A method for configuring a semiconductor manufacturing process, the method including: obtaining a first value of a first parameter based on measurements associated with a first operation of a process step in the semiconductor manufacturing process and a first sampling scheme; using a recurrent neural network to determine a predicted value of the first parameter based on the first value; and using the predicted value of the first parameter in configuring a subsequent operation of the process step in the semiconductor manufacturing process.

Robots and robotic systems and methods can employ artificial neural networks (ANNs) to significantly improve performance. The ANNs can operate alternatingly in forward and backward directions in interleaved fashion. The ANNs can employ visible units and hidden units. Various objective functions can be optimized. Robots and robotic systems and methods can execute applications including a plurality of agents in a distributed system, for instance with a number of hosts executing respective agents, at least some of the agents in communications with one another. The hosts can execute agents in response to occurrence of defined events or trigger expressions, and can operate with a maximum latency guarantee and/or data quality guarantee.

Aspects of the present disclosure provide systems, methods, and computer-readable storage media that support mechanisms for generating a feasible assembly plan for a product based on data analytics. In aspects, information on components of a product is obtained from one or more product models (e.g., a three-dimensional (3D) computer aided design (CAD) model) that define the individual components of the product. The individual component information may be used to represent the assembly of the product as an assembly graph, in which each node of the assembly graph represents one of the components of the product to be assembled. The assembly graph is passed through a set of data analytics modules to generate the feasible assembly plan, or assembly sequence, as a series of sequential contact predictions, wherein each contact prediction identifies a component to be connected to one or more other components of the product.

A method for configuring a semiconductor manufacturing process, the method including: obtaining a first value of a first parameter based on measurements associated with a first operation of a process step in the semiconductor manufacturing process and a first sampling scheme; using a recurrent neural network to determine a predicted value of the first parameter based on the first value; and using the predicted value of the first parameter in configuring a subsequent operation of the process step in the semiconductor manufacturing process.

A system and method for generating training sets for training neural networks. The method includes receiving a plurality of query pairs, wherein each of the plurality of query pairs includes a query and a real result previously determined for the query; determining at least one variable element of each query in the plurality of received query pairs; determining a variance for the at least determined variable element of each query in the plurality of received query pairs; and generating a training set based on the determined variable element, the determined variance, and the previously determined real result.

A method for configuring a semiconductor manufacturing process, the method including: obtaining a first value of a first parameter based on measurements associated with a first operation of a process step in the semiconductor manufacturing process and a first sampling scheme; using a recurrent neural network to determine a predicted value of the first parameter based on the first value; and using the predicted value of the first parameter in configuring a subsequent operation of the process step in the semiconductor manufacturing process.