A position detector includes a detection unit configured to detect light from a first diffraction grating including a first pattern disposed in a first direction, and light from a second diffraction grating including a second pattern disposed in the first direction, and a control unit configured to obtain a relative position between the first and the second diffraction gratings based on the light detected by the detection unit. The position detector has a third pattern formed in a second direction different from the first direction at edges of the first pattern of the first diffraction grating, the third pattern has a width smaller than a width of the first pattern of the first diffraction grating.

A measurement device for measuring a relative position between alignment marks includes an illumination unit capable of illuminating the alignment marks at a plurality of wavelengths, a detection unit that detects light from the alignment marks, a processing unit that obtain the relative position between the alignment marks, and an adjustment unit that adjusts a relative amount between light amounts of the plurality of wavelengths so that a relative value between detection light amounts of light from the alignment marks falls within a predetermined range.

A detecting apparatus that detects a mark includes: an imaging device configured to perform imaging of the mark; and a controller configured to control the imaging device. The controller is configured to control the imaging device such that only a period in which a position of an object with the mark is within a tolerance is a period of the imaging before the position converges within the tolerance.

The present invention provides a pattern forming method of forming a plurality of pattern layers on a substrate by using a plurality of lithography apparatuses including a first lithography apparatus and a second lithography apparatus, the method comprising a first step of forming a first pattern layer by the first lithography apparatus which adopts a die-by-die alignment method, based on alignment information obtained by using the die-by-die alignment method for a plurality of marks formed on the substrate by a lithography apparatus which adopts a global alignment method, and a second step of forming a second pattern layer so as to overlap with the first pattern layer by the second lithography apparatus, based on alignment information obtained by using the global alignment method for a plurality of shot regions formed on the substrate by the first lithography apparatus in the first step.

A lithographic apparatus is disclosed that has a first substrate table arranged to hold a substrate and a second substrate table arranged to hold a substrate, an imprint template holder arranged to hold an imprint template, and an imprintable medium dispenser, wherein the first substrate table is moveable between a first position located at or adjacent to the imprintable medium dispenser, and a second position located at or adjacent to the imprint template holder, and the second substrate table is moveable between the first and second positions, such that the first and second substrate tables swap positions.

A template includes: a base material having a principal surface; a mesa structure provided on the principal surface and having a first surface; and a silicon film that is provided on the first surface of the mesa structure, has a projection-and-depression pattern, and is made of a material different from a material for the base material.

An imprinting apparatus can form a pattern of an imprint material supplied to a substrate with a mold. The imprinting apparatus includes a substrate holding unit configured to hold the substrate, a mold holding unit configured to hold the mold, and a control unit configured to control the mold holding unit that changes an inclination of the mold while the mold is kept in contact with the imprint material based on a position in a surface direction of the substrate where the mold contacts the imprint material, in such a way as to reduce a relative inclination between the mold and the substrate that may occur if the substrate holding unit inclines when the mold is brought into contact with the imprint material.

A method of transferring a flexible layer to a substrate makes use of a partial bulge in the flexible layer, which does not make contact with the substrate. The partial bulge advances to the location of an alignment marker on the substrate. When alignment adjustments are needed, they are made with the partial bulge in place so that more reproducible positioning is possible when fully advancing the flexible layer against the substrate.

According to one embodiment, an imprint method is provided. In the imprint method, a template including a mechanoluminescent material is brought into contact with a resist on a substrate. The posture of the template is adjusted on the basis of the intensity of mechanoluminescence from the template. Light is emitted to the resist to harden the resist. The template is separated from the resist.

Systems and methods for shaping a film. Formable material in an imprint field on the substrate may be contacted with a shaping surface of a template. Outer boundaries of the imprint field correspond to outer boundaries of the shaping surface. Shaping the film includes forming a cured layer within the imprint field while the shaping surface is in contact with the formable material. Shaping the film may include separating the shaping surface from the cured layer. Shaping the film may include moving the template away from the imprint field to a first offset location wherein the outer boundaries of the shaping surface are offset relative to the outer boundaries of the imprint field. Shaping the film may include curing a second portion of the formable material while the template is at the first offset location so as to form the shaped film.