Included are: a processing container in which a support capable of supporting at least one substrate is loaded, and in which the substrate is processed; a transfer chamber including a plurality of the supports and capable of switching the supports and transferring the supports to the processing container; a gas supplier that supplies a processing gas for depositing a film and a cleaning gas for removing the deposited film into the processing container; and a controller including a determinator that determines whether a film adhering to the support by the processing of the substrate has reached a cleaning start condition, and capable of controlling a notification indicating that cleaning processing of the support can be performed when the support has reached the cleaning start condition from a determination result of the determinator.

Examples relate to changing a processing job carried out on a processing machine including a processing unit configured as an application unit, and a processing unit configured as a shaping unit. A first processing job is completed by the processing machine, during which a substrate is processed by the processing units. The first processing job is automatically terminated and a modification is automatically started for adapting at least one unit of the processing machine to a configuration of a directly succeeding processing job. Prior to the modification, the configuration for the directly succeeding processing job is provided to a machine control system. During the modification, at least one modification process of the shaping unit is performed to temporally overlap with at least one further modification process of the processing machine. The directly succeeding processing job is started, during which at least one substrate is processed by the processing units.