A substrate holder including: a main body having a main body surface; a plurality of burls projecting from the main body surface and configured for supporting the substrate; and an edge seal projecting from the main body surface, wherein: the edge seal is spaced apart from the plurality of burls so as to define a gap therebetween, the gap having a width greater than or equal to about 75% of a pitch of the plurality of burls; the plurality of burls includes a first group of burls and a second group of burls surrounding the first group of burls; and the stiffness in the direction perpendicular to the support plane per unit area of the second group of burls is greater than or equal to about 150% of the stiffness in the direction perpendicular to the support plane per unit area of the first group of burls.

A method for correcting values of one or more feed-forward parameters used in a process of patterning substrates, the method including: obtaining measured overlay and/or alignment error data of a patterned substrate; and calculating one or more correction values for the one or more feed-forward parameters in dependence on the measured overlay and/or alignment error data.

Methods and apparatuses for determining a position of an alignment mark applied to a region of a first layer on a substrate using a lithographic process by: obtaining an expected position of the alignment mark; obtaining a geometrical deformation of the region due to a control action correcting the lithographic process; obtaining a translation of the alignment mark due to the geometrical deformation; and determining the position of the alignment mark based on the expected position and the translation.

Methods and apparatuses for determining in-plane distortion (IPD) across a substrate having a plurality of patterned regions. A method includes obtaining intra-region data indicative of a local stress distribution across one of the plurality of patterned regions; determining, based on the intra-region data, inter-region data indicative of a global stress distribution across the substrate; and determining, based on the inter-region data, the IPD across the substrate.

A method for fabricating a wafer includes providing a wafer table, wherein the wafer table includes support pins that are movable with respect to each other; identifying features of a layer to be formed on a wafer, wherein the features have a tolerance for overlay errors below a threshold; moving one or more support pins based on the features; after the moving of the one or more support pins, mounting the wafer on the wafer table; and after the mounting of the wafer on the wafer table, forming the layer on the wafer.

A substrate table for supporting a substrate includes a surface and coarse burls. Each of the coarse burls includes a burl-top surface and fine burls. The coarse burls are disposed on the surface of the substrate table. The fine burls are disposed on the burl-top surface. The fine burls contact the substrate when the substrate table supports the substrate.

Apparatus for and method of removing a contaminant from a working surface of a lithography support such as a reticle or wafer stage in an EUV or a DUV photolithography system in which abase supporting the substrate is provided with a surface profile so as to be thicker towards a middle portion of the base so that when a substrate supported by the base is pressed between the working surface and the base the contaminant is transferred from the working surface to the substrate.

Various burl designs for holding an object in a lithographic apparatus are described. A lithographic apparatus includes an illumination system, a first support structure, a second support structure, and a projection system. The illumination system is designed to receive radiation and to direct the radiation towards a patterning device that forms patterned radiation. The first support structure is designed to support the patterning device on the first support structure. The second support structure has a plurality of burls and is designed to support the substrate on the plurality of burls. A topography of a top surface of each of the plurality of burls is not substantially flat, such that a contact area between the substrate and each of the plurality of burls is reduced. The projection system is designed to receive the patterned radiation and to direct the patterned radiation towards the substrate.

The invention provides a substrate support for supporting a substrate, comprising: a support body, which support body comprises a support surface for supporting the substrate, a rotary dither device, which is configured to induce a relative rotary dither motion between the substrate and the support surface of the support body around a rotation axis which is perpendicular to the support surface.

The invention provides a substrate support arranged to support a substrate, comprising piezo a actuator, further comprising a first pair of electrodes, a second pair of electrodes and a piezo material having a first surface and a second surface. The first surface is arranged along a first direction and second direction. The first pair of electrodes comprises a first electrode arranged on the first surface and a second electrode arranged on the second surface. The second pair of electrodes is arranged to shear the piezo material. The first pair of electrodes is arranged to elongate the piezo material in a third direction perpendicular to the first direction and second direction. The first electrode is divided into at least two parts and is arranged to rotate the first surface and the second surface relatively to each other about the first direction wherein the piezo actuator is arranged to support the substrate.