A system and method are provided for generating minimal cut-sets for highly integrated large systems. The method includes receiving a system model (102) and a scenario (104), and obtaining a dependency array (300) from the system model (102) according to the scenario, with the dependency array (300) including at least one case (302). The method includes selecting a case (302) in the dependency array (300). The method includes querying a cut-set repository (110) to determine if a cut-set for a component (200) in the case (302) is already stored, and retrieving said cut-set; and if a cut-set is not stored, generating the minimal cut-set for the component (200). And the method includes computing a final cut-set list (112) by expanding the dependency array (300) using the cut-set for the component (200). The method improves the efficiency of cut-set generation applied to manufactured systems with great number of components.

A data analysis method and apparatus, an electronic device, and a storage medium are provided, which are applicable to the semiconductor display manufacturing field and the artificial intelligence technology field. The data analysis method is applicable to a data analysis platform including at least one data analysis model. The method includes: acquiring a target task for a target product; analyzing target data corresponding to the target task using the at least one data analysis model, and determining a target analysis model from the at least one data analysis model; and in response to a first user completing a parameter adjustment operation on the target analysis model based on the target data, analyzing the target data using the adjusted target analysis model to obtain a target analysis result corresponding to the target task.