A connection arrangement for connecting a first component and a second component of an imaging device for micro lithography, such as for using light in the extreme UV range (EUV), includes a connection unit having a first contact portion, a second contact portion and a coupling portion.

A contamination trap for use in a debris mitigation system of a radiation source, the contamination trap comprising a plurality of vanes configured to trap fuel debris emitted from a plasma formation region of the radiation source; wherein at least one vane or each vane of the plurality of vanes comprises a material comprising a thermal conductivity above 30 W m.sup.?1 K.sup.?1.

An alignment system configured to be substantially insensitive to thermal variations in its system during alignment measurements. The alignment system includes a sensor system, a support structure, a sensing element, a position measurement system, and an athermal interface between the sensing element and the support structure. The sensor system is configured to determine a in position of an alignment mark on a substrate and the support structure is configured to support the sensor system. The sensing element is configured to detect an unintentional displacement of the support structure and the position measurement system is configured to measure the unintentional displacement relative to a reference element based on the detected unintentional displacement. The athermal interface is configured to prevent detection of temperature induced displacement of the support structure by the sensing element.

A projection exposure apparatus for semiconductor lithography includes: a light source for generating optical used radiation by which structures arranged on a reticle can be imaged onto a wafer; a plurality of optical elements for guiding and manipulating the used radiation; and a plurality of position sensors for determining the position of at least some of the optical elements. At least some of the position sensors are arranged on a measurement structure that is at least partially decoupled mechanically and/or thermally from the further components of the projection exposure apparatus. The measurement structure has at least two mechanically decoupled substructures. The first substructure has a lower coefficient of thermal expansion than the second substructure. The second substructure has a greater stiffness than the first substructure.

An object of the present invention is to provide a chemical liquid which has excellent defect inhibition performance and hardly breaks a transfer pipe line that a device for manufacturing the chemical liquid includes at the time of manufacturing the chemical liquid. Another object of the present invention is to provide a chemical liquid storage body, a manufacturing method of a chemical liquid, and a manufacturing method of a chemical liquid storage body. The chemical liquid according to an embodiment of the present invention is a chemical liquid containing an organic solvent and an ion of at least one kind of atom selected from the group consisting of an Fe atom, a Cr atom, a Ni atom, and a Pb atom, in which in a case where the chemical liquid contains one kind of the ion, a content of the metal ion is 0.1 to 100 mass ppt, in a case where the chemical liquid contains two or more kinds of the ions, a content of each of the metal ions is 0.1 to 100 mass ppt, and a charge potential is equal to or lower than 100 mV.

A component for a mirror array for EUV lithography, particularly for use in faceted mirrors in illumination systems of EUV lithography devices. A component (500) for a mirror array for EUV lithography is proposed which is at least partially made from a composite material including matrix material (502) that contains copper and/or aluminium, and reinforcing material in the form of fibers (504). The composite material also includes particles (508) that consist of one or more of the materials from the group: graphite, adamantine carbon, and ceramic.

An optical system for a lithography apparatus, having a first component, a second component, and an optical element, which is held between the first component and the second component with force-fit engagement and for this purpose is subjected to a clamping force. At least one of the components includes a bearing portion which contacts the optical element and which has a shape-memory alloy.

A porous member is used in a liquid removal system of an immersion lithographic projection apparatus to smooth uneven flows. A pressure differential across the porous member may be maintained at below the bubble point of the porous member so that a single-phase liquid flow is obtained. Alternatively, the porous member may be used to reduce unevenness in a two-phase flow.

Particle trap assemblies configured to reduce the possibility of contaminant particles with a large range of sizes, materials, travel speeds and angles of incidence reaching a particle-sensitive environment. The particle trap may be a gap geometric particle trap located between a stationary part and a movable part of the lithography apparatus. The particle trap may also be a surface geometric particle trap located on a surface of a particle sensitive environment in lithography or metrology apparatus.

An electrostatic clamp (300) and a method for manufacturing the same is disclosed. The electrostatic clamp includes a first layer (302) having a first ultra-low expansion (ULE) material, a second layer (304) coupled to the first layer, having a second ULE material, and a third layer (306), coupled to the second layer, having a third ULE material. The electrostatic clamp further includes a plurality of fluid channels (316) located between the first layer and the second layer and a composite layer (308) interposed between the second layer and the third layer. The method for manufacturing the electrostatic clamp includes forming the plurality of fluid channels, disposing the composite layer on the third layer, and coupling the third layer to the second layer. The plurality of fluid channels is configured to carry a thermally conditioned fluid for temperature regulation of a clamped object.