A liquid crystal exposure apparatus that exposes a substrate with an illumination light via a projection optical system is equipped with: a substrate holder that holds the substrate; a substrate encoder system that includes head units and scales, and acquires the position information of the substrate holder on the basis of the output of the head units; and a drive section that relatively moves one of the head units and the scales on the substrate holder with respect to the other.

A pattern forming apparatus comprising: a rotary drum that includes a cylindrical outer circumferential surface which is curved at a predetermined radius from a predetermined center line, that rotates about the center line in a state in which a part of a sheet substrate is supported in a length direction of the sheet substrate along the outer circumferential surface; a pattern forming part that forms the pattern on the sheet substrate at a first specific position; a scale disk that is fixed to an end portion of the rotary drum in a direction in which the center line extends while being coaxial with the center line and that includes a circular scale; and a first reading mechanism that is arranged to oppose with the scale formed at the outer circumferential surface of the scale disk, that is arranged at substantially same azimuth as an azimuth.

The present disclosure generally relates to a method and apparatus for loading, processing, and unloading substrates. A processing system comprises a load/unload system coupled to a photolithography system. The load/unload system comprises a first set of tracks having a first height and a first width, and a second set of tracks having a second height and a second width different than the first height and first width. An unprocessed substrate is transferred from a lift pin loader to a chuck along the first set of tracks on a first tray while a processed substrate is transferred from the chuck to the lift pin loader along the second set of tracks on a second tray. While a first tray remains with a substrate on the chuck during processing, the load/unload system is configured to unload a processed substrate and load an unprocessed substrate on a second tray.

The present application relates to a film mask comprising: a transparent substrate; a darkened light-shielding pattern layer provided on the transparent substrate; and an embossed pattern part provided on a surface of the transparent substrate, which is provided with the darkened light-shielding pattern layer, a method for manufacturing the same, a method for forming a pattern by using the same, and a pattern formed by using the same.

The present application relates to a film mask including: a transparent substrate; a darkened light-shielding pattern layer provided on the transparent substrate; and a release force enhancement layer provided on the darkened light-shielding pattern layer and having surface energy of 30 dynes/cm or less, a method for manufacturing the same, and a method for forming a pattern using the film mask.

A fiber-type electronic device comprising a pattern for electronic devices stacked on a fiber filament substrate is provided. It is possible to manufacture an electronic device directly on a fiber filament substrate by applying the pattern for electronic devices. Thus, it can be widely used for wearable devices and the like. The pattern for electronic devices is manufactured by a method for forming a pattern for electronic devices comprising an exposure process using a maskless exposure apparatus. Thus, it is possible to manufacture a pattern for electronic devices on a fiber filament substrate through a continuous process and thus to increase the process efficiency.

A substrate stage device of an exposure apparatus is equipped with: a noncontact holder that supports, in a noncontact manner, a first area and at least a partial area of a second area, of a substrate, the second area being arranged side by side with the first area in the Y-axis direction; a substrate carrier that holds the substrate held in a noncontact manner by the noncontact holder, at a position not overlapping the noncontact holder in the X-axis direction; Y linear actuators and Y voice coil motors that relatively move the substrate carrier with respect to the noncontact holder in the Y-axis direction; X voice coil motors that move the substrate carrier in the X-axis direction; and actuators that move the noncontact holder in the X-axis direction.

The present disclosure generally relates to a method and apparatus for loading, processing, and unloading substrates. A processing system comprises a load/unload system coupled to a photolithography system. The load/unload system comprises a first set of tracks having a first height and a first width, and a second set of tracks having a second height and a second width different than the first height and first width. An unprocessed substrate is transferred from a lift pin loader to a chuck along the first set of tracks on a first tray while a processed substrate is transferred from the chuck to the lift pin loader along the second set of tracks on a second tray. While a first tray remains with a substrate on the chuck during processing, the load/unload system is configured to unload a processed substrate and load an unprocessed substrate on a second tray.

A fabrication method of a mask and a mask, a display panel and a touch panel are provided. The fabrication method of the mask includes: providing a substrate; forming a photoresist material layer on the substrate; and performing at least two scanning exposure processes on the photoresist material layer by using a scanning beam, wherein, each of the at least two scanning exposure processes is performed along a first direction parallel to a surface where the substrate is located, the scanning beam in each of the at least two scanning exposure processes scans the photoresist material layer in a scanning region having a preset width, at least one pair of adjacent scanning regions partially overlap with each other, and a partially overlapping region of the at least one pair of adjacent scanning regions is located in a first region of the mask.

A stepper (100) for lithographic processing of semiconductor substrates includes abase (102), a chuck (104) that moves only along an X axis of a coordinate system, a bridge (114) mounted over the base and the chuck, and at least one projection camera (112) mounted on the bridge. The at least one projection camera is movable along a Y axis of the coordinate system. The combined range of travel of the chuck along the X axis and the at least one projection camera along the Y axis is sufficient to address a field of view of the at least one projection camera to substantially an entire substrate (106) mounted on the chuck.