Methods for controlling the surface profiles of wafers sliced from an ingot with a wire saw include measuring an amount of displacement of a sidewall of a frame of the wire saw. The sidewall is connected to a bearing of a wire guide supporting a wire web in the wire saw. Based on the measured amount of displacement of the sidewall, a pressure profile for adjusting a position of the sidewall is determined by a computing device. Pressure is applied to the sidewall using a displacement device according to the determined pressure profile to control the position of the sidewall.

A system including a controller, an interface, and a calibration controller. The controller is configured to (i) select a set of fields, and (ii) based on the set of fields, supply control effort to first actuators in zones of a chamber. The interface is configured to receive feedback signals from sensors. The feedback signals are indicative of fields respectively of the zones. The controller is configured to adjust an amount of control effort supplied to the actuators based on the fields. The calibration controller is configured to, based on the fields, generate calibration values for each of the sensors. The calibration values for each of the sensors are indicative of field contributions corresponding respectively to the actuators.

There are provided a system, computer software product and method of generating a training set for a classifier using a processor. The method comprises: receiving a training set comprising training defects each having assigned attribute values, the training defects externally classified into classes comprising first and second major classes and a minor class; training a classifier upon the training set; receiving results of automatic classification of the training defects; automatically identifying a first defect that was externally classified into the first major class and automatically classified into the second major class; automatically identifying by the processor a second defect from the multiplicity of training defects that was externally classified into the minor class and automatically classified to the first or second major classes; and correcting the training set to include the first defect into the second major class, or to include the second defect into the first or the second major class.

Provided is a plasma processing apparatus including a processing unit in which a sample is plasma processed and which includes a monitor (optical emission spectroscopy) that monitors light emission of plasma, wherein the processing unit includes a prediction model storage unit that stores a prediction model predicting a plasma processing result, and a control device in which the plasma processing result is predicted by using a prediction model selected based on light emission data and device data as an indicator of state change of the processing unit.

Methods for controlling the surface profiles of wafers sliced from an ingot with a wire saw include measuring an amount of displacement of a sidewall of a frame of the wire saw. The sidewall is connected to a bearing of a wire guide supporting a wire web in the wire saw. The measured amount of displacement of the sidewall is stored as displacement data. Based on the stored data, a pressure profile for adjusting a position of the sidewall is determined by a computing device. Pressure is applied to the sidewall using a displacement device according to the determined pressure profile to control the position of the sidewall.

A processor-implemented method of an apparatus or system includes obtaining an expert classification criterion from a memory of the apparatus or system; converting manufacturing process data associated with a manufacturing process to a test sample in a form of an image; generating, using a machine learning model provided the test sample, a probability value that the test sample corresponds to a target class representing an anomaly occurring in the manufacturing process; adjusting the probability value by reflecting the expert classification criterion for the anomaly; and identifying, by classifying the anomaly based on the adjusted probability value, whether a final abnormality in the manufacturing process has occurred.

A plurality of system control devices respectively include network interfaces for communicating with each other via a network. One of the plurality of system control devices functions as a master system control device, and the remaining system control devices function as slave system control devices. The master system control device transmits a control command to the slave system control devices by means of the network interface. The slave system control devices receive the control command by means of the network interfaces and supply an operation command to abatement devices in accordance with the control command. When unable to communicate with the master system control device, the slave system control devices either function as master system control devices or enter stand-alone operation mode.

An information processing apparatus for controlling display on a user interface includes an acquisition unit, and a display control unit. The acquisition unit acquires information including an operated state indicating a state regarding an operation performed on each of a plurality of apparatuses, and an operating state indicating a state regarding an operating status of each of the plurality of apparatuses. The display control unit controls display of the information regarding an apparatus identified from among the plurality of apparatuses on the user interface, based on the information including the operated state and the operating state acquired by the acquisition unit.

An information processing apparatus includes an acquisition unit configured to acquire process information about a substrate process, the process information including process data and a process condition, and a display control unit configured to control a display on a display apparatus based on the process information acquired by the acquisition unit, wherein the display control unit selectively displays, on the display apparatus, a first screen that displays the process data of a lot including a plurality of substrates on a lot-by-lot basis and a second screen that displays the process data of a first lot on a substrate-by-substrate basis, the first lot being a lot designated by a user from the lot displayed on the first screen.

A wafer processing apparatus includes a controller connected to a first robot and a second robot. The controller controls the first robot so that the wafer is placed on a first load lock stage in such a way that the center of the wafer is shifted from the center of the first load lock stage by a first position shift amount and another wafer is placed on a second load lock stage in such a way that the center of the wafer is shifted from the center of the second load lock stage by a second position shift amount. The controller controls the second robot so that the second robot simultaneously conveys two wafers between the first and second load lock stages, and a first processing stage and a second processing stage.