A bore metrology method includes aligning a first structure, which defines an initial bore, with a second structure, which defines a pilot bore, such that the initial bore is partially obstructed by the second structure and the pilot bore is superimposed with the initial bore. The initial bore includes a bore locating target assembly within the initial bore, the bore locating target assembly having an optical target, the optical target having a reflector and an optical absorbing feature, the optical absorbing feature defining a pattern on the optical target. At least a portion of the reflector and at least a portion of the pattern are visible through the pilot bore. The method further includes imaging the portion of the reflector and the portion of the pattern that are visible through the pilot bore. The method further includes determining a centerline of the initial bore based on the imaging.

A method for finding a center of a process kit and/or a process kit ring is provided. An object placed on an end effector is moved past a sensor of a manufacturing system. A first signal indicating a current shape of object is received from the sensor of the manufacturing system. A determination is made whether the first signal corresponds to a second signal indicating a predefined shape for a process kit and/or a process kit carrier. In response to a determination that the first signal corresponds to the second signal, a coordinate correspondence is determined between coordinates of a center of the object and coordinates of a center of the end effector. The determined coordinate correspondence indicates whether a current placement of the object on the end effector satisfies a target placement criterion.

A die layout calculation method is provided. The method includes: selecting, based on a distribution array of a plurality of dies in a wafer, one die as a reference die; making first movements of a wafer center to determine a first coverage region for each first movement, and determining a feasible region based on a number of complete dies in each first coverage region; making a plurality of second movements of the wafer center in the feasible region to determine a second coverage region for each second movement, and determining a relative position of the wafer center in the reference die corresponding to a maximum number of complete dies in the second coverage region; and determining a die layout comprising a location of each die in the wafer. This method improves the accuracy and efficiency of determining the maximum number of dies.

A target provided to a substrate placement portion is detected by an object detection sensor at a plurality of rotation positions of the substrate placement portion. An index length which is a distance from a robot reference axis to the target in a direction perpendicular to an axial direction, or information correlated therewith, is calculated. At least one of a rotation position of a detection line about the robot reference axis and a rotation position of the substrate placement portion about a rotation axis when the target located on a line connecting the robot reference axis and the rotation axis is detected is calculated on the basis of the calculated index length or the calculated information correlated therewith. A direction in which the rotation axis is present as seen from the robot reference axis is specified on the basis of the calculated rotation position.

Embodiments described herein generally relate to an apparatus and method of performing a robot calibration process within a substrate processing system. In one embodiment, a calibration device is used to calibrate a robot having an end effector. The calibration device includes a body, a first side and a second side opposite to the first side. The calibration device further includes a sensor disposed on the second side of the body. In some embodiments, the sensor covers the entire second side of the body. In this configuration, because the sensor covers the entire second side of the body of the calibration device, the calibration device can be utilized to sense the contact between the sensor and various differently configured chamber components found in different types of processing chambers or stations disposed within a processing system during a calibration process performed in each of the different processing chambers or stations.

One or more first signals are obtained. The first signals indicate a current shape of an object placed on an end effector. The one or more first signals are compared to one or more second signals that each indicate a predefined shape for a process component on the end effector. A determination is made of whether a current placement of the object on the end effector satisfies a target placement criterion based on the comparison.

A drilling method is provided allowing drilling in confined spaces with less effort. Two independent data sources are used for reducing tolerances between the component to be joined to the workpiece. The component is measured at the supplier using photogrammetry or laser scanning. First geometric data of the component obtained by this measurement are put in a data storage, such as a barcode tag or database. At the manufacturer, the first geometric data are used to position the component relative to the workpiece. Subsequently, the component is measured to obtain second geometric data indicative of the positions and diameters of the component joining holes. After determining a deviation between the first and second geometric data to be smaller than a predetermined threshold, the automatic drill is positioned at the correct drilling location and joining holes are drilled into the workpiece. Finally, the component and the workpiece are joined by fasteners.

The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a plurality of treating chambers performing a respective treatment on a substrate therein; a transfer chamber having a robot transferring the substrate between the plurality of treating chambers; a detection unit mounted on the robot and configured to detect a substrate state; and a controller for controlling the detection unit, wherein the detection unit comprises: an imaging member for imaging the substrate; and a driving member for moving the imaging member, and wherein the controller controls the detection unit to image and store an image of the substrate at an optimal position and determines whether an image of the substrate is a normal state based on the image obtained in the optimal position, the optimal position determined based on a process variable of the treating chamber.

A system for locating the position of a component includes, an image capture device, the image capture device being configured to capture an image of a component, a working implement mounted in fixed relation to the image capture device, a positioning system configured to adjust a position of the image capture device and the working implement in relation to the component, and an image processing module in communication with the image capture device, the imaging processing module being configured to receive the image from the image capture device and to identify at least one feature of the component. The positioning system is configured to adjust the position of the image capture device based on a location of the identified feature within the image to align the image capture device with the identified feature, and to align the working implement with the identified feature based upon an offset between the image capture device and the working implement.

A method of machining a cellular core (14) includes mounting the core (14) atop a table (12) in a multi-axis Computerized Numerical Controlled (CNC) machine (10). The machine (10) is operated to self-scan the core (14) and self-recognize individual cells (30) arranged laterally in columns and longitudinally in rows. A machining path (E) is self-generated from the pre-recognized cells (30), and the core (14) is then machined along the self-generated machining path (E).