This method includes a step of imaging, by an imaging apparatus in a substrate treatment system, a reference substrate which is a reference for condition setting and acquiring a captured image of the reference substrate; and a step of imaging, by the imaging apparatus, a treated substrate on which the predetermined treatment has been performed under a current treatment condition and acquiring a captured image of the treated substrate. A deviation amount in color information between the captured image of the treated substrate and the captured image of the reference substrate is calculated. A correction amount of the treatment condition is calculated based on a correlation model acquired in advance and on the deviation amount in the color information. Also included is a step of setting the treatment condition based on the correction amount and performing the treatment on a target substrate based on the set treatment condition.

There is provided a substrate processing system, including: a plurality of substrate processing apparatuses; a first control part installed in each of the plurality of substrate processing apparatuses and configured to transmit a first apparatus data from each of the plurality of substrate processing apparatuses; a second control part configured to receive the first apparatus data from each of the plurality of substrate processing apparatuses, generate a priority data of each of the plurality of substrate processing apparatuses based on the first apparatus data, and transmit the priority data to the first control part; and a display part configured to display the priority data thereon.

A wafer manufacturing system includes a wafer manufacturing device provided with a sensor; a host PC that is connected to the wafer manufacturing device via a data communication line; a logic controller that samples and stores an analog output signal of the sensor; and a relay PC that extracts tracking information transmitted on the data communication line for a wafer or a single crystal that is being processed by the wafer manufacturing device and sends the tracking information to the logic controller, and the logic controller stores a digital value of the analog output signal of the sensor in association with the tracking information that is sent from the relay PC.

The present disclosure provides a method and an apparatus for setting wafer script, a device, and a storage medium. In response to the demand unit determining that the execution necessary condition of the script to be executed satisfies the business requirement based on the parameter information, the platform unit acquires the lot identification of the script to be executed and the corresponding production information. In response to the demand unit determining that the script to be executed is executed for the wafers corresponding to the script to be executed for the first time, the platform unit detects whether the first production information corresponding to the first wafers satisfies the execution necessary condition. If satisfied, the platform unit sets parameter information and assignment information for the first wafers, and synchronizes the first wafers with the set information to the material execution unit such that the material execution unit performs corresponding operation.

A recipe updating method of a plasma processing apparatus includes: performing a plasma processing on a substrate mounted on a stage using a first recipe including an application timing of a radio-frequency power for plasma generation; measuring a reference timing at which a temperature of the stage drops to a minimum value and a first maximum value of the temperature of the stage in association with the first recipe; performing the plasma processing on the substrate using a second recipe obtained by changing the application timing of the first recipe to the reference timing; measuring a second maximum value of the temperature of the stage in association with the second recipe; and updating the first recipe to the second recipe when the second maximum value is smaller than the first maximum value.

A method of manufacturing a semiconductor device includes defining a sampling plan in a process control system. Measurement values are obtained at the first number N of the sample points. The first number of measurement values are modelled using a wafer model to generate a first set of coefficients according to a reference model. A second number M of the first number N of sample points is randomly selected. The second number M of measurement values obtained at the second number M of sample points is modelled using the wafer model to generate a second set of coefficients according to a phase_1 model. One of the M sample points is randomly replaced by one of the N−M sample points to obtain a subsample. The measurement values of the subsample are modelled using the wafer model to generate a third set of coefficients according to a phase_2 model.

Provided is a semiconductor manufacturing apparatus, comprising: a first device; one or more sensors that detect physical quantities indicating a state of the first device; a first calculation circuit that calculates one or more feature quantities of the first device from the detected physical quantities; and a failure prediction circuit that monitors a temporal change in the one or more feature quantities calculated in the first calculation circuit, and stops receiving a new substrate when a duration for which a degree of deviation of the one or more feature quantities from those at a normal time is increasing exceeds a first time, and/or when a number of increases and decreases per unit time in the degree of deviation of the one or more feature quantities from those at the normal time exceeds a first number.

The present application discloses a method of handling a transaction request, including: performing an information exchange between a manufacturing execution system and a machine control system by an agent module; the information exchange including: sending a first transaction request by the machine control system to the agent module, and then sending the first transaction request by the agent module to the manufacturing execution system.

A substrate processing apparatus includes a device management controller including a parts management control part configured to monitor the state of parts constituting the apparatus, a device state monitoring control part configured to monitor integrity of device data obtained from an operation state of the parts constituting the apparatus, and a data matching control part configured to monitor facility data provided from a factory facility to the apparatus. The device management controller is configured to derive information evaluating the operation state of the apparatus based on a plurality of monitoring result data selected from a group consisting of maintenance timing monitoring result data acquired by the parts management control part, device state monitoring result data acquired by the device state monitoring control part, and utility monitoring result data acquired by the data matching control part.

This method includes: a step of imaging, by an imaging apparatus in a substrate treatment system, a reference substrate which is a reference for condition setting and acquiring a captured image of the reference substrate; a step of imaging, by the imaging apparatus, a treated substrate on which the predetermined treatment has been performed under a current treatment condition and acquiring a captured image of the treated substrate; a step of calculating a deviation amount in color information between the captured image of the treated substrate and the captured image of the reference substrate; a step of calculating a correction amount of the treatment condition based on a correlation model acquired in advance and on the deviation amount in the color information; and a step of setting the treatment condition based on the correction amount, wherein steps other than the step of acquiring a captured image of the reference substrate are performed for each of the treatment apparatuses.