Patent classifications
G05B2219/33034
Machine learning systems for monitoring of semiconductor processing
A method of operating a polishing system includes training a plurality of models using a machine learning algorithm to generate a plurality of trained models, each trained model configured to determine a characteristic value of a layer of a substrate based on a monitoring signal from an in-situ monitoring system of a semiconductor processing system, storing the plurality of trained models, receiving data indicating a characteristic of a substrate to be processed, selecting one of the plurality of trained models based on the data, and passing the selected trained model to the processing system.
LEARNING DEVICE, LEARNING METHOD, AND PROGRAM THEREFOR
This learning device provides a learned model to an adjuster containing a learned model learned to output a predetermined compensation amount to a controller, in a control system including the controller outputting a command value obtained by compensating a target value based on a compensation amount and a control object controlled to process an object to be processed. The learning device includes: an evaluation part obtaining operation data including the target value, command value and control variable and evaluates the quality of the control variable; a learning part generating candidate compensation amounts based on the operation data, and learning, as teacher data, the generated candidate compensation amount and the specific parameter of the object, and generating a learned model; and a setting part providing the learned model to the adjuster if the evaluated quality is within an allowable.
Machine learning devices and methods for optimizing the speed and accuracy of thread mill, inner diameter, outer shape, and surface machine tools
A machine learning device performs machine learning with respect to a numerical control device that operates a machine tool on the basis of a machining program. The machine learning device includes a state information acquisition unit configured to acquire state information including conditions of a spindle speed, a feed rate, a number of cuts, and a cutting amount per one time or a tool compensation amount, and a cycle time of cutting a workpiece, and machining accuracy of the workpiece; an action information output unit configured to output action information including modification information of the condition; a reward output unit configured to output a reward value in reinforcement learning on the basis of the cycle time and the machining accuracy; and a value function updating unit configured to update an action value function on the basis of a reward value, the state information, and the action information.
MACHINE LEARNING DEVICE, CONTROL SYSTEM, AND MACHINE LEARNING METHOD
A machine learning device includes a virtual temperature model calculating unit having an equation including a first coefficient for determining a heat generation amount and a second coefficient for determining a heat dissipation amount. The virtual temperature model calculating unit is configured to calculate virtual temperature data by estimating a temperature of a specific portion of a machine by the equation using heat generation factor data. A thermal displacement model calculating unit is configured to calculate, using the calculated virtual temperature data and actual temperature data acquired from at least one temperature sensor mounted to a portion other than the specific portion, an error between thermal displacement estimated by the equation and actually measured thermal displacement, in which the virtual temperature model calculating unit performs machine learning to search for the first coefficient and the second efficient so that the error is minimized.
Adjustment of a deviation of an axis position of driving unit of machine tool
An adjustment necessity determination device is an adjustment necessity determination device that makes a determination, after a workpiece is machined, about a necessity to make an adjustment of a deviation of the axis position of each axis of a machine tool that has performed the machining and includes: a data acquisition unit that acquires a physical quantity relating to a cause of a deviation of the axis position of each axis of the machine tool, the physical quantity observed at the time of the machining; a time-series data storage unit that stores the physical quantity as time-series data; and an adjustment necessity judgement unit that makes a judgment about a necessity to make an adjustment of a deviation of the axis position of each axis of the machine tool based on the time-series data.
Feature extraction and fault detection in a non-stationary process through unsupervised machine learning
An apparatus, method, and non-transitory machine-readable medium provide for improved feature extraction and fault detection in a non-stationary process through unsupervised machine learning. The apparatus includes a memory and a processor operably connected to the memory. The processor receives training data regarding a field device in an industrial process control and automation system; extracts a meaningful feature from the training data; performs an unsupervised classification to determine a health index for the meaningful feature; identifies a faulty condition of real-time data using the health index of the meaningful feature; and performs a rectifying operation in the industrial process control and automation system for correcting the faulty condition of the field device.
Adaptive chamber matching in advanced semiconductor process control
Systems and methods for controlling device performance variability during manufacturing of a device on wafers are disclosed. The system includes a process platform, on-board metrology (OBM) tools, and a first server that stores a machine-learning based process control model. The first server combines virtual metrology (VM) data and OBM data to predict a spatial distribution of one or more dimensions of interest on a wafer. The system further comprises an in-line metrology tool, such as SEM, to measure the one or more dimensions of interest on a subset of wafers sampled from each lot. A second server having a machine-learning engine receives from the first server the predicted spatial distribution of the one or more dimensions of interest based on VM and OBM, and also receives SEM metrology data, and updates the process control model periodically (e.g., to account for chamber-to-chamber variability) using machine learning techniques.
PREDICTION DEVICE
Provided is a prediction device, to which one or more wire electrical discharge machines are connected, the one or more wire electrical discharge machines each performing machining on an object to be machined according to a predetermined machining condition while moving a wire electrode relatively with respect to the object to be machined along a machining path, the prediction device including a prediction unit that predicts, for a predetermined component constituting the wire electrical discharge machine, a predicted rate of consumption indicative of a rate of consumption based on the machining condition when the wire electrode is moved relatively by a unit distance, and a display unit that displays the predicted rate of consumption of the component.
BACKUP CONTROL BASED CONTINUOUS TRAINING OF ROBOTS
Provided are systems and methods for training a robot. The method commences with collecting, by the robot, sensor data from a plurality of sensors of the robot. The sensor data may be related to a task being performed by the robot based on an artificial intelligence (AI) model. The method may further include determining, based on the sensor data and the AI model, that a probability of completing the task is below a threshold. The method may continue with sending a request for operator assistance to a remote computing device and receiving, in response to sending the request, teleoperation data from the remote computing device. The method may further include causing the robot to execute the task based on the teleoperation data. The method may continue with generating training data based on the sensor data and results of execution of the task for updating the AI model.
Machine learning device and machining time prediction device
A machine learning device acquires from a numerical controller information relating to machining when the machining is performed, and further acquires an actual delay time due to servo control and due to machine movement which are caused in the machining when the machining is performed. Then, the device performs supervised learning using the acquired machining-related information as input data, and using the acquired actual delay time due to servo control and due to machine movement as supervised data, and constructs a learning model, thereby predicting the machine delay time caused in a machine with high precision.