According to the embodiments, a template in which a main pattern is placed on a pattern-formed surface of a template substrate, the main pattern being formed by a concave and convex pattern, the template substrate being transparent to an electromagnetic wave with a predetermined wavelength is provided. The template includes a first mark in which line-shaped first concave patterns and first convex patterns are alternately placed in a width direction on the pattern-formed surface. The first convex pattern includes a first light-blocking portion and a first translucent portion. The first light-blocking portion is a region including a first side surface in the width direction and being covered with a metal film. The first translucent portion is a region including a second side surface in the width direction and being not covered with the metal film.

The present invention provides a pattern forming method of forming a plurality of pattern layers on a substrate by using a plurality of lithography apparatuses including a first lithography apparatus and a second lithography apparatus, the method comprising a first step of forming a first pattern layer by the first lithography apparatus which adopts a die-by-die alignment method, based on alignment information obtained by using the die-by-die alignment method for a plurality of marks formed on the substrate by a lithography apparatus which adopts a global alignment method, and a second step of forming a second pattern layer so as to overlap with the first pattern layer by the second lithography apparatus, based on alignment information obtained by using the global alignment method for a plurality of shot regions formed on the substrate by the first lithography apparatus in the first step.

A dual-layer alignment apparatus is disclosed which includes: a fixed frame (40) and, disposed thereon, a first measuring device (50) and a mark plate (41), the mark plate (41) having a fixed-frame mark (20); and a motion stage (60) and, disposed thereon, a reference mark (30), a motion-stage mark (70) and a second measuring device (10). The first measuring device (50) is configured to measure a relative positional relationship between the reference mark (30) and the motion-stage mark (70), the second measuring device (10) is configured to measure a relative positional relationship between the reference mark (30) and the fixed-frame mark (20), from which a final relative positional relationship between the motion-stage mark (70) and the fixed-frame mark (20) is derived, based on which the motion stage (60) is displaced to a target location. A corresponding dual-layer alignment method is also disclosed. In the apparatus, the motion stage (60) is the only movable component. Additionally, coordinate relationships can be calibrated in a static manner in order to immunize calibration accuracy from positioning accuracy of the motion stage (60), such that the alignment accuracy is improved. Further, a dual- or multi-lens design can be employed to allow additional improvements in flexibility and alignment efficiency.

The present invention provides an imprint apparatus which forms a pattern of an imprint material onto a substrate by using a mold, the apparatus including a control unit configured to provide a user interface for displaying a first map indicating a supply position of the imprint material to be supplied onto the substrate, an adjustment window for adjusting a value of an apparatus parameter which is set in the imprint apparatus and used to change a supply position of the imprint material, and a second map indicating a supply position of the imprint material after adjustment of the value of the apparatus parameter.

A method for aligning a first substrate, in particular a mask, with a second substrate, in particular a wafer, comprises inserting the first substrate and the second substrate into a positioning means; capturing at least one joint image of the first substrate and the second substrate; displaying the image; a plurality of image points in the image being marked by a user; and determining a control command for actuating the positioning means on the basis of the marked image points in such a way that the substrates are aligned with one another.

A method for aligning a first article relative to a second article. The second article is provided with at least one flexible structure fixed to the second article at one point while the first article includes at least one surface relief marking. A detector measures the interaction between the flexible structure and surface relief marking and generates detector signals relative to that interaction to achieve alignment between the first and second articles.

An overlay alignment detection apparatus for a display device and an exposure process system are provided by embodiments of the present disclosure, the overlay alignment detection apparatus including a bearing frame for bearing the display device, a control device, a detection device and an analysis device. The control device is configured to send control commands to the detection device depending on pre-stored coordinate information of a reference point within an overlay area of the display device when the bearing frame is at an idle time among processes; the detection device is configured to be moved to the overlay area of the display device on the bearing frame according to the control commands sent by the control device, to acquire images of the overlay area, and to send the acquired images to the analysis device; and the analysis device is configured to analyze and process an overlay alignment condition of the display device, with the images sent by the detection device. The overlay alignment detection apparatus provided by the present disclosure may determine the overlay alignment condition of the display device without measuring critical dimensions of the display device; therefore, detection efficiency may be enhanced, such that a comprehensive detection may be implemented on all display devices to be detected and product quality thereof may also be improved.

A device for positioning a mask relative to the surface of a wafer with a view to the exposure of the wafer, which includes (i) first positioning structure suitable for holding and moving the mask and the wafer in relation to each other; (ii) imaging structure suitable for producing at least one image of the mask and of the surface of the wafer according to at least one field of view, so as to image positioning marks of the mask and of the wafer simultaneously in the field of view; and (iii) at least one optical distance sensor suitable for producing a distance measurement between the surface of the wafer and the mask in the field(s) of view, with a measurement beam which passes at least partially through the imaging structure.

An optical image capturing module and an alignment method and an observation method for an upper substrate and a lower substrate using the optical image capturing module are provided. The upper substrate and the lower substrate are disposed opposite. The alignment method includes the following steps of: emitting a light ray; filtering the light ray and dividing the light ray into a light ray at first wavelength and a light ray at second wavelength, whereby the light ray at first wavelength irradiates a pattern on the upper substrate, and the light ray at second wavelength irradiates a pattern on the lower substrate; reflecting the pattern on the upper substrate to an image capturing device; reflecting the pattern on the lower substrate to the image capturing device; and determining the positions of the pattern on the upper substrate and the pattern on the lower substrate on the image capturing device.

A method for correcting an exposure pattern on a substrate includes obtaining, based on the exposure pattern, displacement adjustment parameters for adjusting displacements of a worktable supporting the substrate in each of a first direction and a second direction, a rotation angle adjustment parameter for adjusting a rotation angle of the worktable in a rotation direction, and a gap adjustment parameter for adjusting a gap between the worktable and a mask plate. The first direction and the second direction are perpendicular to each other in a horizontal plane. The rotation direction is a direction in which the worktable rotates around a central axis of a base table supporting the mask plate. The method further includes moving the worktable based on the displacement adjustment parameters, the rotation angle adjustment parameter and the gap adjustment parameter.