An electronic device manufacturing system capable of causing a first deposition operation of a plurality of deposition operations to be performed on a substrate according to a process recipe. Metrology data associated with a first set of layers formed by the first deposition operation is obtained and provided, as input, the metrology data to a trained machine learning model. An output value of the trained machine learning model is obtained. The output value is indicative at least one deposition time offset value for at least one layer of the plurality of layers. An updated process recipe is generated by applying the at least one deposition time offset value to the process recipe. A second deposition operation of the plurality of deposition operations is performed on the substrate according to the updated process recipe. The second deposition operation forms a second set of layers on the first set of layers.