Provided is an inspection system for a wire electrical discharge machine, capable of automatically performing inspection of a constituent element and the like. The inspection system for a wire electrical discharge machine is provided with the wire electrical discharge machine, a robot for inspecting the constituent element of the wire electrical discharge machine, an image pickup device provided on a movable part of tee robot and configured to image the constituent element, an image processing unit configured to acquire an image of the constituent element by means of the image pickup device, and a maintenance necessity determination unit configured to determine the necessity of maintenance of the constituent element based on the image acquired by the image processing unit.

A packaging system for high flexibility and speed box-last packaging comprises one or more dimensional scanning sensors that are configured to scan a group of one or more target products that are to be boxed and gather dimension information describing physical dimensions of the group of one or more target products. The system also comprises one or more packaging-production machines that are configured to generate custom-made packaging templates that conform to a pre-determined set of packaging template types. Additionally, the system comprises a packaging template buffer that comprises physically divided sections that contain multiple packaging templates selected from the pre-determined set of packaging template types that are generated by the one or more packaging-production machines. Each of the packaging templates are organized within the physically divided section based upon packaging template type.

Systems, computer-implemented methods, and instructions encoded in machine-accessible storage media are provided for determining manufacturability of an integrated circuit layout. A computer-implemented method includes receiving a layout describing the integrated circuit to be manufactured by a semiconductor manufacturing process. The method also includes generating a differentiable manufacturability parameter as an output of a machine learning model using the layout, the machine learning model being trained to generate the differentiable manufacturability parameter. The differentiable manufacturability parameter describes the manufacturability of the integrated circuit by the semiconductor manufacturing process.

A control device for at least one technical installation is described herein. The control device includes at least one mobile control unit for controlling the at least one technical installation as well as at least one supply unit, which can be assigned in a fixed manner to the technical installation and be connected thereto in an energy- and signal-transmitting manner for supplying the at least one mobile control unit with energy. The at least one mobile control unit and the at least one supply unit have a device for wireless energy transmission with a transmission frequency within a predetermined distance between the supply unit and the mobile control unit and for wireless transmission of a safety protocol in the course of the energy transmission. Furthermore, a technical installation and a method for controlling a technical installation are specified.

A sheet processing apparatus includes: at least one processing tool that takes a processable state and an unprocessable state; a setting unit that sets operation parameters on the processable state and the unprocessable state; and a control unit that controls an operation of the processing tool based on the set operation parameters, in which the setting unit sets the operation parameters such that: a processable state holding process in which the processing tool holds the processable state, is executed, when a certain portion-to-be-processed is formed in a certain pre-product and then a next portion-to-be-processed of the same type as the certain portion-to-be-processed is formed in a next pre-product; and/or a processing tool selection process in which the processing tool for forming the portion-to-be-processed is selected so that a moving distance of the processing tool is minimized, is executed.

A method and system are provided for automatically portioning workpieces, such as food products, by simulating portioning the workpieces in accordance with the one or more desired shapes of the final piece(s) as a directly controlled physical characteristic (parameter/specification) as well as one or more resulting indirectly controlled physical characteristics (parameters/specifications). The desired shape(s) of the final piece(s) are defined by a plurality of manipulatable reference coordinates. A workpiece is scanned to obtain scanning information, then portioning of the workpiece is simulated in accordance with the desired shape(s) of the final piece(s) defined by the directly controlled reference coordinates, thereby to determine the one or more indirectly controlled physical characteristics of the one or more final pieces to be portioned from the workpiece. The simulated portioning of the workpiece is performed for multiple combinations of directly controlled shapes as defined by the modified or edited reference coordinates and indirectly controlled physical characteristics until an acceptable set of a directly controlled shape and resulting one or more indirectly controlled physical characteristics is determined.

A method for multistep machining a cutting tool includes defining a data set of the cutting tool, positioning the workpiece in a machining device, determining a data set of the workpiece to be machined, defining at least one machining program based on the defined data set in relation to the determined data set of the workpiece, subjecting the workpiece to the at least one machining program, to obtain intermediate geometries of the workpiece, determining a second data set by measuring means including the intermediate geometries of the workpiece and transferring the machined workpiece to a second machining device. Furthermore, the steps of positioning, determining data set of the workpiece, defining machining program, subjecting the workpiece to the machining program, determining a second data set and transferring to the second machining device are repeated until the workpiece takes on the shape of the target geometries.

A short detection apparatus configured to detect a layer short in a motor in which a plurality of sets of multi-phase windings are independently disposed in a stator includes an acquisition unit configured to acquire electricity information corresponding to windings of individual phases in the sets of the multi-phase windings; and a determination unit configured to determine, based on the electricity information which the acquisition unit acquires with respect to windings of a mutually identical phase in the sets of the multi-phase windings, whether a layer short occurs in any one of the windings of the mutually identical phase.

A system includes a wafer shape metrology sub-system configured to perform one or more shape measurements on post-bonding pairs of wafers. The system includes a controller communicatively coupled to the wafer shape metrology sub-system. The controller receives a set of measured distortion patterns. The controller applies a bonder control model to the measured distortion patterns to determine a set of overlay distortion signatures. The bonder control model is made up of a set of orthogonal wafer signatures that represent the achievable adjustments. The controller determines whether the set of overlay distortion signatures associated with the measured distortion patterns are outside tolerance limits provides one or more feedback adjustments to the bonder tool.

A method can comprise: determining a plurality of potential repair processes for the stack of IBRs, each repair process associated with a defect on an inspected IBR; generating a finite element model of the stack of IBRs with a potential repaired defect of each inspected IBR being modeled, a plurality of vane stages disposed between adjacent inspected IBRs, and an engine case; performing a structural analysis and an aerodynamic analysis; determining whether the stack of IBRs with the potential repaired defect of each inspected IBR meets a structural criteria and an aerodynamic criteria; and repairing each IBR in the stack of IBRs with the repair process for the potential repaired defect for each inspected IBR in the stack of IBRs in response to determining the stack of IBRs meets the structural criteria and the aerodynamic criteria.