Provided is a lithography apparatus capable of detecting the abnormal holding of an original in a shorter period of time. The lithography apparatus is configured to form a pattern on a substrate through use of the original, and includes: a holding unit configured to hold the original on which a first mark is formed; a measuring unit configured to pick up an image of the first mark; and a control unit configured to: cause the measuring unit to obtain the image of the first mark on the original held by the holding unit with a focus position of the measuring unit being adjusted to a reference position; and determine that the original is being abnormally held by the holding unit when a change in a first contrast, which is a contrast of the image of the first mark with respect to a reference contrast, falls out of an allowable range.

A particle removal device, along with methods of using such, are described. The device includes a handheld module having a body. A first one or more channels and a second one or more channels are formed in the body. The body includes a nozzle, and the handheld module is configured to provide suction by the nozzle and to inject an ionized fluid stream by the nozzle. The body further includes a handle attached to the nozzle.

The present disclosure provides a method for fabricating a semiconductor structure, including disposing a mask at a first position in a first chamber, generating; a first plurality of ions toward the mask by an ionizer, forming a photoresist layer on a substrate, receiving the substrate in the first chamber, and exposing the photoresist layer with actinic radiation through the mask in the first chamber.

A system including: a substrate support configured to hold a substrate; a conductive or semi-conductive element contacting the substrate support and covering at least part of the substrate support; and a charging device configured to apply a positive potential to the conductive or semi-conductive element with respect to the part of the substrate support that is covered by the conductive or semi-conductive element.

A mirror, in particular for a microlithographic projection exposure apparatus or an inspection system, having a mirror substrate (205), a reflection layer (220), which is configured to have a reflectivity of at least 50% for electromagnetic radiation of a predefined operating wavelength that is incident on the optically effective surface (200a) of the mirror at an angle of incidence of at least 65° relative to the respective surface normal, and a barrier layer system (210), which is arranged between the reflection layer and the mirror substrate and has a sequence of alternating layer plies composed of a first material and at least one second material. The barrier layer system reduces penetration of hydrogen atoms that would otherwise penetrate the mirror substrate by at least a factor of 10.

The present disclosure provides an apparatus for fabricating a semiconductor device, including a first chamber for accommodating a mask, and a first ionizer in the first chamber, wherein the first ionizer is adjacent to the mask.

An extreme ultraviolet light generation apparatus may include: a chamber device including an internal space; a target supply unit disposed at the chamber device and configured to supply a droplet of a target substance to the internal space; a target collection unit disposed at the chamber device, communicated with the internal space through an opening provided to an inner wall of the chamber device, and configured to collect the droplet passing through the opening; a detection unit disposed at the chamber device and configured to detect the target substance accumulating in the vicinity of the opening of the inner wall; and a control unit configured to stop the target supply unit depending on a result of the detection by the detection unit.

An extreme ultraviolet (EUV) lithography system includes a vane bucket module. The vane bucket module includes a collecting tank and a temperature adjusting pack. The collecting tank has a cover and the cover includes a plurality of through holes. Thicknesses of edges of the cover is greater than a thickness of a center of the cover. The temperature adjusting pack surrounds the collecting tank. The temperature adjusting pack includes a plurality of inlets aligned with the through holes.

An extreme ultraviolet light generation device according to an aspect of the present disclosure includes: a chamber; a mirror configured to condense extreme ultraviolet light radiated from plasma generated by irradiating a target supplied into the chamber with a laser beam; an electromagnet disposed outside the chamber to form a magnetic field between a generation region of the plasma in the chamber and the mirror; a current inversion device configured to invert the direction of current flowing through the electromagnet; and a controller configured to control the current inversion device to invert the direction of the current when a set condition is satisfied.

System and method for removing molecular contaminants from an air stream are disclosed. The system includes first, second and third filter. The first filter removes organic contaminants from an air stream passing through the first filter. The second filter is downstream of the first filter, is physically and chemically exchangeable with the first filter and removes organic contaminants from the air stream output of the first filter. The third filter, downstream of the second filter, is not exchangeable with the first filter or the second filter. The first position filter can be replaced by the second filter in the second position when the first filter in the first position becomes depleted as detected. A new filter in the second filter position is inserted. Replacing the depleted first filter with the second downstream filter reduces costs and waste while inserting the new filter in the second position ensures removing organic contaminants.