A digital lithography system includes scan regions including a first scan region and a second scan region adjacent to the first scan region. The digital lithography system further includes exposure units located above the scan regions, a memory, and at least one processing device operatively coupled to the memory. The exposure units include a first exposure unit associated with the first scan region and a second exposure unit associated with the second scan region. The processing device is to perform operations including initiating a digital lithography process to pattern a substrate disposed on the stage in accordance with instructions, and performing exposure unit boundary smoothing with respect to the first and second exposure units during the digital lithography process.

A digital lithography system includes adjacent scan regions, exposure units located above the scan regions, a memory, and a processing device operatively coupled to the memory. The exposure units include a first exposure unit associated with a first scan region and a second exposure unit associated with a second scan region. The processing device is to initiate a digital lithography process to pattern a substrate disposed on a stage in accordance with instructions. The processing device is to further perform a first pass of the first exposure unit over a stitching region at an interface of the first scan region and the second scan region at a first time. The processing device is to further perform a second pass of the second exposure unit over the stitching region at a second time that varies from the first time by less than forty seconds.

A sensor fabricated from a plurality of layers on a semiconductor wafer. The sensor comprises a plurality of sensor elements arranged in stitching blocks and having a plurality of vertically arranged read-out lines, a plurality of vertically arranged select/reset lines, and a plurality of horizontally arranged select/reset lines, running from a right-hand edge to an oppositely disposed left hand edge and being connected to ones of the plurality of vertically arranged select/reset lines, plurality of read-out circuits connected to the plurality of vertically arranged read-out lines, and ones of the plurality of vertically arranged read-out lines swerve at one of the bottom or top edges of the stitching blocks, such that ones of the plurality of vertically arranged read-out lines in a first one of the plurality of stitching blocks connect to a displaced one of the vertical lines in a second abutting one of the plurality of stitching blocks.

A method of manufacture of objects including receiving a CAD file containing electrical circuit design data for direct writing on a surface, the CAD file including CAD data for a multiplicity of objects to be produced on the surface, automatically configuring a direct write machine to direct write direct writing data based on the CAD data on the surface in plural scans, each having a scan width less than a width of the surface, including arranging the direct writing data for the multiplicity of objects to be written in a side by side manner in each of the plural scans so as to be within the scan width, whereby stitching of direct writing data between adjacent scans is obviated and operating the direct write machine to create the multiplicity of objects on the surface.

Disclosed herein an exposure apparatus capable of implementing a microfabrication onto a work with a higher throughput and a lower cost. The exposure apparatus generates interfering light by crossing two or more branched light beams branched from output light from a coherent light source at a predetermined interfering angle, and exposes the substrate by repeating an irradiation onto the substrate with the interfering light and a conveyance of the substrate. At this moment, the exposure apparatus shapes in interfering light irradiation region on the substrate onto which the interfering light is irradiated into a predetermined shape. Then, the exposure apparatus disposes a plurality of the interfering light irradiation regions in successive shots to be located adjacent to each other on the substrate in a direction of conveying the substrate without the interfering light irradiation regions being overlapped when exposing the substrate while conveying the substrate in a stepwise manner.

In an exposure apparatus, on a substrate holder, a plurality of grating areas is arranged mutually apart in the X-axis direction, and a plurality of heads that irradiates a measurement beam with respect to the grating area and can move in the Y-axis direction is arranged outside of the substrate holder. A control system controls movement of the substrate holder in at least directions of three degrees of freedom within an XY plane, based on measurement information of at least three heads of the plurality of heads facing the grating area and measurement information of a measurement device that measures position information of the plurality of heads. The measurement beam of each of the plurality of heads, during the movement of substrate holder in the X-axis direction, moves off of one of the plurality of grating areas and switches to another adjacent grating area.

A method of semiconductor metrology includes patterning a film layer on a semiconductor substrate to define a first field on the semiconductor substrate with a first pattern comprising at least a first target feature within a first margin along a first edge of the first field and to define a second field, which abuts the first field, with a second pattern comprising at least a second target feature within a second margin along a second edge of the second field, such that the second edge of the second field adjoins the first edge of the first field. The first target feature in the first margin is adjacent to the second target feature in the second margin without overlapping the second target feature. An image is captured of at least the first and second target features and is processed to detect a misalignment between the first and second fields.

A photomask (2) for optical alignment and an optical alignment method. By aligning the tail ends of first light-transmission patterns (313) which form a first photomask figure (3), and aligning the front ends of second light-transmission patterns (413), which form a second photomask figure (4) in the photomask (2), the un-exposed or underexposed areas do not exist at the tail ends of first substrate units (11) and the front end of second substrate units (12) during the process of optical alignment, thereby the problem existed in the traditional optical alignment manufacture process, that the brightness of a display is not uniform due to existing unexposed or underexposed areas, is solved, meanwhile, the reduction of the distance between the first substrate units (11) and the second substrate units (12) on a substrate is facilitated, thereby the utilization rate of the substrate is improved.

A touch panel includes a substrate, a touch driving electrode disposed on the substrate, and a touch sensing electrode disposed on the substrate, at least one of the touch driving electrode and the touch sensing electrode has a metal mesh-like structure including nodes, each node includes a first protruding structure and a second protruding structure distributed on both sides of a mesh bar, and the first protruding structure and the second protruding structure are arranged in a staggered manner along an extension direction of the mesh bar. The mesh-like structure includes a first mesh bar and a second mesh bar directly connected to both ends of the node respectively, and a center line of the first mesh bar does not coincide with a center line of the second mesh bar.

An exposure device is disclosed, including: a light source (1), an illumination module (2), a mask stage (5), a projection objective module, an imaging position adjustment module (4) and a wafer stage (6), disposed sequentially along a direction of light propagation, the imaging position adjustment module (4) including a plurality of adjustment elements (410) arranged individually, the projection objective module including a plurality of projection objectives (3) each having an FoV in positional correspondence with a respective one of the plurality of adjustment elements (410). The imaging position adjustment module (4) ensures satisfactory imaging quality and FoV stitching quality of the projection objectives (3) by performing translation, magnification, focal plane and other adjustments on an image formed by the projection objective module. The projection objective module is simpler as it does not contain any component or mechanism for imaging position adjustment.