Three-dimensional printing methods and systems use a derived geometry and aligns anisotropic inclusions in any orientation at any number of discrete volumetric sections. Structural, thermal, or geometry-based analyses are combined with inclusion alignment computations and print preparation methods and provided to 3D printers to produce composite material parts that meet demanding geometric needs as well as enhanced structural and thermal requirements. In one example, optimal inclusion alignment vectors associated with a section of the object are calculated based on specifications for the object, segmenting a three-dimensional model of the object into layer slices, grouping each section within each layer slice having similar alignment vectors and combining the groupings and generating printing instructions for the object according to the grouped alignment vectors.

Alignment can be monitored by positioning at least one alignment verification location per alignment frame. The alignment verification location is a coordinate within the alignment frame. A distance between each of the alignment verification locations and a closest instance of an alignment target is determined. An alignment score can be determined based on the distance. The alignment score can include a number of the alignment frames between the alignment verification location and the alignment target. If the alignment score is below a threshold, then alignment setup can be performed.

A method and a device for aligning two lenses, wherein the method is directed to aligning first and second optical partial systems of an optical system, which are arranged so as to be located opposite to one another. The method includes the steps of: projecting alignment marks into a first image plane of the first optical partial system, projecting the alignment marks from the first image plane onto a sensitive surface of the second optical partial system, and aligning the optical partial systems relative to one another, such that projections of the alignment marks in a depth of field of the sensitive surface are imaged at ideal positions.

A method of measuring overlay uses a plurality of asymmetry measurements from locations (LOI) on a pair of sub-targets (1032, 1034) formed on a substrate (W). For each sub-target, the plurality of asymmetry measurements are fitted to at least one expected relationship (1502, 1504) between asymmetry and overlay, based on a known bias variation deigned into the sub-targets. Continuous bias variation in one example is provided by varying the pitch of top and bottom gratings (P1/P2). Bias variations between the sub-targets of the pair are equal and opposite (P2/P1). Overlay (OV) is calculated based on a relative shift (xs) between the fitted relationships for the two sub-targets. The step of fitting asymmetry measurements to at least one expected relationship includes wholly or partially discounting measurements (1506, 1508, 1510) that deviate from the expected relationship and/or fall outside a particular segment of the fitted relationship.

Various embodiments of aligning wafers are described herein. In one embodiment, a photolithography system aligns a wafer by averaging individual via locations. In particular, some embodiments of the present technology determine the center locations of individual vias on a wafer and average them together to obtain an average center location of the set of vias. Based on a comparison of the average center location to a desired center location, the present technology adjusts the wafer position. Additionally, in some embodiments, the present technology compares wafer via patterns to a template and adjusts the position of the wafer based on the comparison.

A method of aligning a plate containing a substrate is disclosed wherein multiple cameras with distinct fields of view are aligned with mark cells that are within the field of view of each of the multiple cameras.

A sensor mark including: a substrate having: a deep ultra violet (DUV) radiation absorbing layer including a first material which substantially absorbs DUV radiation; and a protecting layer including a second material, wherein: the DUV radiation absorbing layer has a through hole in it; the protecting layer is positioned, in plan, in the through hole and the protecting layer in the through hole has a patterned region having a plurality of through holes; and the second material is more noble than the first material.

Three-dimensional printing methods and systems use a derived geometry and aligns anisotropic inclusions in any orientation at any number of discrete volumetric sections. Structural, thermal, or geometry-based analyses are combined with inclusion alignment computations and print preparation methods and provided to 3D printers to produce composite material parts that meet demanding geometric needs as well as enhanced structural and thermal requirements. In one example, optimal inclusion alignment vectors associated with a section of the object are calculated based on specifications for the object, segmenting a three-dimensional model of the object into layer slices, grouping each section within each layer slice having similar alignment vectors and combining the groupings and generating printing instructions for the object according to the grouped alignment vectors.

An inspection method includes a rough alignment process of acquiring optical images of first and second patterns previously set to confirm whether a position misalignment amount in a rotation direction of a sample with respect to an X or Y direction is equal to or smaller than a first acceptable value, and conforming whether the position misalignment amount is equal to or smaller than the first acceptable value on the basis of an acquisition result, and a fine alignment process of acquiring optical images of third patterns positioned on different corners of a rectangular frame constituted of four sides along the X or Y direction on an optical image of the sample and rotating a stage until a position misalignment amount detected based on the optical images of the third patterns becomes equal to or smaller than a second acceptable value being smaller than the first acceptable value.

A device for measuring reference points in real time during lithographic printing includes a light source providing an exposure beam; a light modulator modulating the exposure beam according to an exposure pattern; a measurement system configured to measure a position of a number of alignment marks previously arranged on a substrate; and an exposure optical system comprising a control unit. The exposure optical system delivers the modulated exposure beam as an image provided by the light modulator onto the substrate. The exposure system control unit is configured to calculate the orientation of the substrate based on the position of the alignment marks and control the delivering of the modulated exposure beam relative to the calculated orientation of the substrate.