The invention discloses a panel sorting device. The panel sorting device comprises a placement rack, an alignment device, and a classification robotic arm. The placement rack has multiple layers. Each layer of the placement rack places at least one panel according to the sequence with specification at corresponding position. The alignment device is used to obtain the positional deviation of the panel moved on a production line. Wherein, the classification robotic arm corrects the panel position based on the information of the positional deviation acquired by the alignment device, and places the panel in accordance with its sequence and specification to the corresponding position in the layer of the placement rack. To implement the panel sorting device of this present invention can quickly grab the panel and automatically sort according to the product's specifications. As a result, improve the efficiency of automated handling and production yield, and reduce costs and save installation space.

A second control device of a second substrate processing apparatus creates a virtual carrier, thereby storing a piece of positional information of a substrate to be carried into the second substrate processing apparatus through a direct carry-in entrance before the substrate is carried into the second substrate processing apparatus. The second control device creates a second schedule to convey a substrate carried into the second substrate processing apparatus through the direct carry-in entrance from the outside of the second substrate processing apparatus to the inside of the second substrate processing apparatus, based on the prestored positional information of the substrate outside the second substrate processing apparatus, before the substrate is carried into the second substrate processing apparatus.

A method, apparatus, and system for manufacturing a composite part. A set of reference locations is identified for a set of fiducial markers on a composite ply from a ply shape model for the composite part. The set of fiducial markers is created at the set of reference locations on the composite ply. The composite ply is cut to have a shape defined by the ply shape model.

A method of aging a substrate-processing apparatus according to the inventive concepts may include receiving advance information of a scheduled substrate-receiving container to be loaded on a load port of the substrate-processing apparatus from a host computer, and loading a test substrate into a process chamber to perform an inspection process by means of the advance information.

Disclosed is a substrate processing system that performs a film deposition on plural substrates in a processing container using a film deposition condition calculated based on a characteristic of a film deposited on at least one of the substrates. The substrate processing system includes: a storage unit storing surface state information and arrangement state information that represent influences of a surface state of the one substrate and an arrangement state of the plural substrates on the characteristic of the film deposited on the one substrate, respectively; a calculation unit calculating information that represents an influence of the plural substrates on the characteristic of the film on the one substrate based on the surface state information and the arrangement state information stored in the storage unit; and a correction unit correcting the characteristic of the film deposited on the one substrate based on the information calculated by the calculation unit.

A substrate assembling device includes a first end effector attached to a first arm, a second end effector attached to a second arm, and a controller. The second end effector includes a pair of grippers configured to grip a second substrate, and a placing part where threaded elements are placed. The controller is adapted to control operations of the first arm and the second arm to position the second substrate on a first substrate while gripping the second substrate, by using the pair of grippers of the second end effector, and hold the threaded element placed on the placing part of the second end effector and fasten the held threaded element, by using the first end effector, to join the first substrate and the second substrate together.

A method forms a multi-ply laminate. A first cutting system cuts and moves a first group of courses into staging positions. Placement robots pick up and place the first group of courses from the staging positions to a layup surface to form a first ply of the multi-ply laminate, changing an orientation of fibers from an initial orientation to a desired orientation for the first ply. A second cutting system cuts and moves a second group of courses into the staging positions while the placement robots are picking up and placing the first group of courses. The placement robots pick up and place the second group of courses from the staging positions to the layup surface to form a second ply of the multi-ply laminate after the first ply has been formed, changing the orientation of the fibers from the initial orientation to the desired orientation for the second ply.

Implementations of the present disclosure generally relate to an improved factory interface that is coupled to an on-board metrology housing configured for measuring film properties of a substrate. In one implementation, an apparatus comprises a factory interface, and a metrology housing removably coupled to the factory interface through a load port, the metrology housing comprises an on-board metrology assembly for measuring properties of a substrate to be transferred into the metrology housing.

Methods and systems for laser etching substrates to fine tune antennas for wireless communication are provided. A method includes laser etching an antenna element design into a substrate material. The antenna element design is for receiving conductive material to form an antenna structure. The method also includes laser etching a first area of the substrate material to change an intrinsic property of the substrate material in order to control an electrical characteristic of the antenna structure.

The present disclosure generally relates to determining a process condition in a semiconductor process using attribute-relative process conditions. An example is a method of forming an integrated circuit (IC). First and second historical process conditions are obtained. The first historical process conditions are of previous semiconductor processing corresponding to a target value of a process attribute for forming the IC, and the second historical process conditions are of previous semiconductor processing corresponding to variable values of the process attribute. Attribute-relative process conditions are calculated. Each attribute-relative process condition is based on the first historical process conditions and the second historical process conditions that correspond to a respective given value of the variable values. An average process condition is determined from a subset of the attribute-relative process conditions. A process condition of a subsequent semiconductor process is set based on the average process condition.