An imprint apparatus forms a pattern of an imprint material on a substrate by using a mold, while effecting alignment control of a mold and a substrate with respect to an in-plane direction of the substrate. A mold holding portion holds the mold. A substrate holding portion holds the substrate. A control portion effects control so that the mold and the substrate are brought near to each other while effecting the alignment control, based on a driving profile, after the alignment control is started, to bring the mold and the imprint material into contact with each other. The imprint material is then cured. The control portion changes the driving profile for the alignment control after the alignment control is started and at least one of before and after the mold contacts the imprint material.

An imprint apparatus performs alignment control of a mold and a substrate. A pattern formed on the mold is transferred onto a pattern forming layer on the substrate. A mold holding portion holds the mold, a substrate holding portion holds the substrate, and a control portion effects control so that the mold and the substrate are brought near to each other during the alignment control. The mold and the pattern forming layer are brought into contact with each other and then the pattern forming layer is cured. The control portion changes a driving profile for the alignment control after the alignment control is started and at least one of before and after the mold contacts the pattern forming layer. The driving profile used to move at least one of the mold holding portion and the substrate holding portion to a target position, and includes at least one of acceleration, speed, driving voltage, and driving current.

An imprinting method in which alignment control of a mold and a substrate is effected and a pattern formed on the mold is transferred onto a pattern forming layer provided on the substrate. The imprinting method includes a step in which the mold and the substrate are brought near to each other while effecting the alignment control, after the alignment control is started, to bring the mold and the pattern forming layer into contact with each other, and then, the pattern forming layer is cured, and a step in which the gap between the mold and the substrate is increased, after the pattern forming layer is cured. Further, the alignment control is stopped after the alignment control is started, and at least one of before and after the mold contacts the pattern forming layer.

A circular cylinder-shaped mask is used to form an image of a pattern on a substrate via a projection optical system. The mask has a pattern formation surface on which the pattern is formed and that is placed around a predetermined axis, and the mask is able to rotate, with the predetermined axis taken as an axis of rotation, in synchronization with a movement of the substrate in at least a predetermined one-dimensional direction. When a diameter of the mask on the pattern formation surface is taken as D, and a maximum length of the substrate in the one-dimensional direction is taken as L, and a projection ratio of the projection optical system is taken as , and circumference ratio is taken as , then the conditions for D(L)/ are satisfied.

Aspects of the present disclosure generally relate to a digital lithography system and methods for alignment resolution with the digital lithography system. The digital lithography system includes a metrology system configured to improve overlay alignment for different layers of the lithography process. The metrology system includes an inline metrology system (IMS) in combination with an on tool metrology system (OTM), which enable substrate overlay alignment and die placement correction. The inline metrology system may be positioned on an inline metrology tool and the on tool metrology system is positioned on a digital lithography tool. The inline metrology system facilitates measurement of high-throughput measurement inline metrology data for marks such as die marks and global alignment marks for verification of process stability and die placement data for digital data correction. This inline metrology data can be compared with a design file to determine offsets for the digital data correction.

A measurement apparatus that measures position information of a measurement target is provided. The apparatus includes a scope configured to generate an image by capturing an image of the measurement target, and a processor configured to obtain position information of the measurement target based on the image. The processor is configured to generate a plurality of image components using a statistical technique from a plurality of images generated by the scope, output the plurality of generated image components, perform processing based on the plurality of image components, and determine the position information based on a result of the processing.

Aspects of the present disclosure generally relate to a digital lithography system and methods for alignment resolution with the digital lithography system. The digital lithography system includes a metrology system configured to improve overlay alignment for different layers of the lithography process. The metrology system includes an inline metrology system (IMS) in combination with an on tool metrology system (OTM), which enable substrate overlay alignment and die placement correction. The inline metrology system may be positioned on an inline metrology tool and the on tool metrology system is positioned on a digital lithography tool. The inline metrology system facilitates measurement of high-throughput measurement inline metrology data for marks such as die marks and global alignment marks for verification of process stability and die placement data for digital data correction. This inline metrology data can be compared with a design file to determine offsets for the digital data correction.

A surface position detection device that obtains position information of a detected surface along an axis that intersects the detected surface includes: a light transmission unit by which a plurality of detection lights having a smoothly modulated intensity in the detected surface in a first direction within the detected surface are radiated and superimposed onto the detected surface obliquely from a direction having a direction component in the first direction and which forms an irradiation region on the detected surface; a light reception unit that has a light detection portion having a light reception surface arranged at an optically conjugated position with respect to the detected surface, receives at a different position of each light reception surface, the plurality of detection lights reflected by a detection region of which a width in the first direction is a predetermined value in the irradiation region, and outputs each photoelectric conversion signal of the plurality of detection lights; and a calculation unit that calculates position information of the detected surface based on the photoelectric conversion signal of the plurality of detection lights output from the light reception unit.

The present invention provides an imprint apparatus that forms an imprint material pattern on a substrate by using a mold, comprising: a discharge unit on which a plurality of discharge outlets configured to discharge an imprint material are arranged; a measurement unit configured to measure a relative tilt between the discharge unit and the substrate; and a control unit configured to control a process of causing the discharge unit to discharge the imprint material while relatively moving the discharge unit and the substrate to each other, wherein the control unit is configured to change a relative movement direction of the discharge unit and the substrate in the process in accordance with the relative tilt measured by the measurement unit so as to reduce an arrangement error of the imprint material, discharged from the plurality of discharge outlets, on the substrate.

A patterning device pre-alignment sensor system is disclosed. The system comprises at least one illumination source configured to provide an incident beam along a normal direction towards a patterning device. The system further comprises an object lens group channel along the normal direction configured to receive a 0th order refracted beam from the patterning device. The system further comprises a first light reflector configured to redirect the 0th order refracted beam to form a first retroreflected beam. The system further comprises a first image lens group channel configured to transmit the first retroreflected beam to a first light sensor. The first light sensor is configured to detect the first retroreflected beam to determine a location feature of the patterning device.