An imprint apparatus including a substrate holding unit including a plurality of holding regions whose pressures to a substrate are independently controlled, and configured to hold the substrate on the plurality of holding regions, a first obtaining unit configured to obtain first information about a pressing force applied to a mold when the mold and an imprint material on the substrate are brought into contact with each other, and a control unit configured to control, based on the first information obtained by the first obtaining unit, the pressure between the substrate and each of the plurality of holding regions in a state in which the mold and the imprint material on the substrate are in contact with each other such that deformation that occurs in the substrate due to the pressing force falls within an allowable range.

A component for use in a patterning device environment including a patterning device, wherein the component is treated to suppress EUV plasma-induced contaminant release and/or atomic hydrogen or other radicals induced defectivity. A conduit array comprising at least one conduit, wherein the at least one conduit has been treated to promote adhesion of a contaminant to the at least one conduit.

A method of dislodging contamination from a part of an apparatus used in a patterning process, the method including: providing a cleaning substrate into contact with the part of the apparatus while the part is attached to the apparatus, the cleaning substrate comprising a material configured to chemically react with the contamination; and dislodging contamination on the part of the apparatus by chemical reaction between the material and the contamination.

A debris mitigation system for use in a radiation source. The debris mitigation system comprises a contamination trap. The contamination trap comprises a debris receiving surface arranged to receive liquid metal fuel debris emitted from a plasma formation region of the radiation source. The debris receiving surface is constructed from a material that reacts with the liquid metal fuel debris to form an intermetallic layer on the debris receiving surface.

A lithographic apparatus has an object, the object includes: a substrate and optionally a lower layer on the substrate; an upper layer; and an intermediate layer between the upper layer and the substrate, wherein a bond strength between the intermediate layer and the substrate or lower layer is greater than a bond strength between the intermediate layer and the upper layer and the intermediate layer has a Young's Modulus and/or a Poisson ratio within 20% of that of the upper layer.

A sensor mark including: a substrate having: a deep ultra violet (DUV) radiation absorbing layer including a first material which substantially absorbs DUV radiation; and a protecting layer including a second material, wherein: the DUV radiation absorbing layer has a through hole in it; the protecting layer is positioned, in plan, in the through hole and the protecting layer in the through hole has a patterned region having a plurality of through holes; and the second material is more noble than the first material.

A wafer chuck includes a base made of a ceramic containing silicon carbide. The base has an oxidation-treated layer, and a film made of diamond-like carbon (DLC) is formed on an outermost surface of the base.

A reticle-masking structure is provided. The reticle-masking structure includes a magnetic substrate and a paramagnetic part disposed on the magnetic substrate. The paramagnetic part includes a plurality of fractions disposed on a plurality of protrusion structures. In some embodiments, the protrusion structures are irregularly arranged. A method for forming a reticle-masking structure and an extreme ultraviolet apparatus are also provided.

A positioning system to position a structure comprises an actuator and a control unit to control the actuator in response to a position setpoint received by the control unit. The actuator comprises a magnet assembly comprises a magnet configured to provide a magnetic flux, and a coil assembly, wherein the coil assembly and the magnet assembly are movable relative to each other, the coil assembly comprising a coil, an actuation of the coil by a drive current providing for a force between the magnet assembly and the coil assembly. The magnet assembly comprises a further electric conductor, the further electric conductor comprising a non-ferromagnetic electrically conductive material, wherein the further electric conductor is magnetically coupled to the coil of the coil assembly and forms a short circuit path for an inductive electrical current induced in the further electric conductor as a result of an actuator current in the coil.

A lithographic apparatus is provided. The lithographic apparatus includes a reticle and an electrostatic clamp configured to releasably hold the reticle. The electrostatic clamp includes a first substrate having opposing first and second surfaces, a plurality of burls located on the first surface and configured to contact the reticle, a second substrate having opposing first and second surfaces. The first surface of the second substrate is coupled to the second surface of the first substrate. A plurality of cooling elements are located between the first surface of the second substrate and the second surface of the first substrate. The cooling elements are configured to cause electrons to travel from the second surface of the first substrate to the first surface of the second substrate. Each cooling element is substantially aligned with a respective burl.