An apparatus comprising: a position monitoring system configured to determine the position of the substrate with respect to a projection system configured to project a radiation beam through an opening in the projection system and onto a substrate, wherein a component of the position monitoring system is located beneath the projection system in use; and a baffle disposed between the opening and the component.

The present invention provides an exposure apparatus for performing scanning exposure on each of a plurality of shot regions in a substrate, comprising: a stage configured to hold the substrate; a driver configured to drive the stage; and a controller configured to control the scanning exposure on each of the plurality of shot regions while controlling the driver in accordance with a driving profile, wherein the driving profile includes a first section in which the stage is driven at a constant acceleration in a first direction, a second section in which the stage is driven at a constant acceleration in a second direction opposite to the first direction, and a connection section connecting the first section and the second section, and a period in which the scanning exposure is performed includes at least a part of the connection section.

An imprint lithography apparatus having a first frame to be mounted on a floor, a second frame mounted on the first frame via a kinematic coupling, an alignment sensor mounted on the second frame, to align an imprint lithography template arrangement with a target portion of a substrate, and a position sensor to measure a position of the imprint lithography template arrangement and/or a substrate stage relative to the second frame.

The present disclosure relates to apparatus and methods for performing maskless lithography processes. A substrate rocessing apparatus includes a slab with a plurality of guiderails coupled to and extending along the slab. A first shuttle is disposed on the plurality of guiderails, a second shuttle is disposed on the first shuttle, and a metrology bar is coupled to the second shuttle. The etrology bar includes a first plurality of sensors coupled to the metrology bar. A second plurality of sensors coupled to the metrology bar are disposed laterally inward of the first plurality of sensors.

A self-calibrating overlay metrology system may receive device overlay data for a device targets on a sample from an overlay metrology tool, determine preliminary device overlay measurements for the device targets including device-scale features using an overlay recipe with the device overlay data as inputs, receive assist overlay data for one or more assist targets on the sample including device-scale features from the overlay metrology tool, where at least one of the one or more assist targets has a programmed overlay offset of a selected value along a particular measurement direction, determine self-calibrating assist overlay measurements for the one or more assist targets based on the assist overlay data, where the self-calibrating assist overlay measurements are linearly proportional to overlay on the sample, and generate corrected overlay measurements for the device targets by adjusting the preliminary device overlay measurements based on the self-calibrating assist overlay measurements.

Embodiments of the present disclosure provide a device for adjusting a wafer, a reaction chamber, and a method for adjusting a wafer. The device for adjusting a wafer includes: a lifting module, the lifting module including a first carrier surface configured to carry a wafer, and the first carrier surface ascending to a preset highest position or descending to a preset lowest position relative to a reference surface; a carrier module, the carrier module including a second carrier surface, a position of the second carrier surface being higher than the preset lowest position and being lower than the preset highest position, and the second carrier surface being configured to receive and carry the wafer carried on the first carrier surface; and a suction module, the suction module including a first suction opening facing the wafer and surrounded by the second carrier surface.

A method of forming patterned features on a substrate is provided. The method includes positioning a plurality of masks arranged in a mask layout over a substrate. The substrate is positioned in a first plane and the plurality of masks are positioned in a second plane, the plurality of masks in the mask layout have edges that each extend parallel to the first plane and parallel or perpendicular to an alignment feature on the substrate, the substrate includes a plurality of areas configured to be patterned by energy directed through the masks arranged in the mask layout. The method further includes directing energy towards the plurality of areas through the plurality of masks arranged in the mask layout over the substrate to form a plurality of patterned features in each of the plurality of areas.

A control apparatus for controlling a controlled object includes a measuring device configured to measure a state of the controlled object, and a controller configured to generate a manipulated variable corresponding to an output of the measuring device and a target value. The controller includes a compensator configured to output an index corresponding to the output of the measuring device and the target value, and a converter configured to convert the index into the manipulated variable such that a probability at which a predetermined manipulated variable is generated is a target probability.

An exposure apparatus that exposes a substrate to light by using an original in which a pattern is formed includes an illumination optical system arranged to guide illumination light to the original, the illumination light including first illumination light with a first wavelength and second illumination light with a second wavelength different from the first wavelength, and a projection optical system arranged to form a pattern image of the original by using the illumination light at a plurality of positions in an optical axis direction. The illumination optical system is configured to adjust a position deviation in a direction perpendicular to the optical axis direction between a pattern image formed by the first illumination light and a pattern image formed by the second illumination light by changing an incident angle of the illumination light entering the original.

An actuator comprises a coil, a first cooling plate and a second cooling plate. The cooling plates are configured to cool the coil. The first and second cooling plates are arranged at opposite sides of the coil to be in thermal contact with the coil. The coil comprises a first coil part and a second coil part, the first coil part facing the first cooling plate and the second coil part facing the second cooling plate, the first and second coil parts being separated by a spacing there between. The first cooling plate, the first coil part, the spacing, the second coil part and the second cooling plate form a stacked structure whereby the coil parts are arranged between the cooling plates and the spacing is arranged between the coil parts. The actuator further comprises a filling element arranged in the spacing. The filling element to push the first coil part towards the first cooling plate and to push the second coil part towards the second cooling plate.