and/or where the lithographic apparatus is limited in actuating a potential actuation input which is based on the metrology data; and determining the intra-field correction based at least partially on the accuracy metric.