A stocker may include a load port which a cassette for receiving wafers is either loaded on or unloaded from, an aligner configured to align the wafers and to confirm identification codes of the wafers, a plurality of shelves each having slots for receiving the wafers, a first transfer robot having a first robot arm for transferring the wafers between the load port and the aligner and a second transfer robot having a second robot arm for transferring the wafers between the aligner and the shelves.

A bagging station, comprises a base; a carousel that rotates relative to the base, the carousel including a plurality of bag holding elements; an indicator at each bag holding element that provides a status regarding a bag hanging from the bag holding element; and a bag selection system that controls the indicators to identify bags for allocating items according to a predetermined criteria about at least one of the bag or the items.

The invention concerns a workpiece carrier (4) for a production unit (1) with at least one conveying section (2). The workpiece carrier (4) comprises a workpiece carrier body (13), a workpiece receptacle (16) arranged on the workpiece carrier body (13), a guide device (14) which is arranged on the workpiece carrier body (13) by means of which the workpiece carrier (4) can be received and displaced in the production unit (1), in particular in the conveying section (2), and a code element (20) which is arranged on the workpiece carrier body (13) which is designed to identify the workpiece carrier (4) by means of a detection means (11) arranged in the production unit (1). For identification, the code element (20) has inhomogeneous material properties in its longitudinal orientation. During a relative movement of the code element (20) in the longitudinal orientation (23) relative to the detection means (11), the inhomogeneous material properties of the code element (20) can be detected by the detection means (11) and the workpiece carrier (4) can be identified.

A simultaneous post-treatment detection process of a plurality of objects treated and positioned on a treatment base is provided, wherein the objects at first are coupled to a device identified by an identification code, and wherein the process comprises the fact of decoupling each object from the device to prepare the object for the treatment; positioning, before treatment, each object on a treatment base; associating, by recording by means of an electronic computer on a digital storage medium, the code of each device to an allocation position on the treatment base of a respective object at first coupled thereto by one or more phases selected from a phase of indicating the allocation position implemented by means of a visual support adapted to allow a user to display the allocation position on the base, and a phase of recognizing an outline, defined by each object and previously acquired by an optical instrument and associated to a respective said code, of an object on the base to determine the relative allocation position; detecting to the user the position of the object on the base for each code whenever the user recalls a code recorded on the storage medium, and wherein the recall is performed by visual inspection by the user if the association on the digital storage medium is reproduced by the computer as a graphic mapping viewable by the user, and/or by scanning a code by means of a scanning instrument operatively connected to the computer.

A chip package assembly testing system and method for testing a chip package assembly are provided herein. In one example, the testing system includes a robot disposed in an enclosure and having a range of motion operable to transfer a chip package assembly between any of a first queuing station, a second queuing station and a plurality of test stations. The system also includes an automatic identification and data capture (AIDC) device operable to read an identification tag affixed to a carrier disposed in the first and second queuing stations, and a controller configured to control placement of chip package assemblies by the robot in response information obtained from a carrier disposed in at least one of the first and second queuing stations, the predefined test routine of the test processor of the first test station, and the predefined test routine of the test processor of the second test station.

Example embodiments may relate to methods and systems for selecting a grasp point on an object. In particular, a robotic manipulator may identify characteristics of a physical object within a physical environment. Based on the identified characteristics, the robotic manipulator may determine potential grasp points on the physical object corresponding to points at which a gripper attached to the robotic manipulator is operable to grip the physical object. Subsequently, the robotic manipulator may determine a motion path for the gripper to follow in order to move the physical object to a drop-off location for the physical object and then select a grasp point, from the potential grasp points, based on the determined motion path. After selecting the grasp point, the robotic manipulator may grip the physical object at the selected grasp point with the gripper and move the physical object through the determined motion path to the drop-off location.

The invention concerns a workpiece carrier (4) for a production unit (1) with at least one conveying section (2). The workpiece carrier (4) comprises a workpiece carrier body (13), a workpiece receptacle (16) arranged on the workpiece carrier body (13), a guide device (14) which is arranged on the workpiece carrier body (13) by means of which the workpiece carrier (4) can be received and displaced in the production unit (1), in particular in the conveying section (2), and a code element (20) which is arranged on the workpiece carrier body (13) which is designed to identify the workpiece carrier (4) by means of a detection means (11) arranged in the production unit (1). For identification, the code element (20) has inhomogeneous material properties in its longitudinal orientation. During a relative movement of the code element (20) in the longitudinal orientation (23) relative to the detection means (11), the inhomogeneous material properties of the code element (20) can be detected by the detection means (11) and the workpiece carrier (4) can be identified.

Example embodiments may relate to methods and systems for selecting a grasp point on an object. In particular, a robotic manipulator may identify characteristics of a physical object within a physical environment. Based on the identified characteristics, the robotic manipulator may determine potential grasp points on the physical object corresponding to points at which a gripper attached to the robotic manipulator is operable to grip the physical object. Subsequently, the robotic manipulator may determine a motion path for the gripper to follow in order to move the physical object to a drop-off location for the physical object and then select a grasp point, from the potential grasp points, based on the determined motion path. After selecting the grasp point, the robotic manipulator may grip the physical object at the selected grasp point with the gripper and move the physical object through the determined motion path to the drop-off location.

Example methods and systems for determining 3D scene geometry by projecting patterns of light onto a scene are provided. In an example method, a first projector may project a first random texture pattern having a first wavelength and a second projector may project a second random texture pattern having a second wavelength. A computing device may receive sensor data that is indicative of an environment as perceived from a first viewpoint of a first optical sensor and a second viewpoint of a second optical sensor. Based on the received sensor data, the computing device may determine corresponding features between sensor data associated with the first viewpoint and sensor data associated with the second viewpoint. And based on the determined corresponding features, the computing device may determine an output including a virtual representation of the environment that includes depth measurements indicative of distances to at least one object.

A chip package assembly testing system and method for testing a chip package assembly are provided herein. In one example, the testing system includes a robot disposed in an enclosure and having a range of motion operable to transfer a chip package assembly between any of a first queuing station, a second queuing station and a plurality of test stations. The system also includes an automatic identification and data capture (AIDC) device operable to read an identification tag affixed to a carrier disposed in the first and second queuing stations, and a controller configured to control placement of chip package assemblies by the robot in response information obtained from a carrier disposed in at least one of the first and second queuing stations, the predefined test routine of the test processor of the first test station, and the predefined test routine of the test processor of the second test station.