A heated extreme ultraviolet (EUV) mirror, method of making same, and a projection optics box (POB) of an EUV lithography scanner employing same, are disclosed. The POB includes EUV mirrors disposed inside a vacuum chamber and arranged respective to project an image of a reflective EUV photolithography mask disposed on a reticle stage onto a wafer disposed on a wafer stage. Each EUV mirror of the plurality of EUV mirrors includes a mirror support and an EUV-reflective multilayer disposed on a front side of the mirror support. The plurality of EUV mirrors includes at least one heated EUV mirror that further includes a resistive heater disposed in the mirror support of the heated EUV mirror. In integrated circuit manufacturing, the exposure of a photoresist layer on a semiconductor wafer to EUV light using the POB includes controlling mirror temperature using a heater embedded in the EUV mirror.

An optical system for a lithography apparatus, having a first component, a second component, and an optical element, which is held between the first component and the second component with force-fit engagement and for this purpose is subjected to a clamping force. At least one of the components includes a bearing portion which contacts the optical element and which has a shape-memory alloy.

A component for use in a patterning device environment including a patterning device, wherein the component is treated to suppress EUV plasma-induced contaminant release and/or atomic hydrogen or other radicals induced defectivity. A conduit array comprising at least one conduit, wherein the at least one conduit has been treated to promote adhesion of a contaminant to the at least one conduit.

A porous member is used in a liquid removal system of an immersion lithographic projection apparatus to smooth uneven flows. A pressure differential across the porous member may be maintained at below the bubble point of the porous member so that a single-phase liquid flow is obtained. Alternatively, the porous member may be used to reduce unevenness in a two-phase flow.

Particle trap assemblies configured to reduce the possibility of contaminant particles with a large range of sizes, materials, travel speeds and angles of incidence reaching a particle-sensitive environment. The particle trap may be a gap geometric particle trap located between a stationary part and a movable part of the lithography apparatus. The particle trap may also be a surface geometric particle trap located on a surface of a particle sensitive environment in lithography or metrology apparatus.

A method of dislodging contamination from a part of an apparatus used in a patterning process, the method including: providing a cleaning substrate into contact with the part of the apparatus while the part is attached to the apparatus, the cleaning substrate comprising a material configured to chemically react with the contamination; and dislodging contamination on the part of the apparatus by chemical reaction between the material and the contamination.

A sensor mark including: a substrate having: a deep ultra violet (DUV) radiation absorbing layer including a first material which substantially absorbs DUV radiation; and a protecting layer including a second material, wherein: the DUV radiation absorbing layer has a through hole in it; the protecting layer is positioned, in plan, in the through hole and the protecting layer in the through hole has a patterned region having a plurality of through holes; and the second material is more noble than the first material.

A method for adhering a reticle onto a top surface of a chuck is provided in accordance with some embodiments of the present disclosure. The method includes contacting a plurality of fibers on the top surface of the chuck with the reticle. The reticle is slid relative to the top surface of the chuck along a first direction to increase a contact area between the fibers and the reticle, such that the reticle is adhered to the fibers.

Provided is a member for exposure device, including glass-like carbon. Also, provided is a method for producing the member for exposure device, the method comprising: the step of forming a thermosetting resin material to prepare a resin formed body, and the step of carbonizing the resin formed body to obtain a glass-like carbon body. Also provided is a composite member for exposure device, including the member for exposure device.

An apparatus includes a first substrate, a second substrate, and an intermediate layer disposed between the first and second substrates. The intermediate layer is configured to be a first point of failure or breakage of the apparatus under an applied force. The apparatus can further include a bonding layer disposed between the first and second substrates. The bonding layer is configured to bond the intermediate layer to the first and second substrates. The apparatus can further include a fastener coupled to the first and second substrates. The fastener is configured to secure the intermediate layer to the first and second substrates. The intermediate layer can include a coating applied to the first substrate or the second substrate. The apparatus can further include a second intermediate layer disposed between the first substrate and the fastener or the second substrate and the fastener.