A data generating device includes a memory; and a controller. The memory is configured to store a plurality of sets of drawing information about an index pattern and a laser beam used for drawing the index pattern on a surface of a workpiece in association with respective ones of a plurality of sets of machining contents individually. The index pattern is represented by drawing data. Each of the plurality of machining contents indicates a machining process to be performed on the workpiece to measure deformation of the workpiece. The controller is configured to perform: receiving a generation instruction instructing to start generating the drawing data; designating one set of machining contents from the plurality of sets of machining contents; and generating the drawing data according to designated one set of machining contents and corresponding one of the plurality of sets of drawing information.

A laser diode system includes plurality of laser pumps, each of the plurality of laser pumps including a plurality of laser diode drivers and a plurality of laser diode elements, wherein each of the plurality of laser diode drivers is electrically coupled to power at least two of the plurality of laser diode elements. A combiner electrically is coupled to the plurality of laser diode elements to combine an output of each of the plurality of laser pumps to generate a combined output light. A controller identifies a failed laser pump or a failed laser diode element, receives an encoded key to gain access to the controller, and disables the failed laser pump or the failed laser diode element based at least in part on authenticating the encoded key.

A method for providing position control information for controlling an impingement position of a laser beam for treatment of a chip die in a chip manufacturing process, comprises the steps of a) receiving a specification of positions (x,y) of a electrically conductive elements in the chip die, the positions having a first coordinate along a first direction (x) and a second coordinate (y) along a second direction in a plane defined by the chip die, said first and second direction being mutually transverse to each other, b) selecting a cluster of positions that is within a predetermined two-dimensional spatial range, wherein each pair of positions in the cluster at least has a first minimum difference in their first coordinates or a second minimum difference in their second coordinates and removing the next position from the ordered set, c) update the positions of the set of positions in accordance with an expected time needed to carry out the treatment for said cluster and a speed of a wafer comprising the chip die, d) repeating steps b-d until each of the positions in said set is assigned to a cluster.

In one embodiment, a method of fabrication an implantable lead for providing electrical pulses to tissue of a patient, the method comprises: (i) providing a sheath of transparent insulative material, wherein the sheath comprises a plurality of lumens; (ii) scanning across the sheath with a confocal displacement meter to generate displacement data; (iii) processing the displacement data, in software executed on a computer system, to generate a representation of an exterior surface and lumens of the sheath; (iv) automatically selecting locations, in software executed on a computer system, on the exterior surface of application of laser pulses to create apertures in the sheath that provide access to respective lumens of the sheath; and (v) applying laser pulses according to the sheath to create the apertures.

An apparatus for supporting laser system operation based on central management of drawings using CAD, includes: a drawing control device configured to execute a CAD program, and using Visual Basic Application (VBA) on the CAD program, execute a program to extract drawing information and transmit the drawing information to a drawing information database through a network switch hub; a drawing information database configured to store the extracted drawing information transmitted from the drawing control device; a laser system control device configured to execute a laser control program and read processing history from the drawing information database to perform laser processing control; and a laser device configured to perform processing according to the drawing information using a laser system with the same name as each layer under control of the laser system control device.

Disclosed embodiments include a gantry assembly that has (i) a moveable carriage with a laser head affixed thereto and (ii) two sides (moveable subassemblies) that are connected by a joining subassembly. One side of the gantry has two motors: (i) a first motor (x-axis motor) that moves the carriage along a first axis (x-axis) between the two sides of the gantry, and (ii) a second motor (y-axis motor) that moves the gantry along a second axis (y-axis) perpendicular to the first axis. In some embodiments, the gantry assembly also includes a drive shaft (or alternative drive mechanism) operated by the second motor (y-axis motor) to facilitate movement of the two sides of the gantry together along the second axis (y-axis).