An element which limits throughput of a plating apparatus is identified. A method for identifying an element which limits throughput of a plating apparatus is provided. The method comprises: a step for creating a time chart which represents process schedules of plural processing units and one or plural transfer apparatuses; a step for calculating, based on the time chart, at least one of an operation rate and a degree of freedom of taking-out with respect to each of elements comprising the plural processing units and the one or plural transfer apparatuses, wherein the degree of freedom of taking-out represents a degree of freedom with respect to timing when the substrate which has been processed can be taken out of one of the processing units; and a step for displaying, with respect to each of the elements comprising the plural processing units and the one or plural transfer apparatuses, at least one of the calculated operation rate and the calculated degree of freedom of taking-out.