G03F7/70358

Control apparatus, exposure apparatus, and method of manufacturing article
11630398 · 2023-04-18 · ·

The present invention provides a control apparatus for performing synchronous control to synchronize driving of a second moving member so as to follow driving of a first moving member, including a feedforward control system that includes a calculator configured to obtain an input/output response of the second moving member and position deviations of the first moving member and the second moving member while driving the first moving member and the second moving member in synchronism with each other, and calculate a feedforward manipulated variable based on the input/output response of the second moving member and the synchronous error between the first moving member and the second moving member obtained from the position deviations of the first moving member and the second moving member.

Lithographic method

A method of predicting deflection of a pellicle which will occur during movement of the pellicle in a lithographic apparatus, the method including receiving parameters regarding properties of the pellicle and receiving parameters regarding the expected movement of the pellicle. The parameters are applied to a model which predicts deflection of the pellicle as a function of those parameters. The model includes a plurality of sub-models which relate to different components of deflection of the pellicle. An output of the model may be used to predict.

Exposure Device
20230136440 · 2023-05-04 ·

Provided is an exposure device capable of improving exposure accuracy while ensuring throughput. The exposure device 100 includes: a reflective liquid-crystal modulating device 21, 22; a light source device 10 uniformly illuminating the reflective liquid-crystal modulating device 21, 22 with power-stabilized pulsed laser light in a ultraviolet wavelength band; a projection optical system 30 forming an image of reflected light modulated by the reflective liquid-crystal modulating device 21, 22; and a stage 40 supporting a target on which exposure is performed by a pattern imaged by the projection optical system 30.

Method of manufacturing photo masks

In a method of manufacturing a photo mask for lithography, circuit pattern data are acquired. A pattern density, which is a total pattern area per predetermined area, is calculated from the circuit pattern data. Dummy pattern data for areas having pattern density less than a threshold density are generated. Mask drawing data is generated from the circuit pattern data and the dummy pattern data. By using an electron beam from an electron beam lithography apparatus, patterns are drawn according to the mask drawing data on a resist layer formed on a mask blank substrate. The drawn resist layer is developed using a developing solution. Dummy patterns included in the dummy pattern data are not printed as a photo mask pattern when the resist layer is exposed with the electron beam and is developed.

DISPLAY DEVICE

The invention provides a display device that allows formation of the boundary of exposure at an arbitrary position on its substrate. A display device includes: a display area; a terminal; and a wire formed between the display area and the terminal and connected to the terminal. The wire includes a first part, a second part, and a third part. The first part extends in a first direction. The second part and the third part extend in a direction different from the first direction. The first part is located between the second and third parts and includes a protruding portion protruding in a second direction perpendicular to the first direction.

Light source apparatus and data processing method

A light source apparatus according to an embodiment may be used for an exposure apparatus which exposes a plurality of wafers by repeating a wafer exposure for exposing a total exposure area of each wafer. The wafer exposure may include a sequential execution of scanning exposures in which each divided area defined by dividing the total exposure area of each wafer is scanned by pulsed light. The apparatus may comprise: a light source controller configured to execute a control for outputting the pulsed light based on a luminescence trigger signal received from the exposure apparatus; a detector configured to detect a characteristic of the pulsed light; and a data collection processor configured to collect at least a piece of data in data included in a pulse light data group related to the pulsed light detected by the detector and a control data group related to the control, and execute a mapping process of mapping the collected data by at least one of scanning exposure basis and wafer exposure basis.

Method and apparatus for illuminating image points

A method for the exposure of image points of a photosensitive layer comprising a photosensitive material on a substrate by means of an optical system. The method including continuously moving the image points with respect to the optical system; and controlling a plurality of secondary beams by means of the optical system individually for individual exposures of each image point, whereby the secondary beams are put either into an ON state or into an OFF state, wherein a) secondary beams in the ON state produce an individual exposure of the image point assigned to the respective secondary beam and b) secondary beams in the OFF state do not produce any individual exposure of the image point assigned to the respective secondary beam; wherein, for the generation of image points with grey tones n>1, individual exposures are carried out by different secondary beams with individual doses D.

Lithographic method and lithographic apparatus

A method includes exposing number of fields on a substrate, obtaining data about a field and correcting exposure of the field in subsequent exposures. The method includes defining one or more sub-fields of the field based on the obtained data. Data relating to each sub-field is processed to produce sub-field correction information. A subsequent exposure of the one or more sub-fields is corrected using the sub-field correction information. By controlling a lithographic apparatus by reference to data of a particular sub-field within a field, overlay error can be reduced or minimized for a critical feature, rather than being averaged over the whole field. By controlling a lithographic apparatus with reference to a sub-field rather than only the whole field, a residual error can be reduced in each sub-field.

DIVISIONAL EXOPSURE APPARATUS AND METHOD OF MANUFACTURING LIQUID CRYSTAL DISPLAY USING THE SAME
20170315451 · 2017-11-02 · ·

Disclosed are a divisional exposure apparatus which allows for forming a PAC layer uniformly on RGBW subpixels by a single mask process, using divisional exposure, in a large-size liquid crystal display with a COT structure, and a method of manufacturing a liquid crystal display using the same. To this end, the sum of illumination intensities at the center of an overlap region is controlled in the range of 120% to 130%, and gradually increases from 100% at the edge (boundary) of the overlap region. Accordingly, the cell gap between the RGB subpixels and the W subpixel is made uniform, thus preventing the problem of spots.

LITHOGRAPHIC PATTERNING METHOD AND SYSTEM THEREFORE

Lithographic patterning method for creating features on a surface of a substrate, including the steps of: applying a resist material to the surface; performing resist processing steps, including at least: selectively exposing the resist material layer to a surface treatment step, wherein the resist material in the exposed locations is chemically modified; and developing the resist material layer to selectively remove the resist material locally. The method further comprises detecting, during or after the resist processing steps, a chemical modification of the resist material for monitoring or evaluating the processing steps. The step of detecting is performed by scanning the surface using a scanning probe microscopy device, and wherein the scanning includes contacting the surface with the probe tip in a probing area. The probing area coincides with at least one location of the exposed locations and non-exposed locations, for detecting the chemical modification. The document further describes a system.