An information processing apparatus includes an acquisition unit configured to acquire information containing first process data indicating a result of a substrate process in a first process condition and second process data indicating a result of a substrate process in a second process condition different from the first process condition, and a display control unit configured to control a display on a display apparatus based on the information acquired by the acquisition unit, wherein the display control unit is configured to display, on the display apparatus, a first screen displaying a first data group in which the first process data is arranged chronologically and a second data group in which the second process data is arranged chronologically, the first screen displaying the first data group in a region and the second data group in another region.

An information processing apparatus includes an acquisition unit configured to acquire process information about a substrate process, the process information including process data and a process condition, and a display control unit configured to control a display on a display apparatus based on the process information acquired by the acquisition unit, wherein the display control unit selectively displays, on the display apparatus, a first screen that displays the process data of a lot including a plurality of substrates on a lot-by-lot basis and a second screen that displays the process data of a first lot on a substrate-by-substrate basis, the first lot being a lot designated by a user from the lot displayed on the first screen.

Provided is an apparatus for exchanging an article of a semi-conductor process and a method for exchanging the article using the same. The apparatus for exchanging an article in a semiconductor process, comprising: a loading unit located at a finger coupled to a transferring means for loading the article'an operation controlling unit displaced at the loading unit and having a communicating means; and at least one vision unit.

A plurality of system control devices respectively include network interfaces for communicating with each other via a network. One of the plurality of system control devices functions as a master system control device, and the remaining system control devices function as slave system control devices. The master system control device transmits a control command to the slave system control devices by means of the network interface. The slave system control devices receive the control command by means of the network interfaces and supply an operation command to abatement devices in accordance with the control command. When unable to communicate with the master system control device, the slave system control devices either function as master system control devices or enter stand-alone operation mode.

A semiconductor process transport apparatus including a drive section with at least one motor, an articulated arm coupled to the drive section for driving articulation motion, a machine controller coupled to the drive section to control the at least one motor moving the articulated arm from one location to a different location, and an adapter pendant having a machine controller interface coupling the adapter pendant for input/output with the machine controller, the adapter pendant having another interface, configured for connecting a fungible smart mobile device having predetermined resident user operable device functionality characteristics, wherein the other interface has a connectivity configuration so mating of the fungible smart mobile device with the other interface automatically enables configuration of at least one of the resident user operable device functionality characteristics to define an input/output to the machine controller effecting input commands and output signals for motion control of the articulated arm.

A semiconductor manufacturing apparatus includes one or more process modules, a scheduler, and a transfer controller. A product wafer of a lot that is transferred from a load port to one of the one or more process modules is replenished such that a total number of wafers that are simultaneously processed in the one or more process modules becomes N. When an advance lot being processed and a post lot to be processed subsequent to the advance lot have a same processing condition, the scheduler creates the transfer plan to replenish with the product wafer of the post lot instead of a dummy wafer such that the transfer controller transfers the product wafer and the dummy wafer to the one or more process modules according to the created transfer plan.

A method includes identifying first parameters of a first processing chamber of a semiconductor fabrication facility. The first parameters include first input parameters and first output parameters. The method further includes identifying second parameters of a second processing chamber of the semiconductor fabrication facility. The second parameters include second input parameters and second output parameters. The method further includes generating, by a processing device based on the first parameters and the second parameters, composite parameters comprising composite input parameters and composite output parameters. Semiconductor fabrication is based on the composite parameters.

A system includes sensors, an interface and a controller. The interface receives feedback signals from the sensors. At least some of the sensors are disposed in an electrostatic chuck. The feedback signals are indicative respectively of fields of a heating plate of the electrostatic chuck. The controller, based on the fields and sets of calibration values, estimates values of a first field respectively for multiple points on a substrate. Each of the sets of calibration values corresponds respectively to one of multiple actuators. The calibration values, in each of the sets of calibration values, define amounts of contribution provided by a respective one of the actuators to the first field for the points. The controller changes physical states of the actuators based on the estimated values of the first field of the points to provide a predetermined temperature distribution profile across the electrostatic chuck.

An advanced process control system including a first process tool, a second process tool, and a measurement tool is provided. The first processing tool is configured to process each of a plurality of wafers by one of a plurality of first masks, and provide a first process timing data. The second processing tool is configured to process the wafer processing by the first process tool by one of a plurality of second masks to provide a plurality of works. The second process tool provides a measurement trigger signal according to the first process timing data. The measuring tool is configured to determine whether to perform a measuring operation on each works in response to the measurement trigger signal, and correspondingly provide a measurement result.

A semiconductor process transport apparatus including a drive section with at least one motor, an articulated arm coupled to the drive section for driving articulation motion, a machine controller coupled to the drive section to control the at least one motor moving the articulated arm from one location to a different location, and an adapter pendant having a machine controller interface coupling the adapter pendant for input/output with the machine controller, the adapter pendant having another interface, configured for connecting a fungible smart mobile device having predetermined resident user operable device functionality characteristics, wherein the other interface has a connectivity configuration so mating of the fungible smart mobile device with the other interface automatically enables configuration of at least one of the resident user operable device functionality characteristics to define an input/output to the machine controller effecting input commands and output signals for motion control of the articulated arm.