Patent classifications
G05B2219/34083
NUMERICAL CONTROLLER
To provide a numerical controller capable of performing synchronous control and superimposed control easily with respect to a machine having a complicated configuration. A numerical controller comprises: an elements relationship setting unit that sets a relationship between a first element and a second element; an elements relationship output calculation unit that calculates a relationship output from the relationship between the first element and the second element; and an elements relationship control unit that performs relationship control on the basis of the relationship output.
NUMERICAL CONTROLLER
A numerical controller analyzes a machining program, generates movement command data for moving a main spindle relative to a workpiece, causes an interpolation unit to perform interpolation processing based on the generated movement command data, and generates and outputs interpolation data for each interpolation cycle. Further, the interpolation unit performs provisional interpolation processing according to command speed F on a non-rotating coordinate system, converts a start point and an end point of provisional interpolation to positions on a rotating coordinate system to obtain speed F on the rotating coordinate system, obtains a ratio r of the speed F to the command speed F, and performs main interpolation processing at speed of F/r.
Numerical controller executing operation by a movement command and table-format data
A numerical controller drives motors for respective axes of a machine tool by using an NC program and table-format data that command positions of those axes with reference to a position of a reference axis. The numerical controller generates, based on a movement command commanded by the NC program, interpolation data for an axis to be controlled by the movement command, generates, based on the table-format data, interpolation data for an axis to be controlled by the table-format data, and further generates interpolation data obtained by selection from or superposition of these two pieces of interpolation data.
MACHINE PROGRAMMING METHOD
A method for programming a multi-segment motion plan for a machine tool which uses program points defined directly on a workpiece surface, and computes a time-optimal trajectory which transitions from air cut to cutting without stopping, while arriving at a cutting start waypoint traveling at a specified cutting feed speed. The programming method also combines what are traditionally separate air cut and cutting commands into a single command, and computes the time-optimal trajectory for all segments. The underlying time-optimal trajectory computation calculates an initial motion profile for each segment based on the waypoint geometry and other constraints, and motion states at the waypoints which join the segments are optimized to provide the shortest total trajectory time. The optimized waypoint states include velocities and accelerations with non-zero values.
NUMERICAL CONTROL DEVICE
The present invention realizes deceleration without deviation with respect to a corner speed while maintaining behavior during deceleration at a constant level. This numerical control device comprises: a remaining movement amount calculation unit for calculating a remaining movement amount of a block in a machining program; an excess movement amount calculation unit for calculating, as an excess movement amount, a difference between the remaining movement amount of the block and a movement amount required for deceleration from a present command speed to a corner speed at a designated acceleration; an adjustment amount calculation unit for calculating an acceleration adjustment amount, at the start of the deceleration, for using the entirety of the excess movement amount at interpolation times, on the basis of the excess movement amount, the present command speed, the corner speed, and the designated acceleration; an acceleration calculation unit for calculating a first acceleration obtained by adjusting the acceleration designated at the start of the deceleration using the acceleration adjustment amount and a second acceleration for deceleration to the corner speed at the remaining interpolation times; and a pre-interpolation acceleration/deceleration processing unit for designating the first acceleration at the start of the deceleration and designating the second acceleration at the remaining interpolation times.
NUMERICAL CONTROL DEVICE, MACHINE TOOL, NUMERICAL CONTROL METHOD, AND NON-TRANSITORY COMPUTER READABLE MEDIUM
Provided are a numerical control device, a machine tool, a numerical control method, and non-transitory computer readable medium contributing in achieving that an increase in moving time of a moving part is suppressed while suppressing the amount of computation for calculating a speed curve prior to acceleration/deceleration processing. A CPU reads the current block (Nnow) and a prefetch block and determines a target block (Nd) and a target speed (Vd) at a command point for the target block (Nd). The CPU calculates a first rising speed (V1) at the position where tip acceleration becomes zero from the current tip acceleration. The CPU calculates a reverse interpolation point (Prev). Every time when the reverse interpolation point (Prev) is calculated, the CPU calculates a second rising speed (V2) at the position where the tip acceleration becomes zero from the tip acceleration at the reverse interpolation point (Prev).
SEMICONDUCTOR DEVICE MANUFACTURING EQUIPMENT
The present disclosure relates to semiconductor-device manufacturing equipment. An example semiconductor-device manufacturing equipment incudes a stage that supports a substrate, a head module disposed on top of the stage and including a first bonding head and a second bonding head spaced apart from each other, wherein the head module is configured to bond a die onto the substrate, and a controller configured to control the head module. The head module is configured to move to a first position in a state in which the first bonding head and the second bonding head have respectively picked up a first die and a second die. At the first position, the first bonding head is configured to descend and bond the first die onto a first non-defective chip of the substrate, and the second bonding head is configured to descend and bond the second die onto a second non-defective chip of the substrate.